EP2017373A3 - Procédé grande vitesse pour le placage de palladium et d'alliages de palladium - Google Patents

Procédé grande vitesse pour le placage de palladium et d'alliages de palladium Download PDF

Info

Publication number: EP2017373A3
Authority: EP; European Patent Office
Prior art keywords: palladium; high speed; speed method; alloys; plating
Prior art date: 2007-07-20
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP08160839.0A

Other languages

German (de)

English (en)

Other versions

EP2017373B1 (fr

EP2017373A2 (fr

Inventor

Wan Zhang-Beglinger

Margit Clauss

Felix J Schwager

Jonas Guebey

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

DuPont Electronic Materials International LLC

Original Assignee

Rohm and Haas Electronic Materials LLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-07-20

Filing date

2008-07-21

Publication date

2013-09-11

2008-07-21 Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC

2009-01-21 Publication of EP2017373A2 publication Critical patent/EP2017373A2/fr

2013-09-11 Publication of EP2017373A3 publication Critical patent/EP2017373A3/fr

2018-09-26 Application granted granted Critical

2018-09-26 Publication of EP2017373B1 publication Critical patent/EP2017373B1/fr

Status Active legal-status Critical Current

2028-07-21 Anticipated expiration legal-status Critical

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Electroplating And Plating Baths Therefor (AREA)
Chemically Coating (AREA)

EP08160839.0A 2007-07-20 2008-07-21 Procédé grande vitesse pour le placage d'alliages de palladium Active EP2017373B1 (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US96139307P	2007-07-20	2007-07-20

Publications (3)

Publication Number	Publication Date
EP2017373A2 EP2017373A2 (fr)	2009-01-21
EP2017373A3 true EP2017373A3 (fr)	2013-09-11
EP2017373B1 EP2017373B1 (fr)	2018-09-26

Family

ID=39942904

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP08160839.0A Active EP2017373B1 (fr)	2007-07-20	2008-07-21	Procédé grande vitesse pour le placage d'alliages de palladium

Country Status (4)

Country	Link
US (1)	US20090038950A1 (fr)
EP (1)	EP2017373B1 (fr)
CN (1)	CN101348928B (fr)
TW (1)	TWI391533B (fr)

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CN102449742B (zh) *	2009-05-27	2015-12-09	诺发系统有限公司	用于在薄籽晶层上进行电镀的脉冲序列
DE102010011269B4 (de) *	2009-11-10	2014-02-13	Ami Doduco Gmbh	Verfahren zum Abscheiden einer für das Drahtbonden geeigneten Palladiumschicht auf Leiterbahnen einer Schaltungsträgerplatte und Verwendung eines Palladiumbades in dem Verfahren
CN101838830B (zh) *	2010-05-07	2012-08-15	厦门大学	一种电镀钯镍合金的电解液
US9385035B2 (en)	2010-05-24	2016-07-05	Novellus Systems, Inc.	Current ramping and current pulsing entry of substrates for electroplating
CN105401182B (zh) *	2015-10-14	2017-06-23	佛山科学技术学院	一种在不锈钢上电镀厚钯的镀液配方及其电镀方法
CN105543913A (zh) *	2016-02-25	2016-05-04	盈昌集团有限公司	钯钴合金电镀液及用其电镀眼镜框架的工艺
CN115069093B (zh)	2016-06-06	2024-09-20	联邦科学和工业研究组织	在基材上形成Pd-Au合金层的方法
KR102544423B1 (ko) *	2019-10-30	2023-06-15	후루카와 덴키 고교 가부시키가이샤	접동 접점용 금속 재료 및 그 제조 방법과 모터용 브러시재 및 진동 모터
KR20220124787A (ko)	2020-01-10	2022-09-14	램 리써치 코포레이션	긴 펄싱 및 램핑에 의한 tsv 프로세스 윈도우 및 충진 성능 향상
GB202020071D0 (en)	2020-12-18	2021-02-03	Johnson Matthey Plc	Electroplating solutions
CN116657207B (zh)	2023-06-25	2024-04-26	上海万生合金材料有限公司	一种铜镀钯金键合线及其电镀工艺

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JPH0711475A (ja) *	1993-06-23	1995-01-13	Kojima Kagaku Yakuhin Kk	パラジウムめっき液
US6251249B1 (en) *	1996-09-20	2001-06-26	Atofina Chemicals, Inc.	Precious metal deposition composition and process

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US3925170A (en) *	1974-01-23	1975-12-09	American Chem & Refining Co	Method and composition for producing bright palladium electrodepositions
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GB1495910A (en) *	1975-10-30	1977-12-21	Ibm	Method and bath for electroplating palladium on an articl
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US4100039A (en) *	1976-11-11	1978-07-11	International Business Machines Corporation	Method for plating palladium-nickel alloy
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US4911799A (en) *	1989-08-29	1990-03-27	At&T Bell Laboratories	Electrodeposition of palladium films
JPH05271980A (ja) *	1992-03-30	1993-10-19	Yazaki Corp	パラジウム−ニッケル合金メッキ液
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TW340139B (en) *	1995-09-16	1998-09-11	Moon Sung-Soo	Process for plating palladium or palladium alloy onto iron-nickel alloy substrate
US5976344A (en) *	1996-05-10	1999-11-02	Lucent Technologies Inc.	Composition for electroplating palladium alloys and electroplating process using that composition
US7566390B2 (en)	2004-12-15	2009-07-28	Lam Research Corporation	Wafer support apparatus for electroplating process and method for using the same

2008
- 2008-03-17 CN CN2008100868593A patent/CN101348928B/zh active Active
- 2008-07-14 TW TW097126599A patent/TWI391533B/zh not_active IP Right Cessation
- 2008-07-21 EP EP08160839.0A patent/EP2017373B1/fr active Active
- 2008-07-21 US US12/220,037 patent/US20090038950A1/en not_active Abandoned

Patent Citations (3)

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Publication number	Priority date	Publication date	Assignee	Title
US4673472A (en) *	1986-02-28	1987-06-16	Technic Inc.	Method and electroplating solution for deposition of palladium or alloys thereof
JPH0711475A (ja) *	1993-06-23	1995-01-13	Kojima Kagaku Yakuhin Kk	パラジウムめっき液
US6251249B1 (en) *	1996-09-20	2001-06-26	Atofina Chemicals, Inc.	Precious metal deposition composition and process

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
WALZ ET AL: "DIE GALVANISCHE ABSCHEIDUNG VON PALLADIUM-NICKEL-LEGIERUNGEN AUS DEM AMMONIAKALISCHEN CHLORIDELEKTROLYTEN", MO METALLOBERFLACHE, IGT INFORMATIONSGESELLSCHAFT TECHNIK, MUNCHEN, DE, vol. 40, no. 3, 1 March 1986 (1986-03-01), pages 112 - 118, XP008163844, ISSN: 0026-0797 *

Also Published As

Publication number	Publication date
CN101348928A (zh)	2009-01-21
TWI391533B (zh)	2013-04-01
EP2017373B1 (fr)	2018-09-26
CN101348928B (zh)	2012-07-04
TW200923140A (en)	2009-06-01
EP2017373A2 (fr)	2009-01-21
US20090038950A1 (en)	2009-02-12

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