EP2041805A1 - Emballage de dispositif d'eclairage - Google Patents

Emballage de dispositif d'eclairage

Info

Publication number
EP2041805A1
EP2041805A1 EP07763859A EP07763859A EP2041805A1 EP 2041805 A1 EP2041805 A1 EP 2041805A1 EP 07763859 A EP07763859 A EP 07763859A EP 07763859 A EP07763859 A EP 07763859A EP 2041805 A1 EP2041805 A1 EP 2041805A1
Authority
EP
European Patent Office
Prior art keywords
light
index
refraction
lighting device
device package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07763859A
Other languages
German (de)
English (en)
Inventor
Ian Ashdown
Shane Harrah
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
TIR Technology LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TIR Technology LP filed Critical TIR Technology LP
Publication of EP2041805A1 publication Critical patent/EP2041805A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Definitions

  • the invention pertains to light-emitting devices and in particular to the design of optical components of lighting device packages.
  • LEDs Light-emitting diodes
  • a number of design features can influence the optical paths such as the orientation and the position of optical interfaces and the optical properties of the relevant components of the LED package such as the type of material on either side of an optical interface, for example.
  • the propagation of light inside the LED package can also depend on its wavelength, its intensity, the size and luminous efficacy of the LED dice, the drive current, the opacity of the optical elements of the LED package, the temperature conditions inside the LED package, the refractive indices of the ambient medium and the material of the LED package components as well as the temperature dependence of the refractive indices of the relevant materials, for example.
  • State of the art LED packages have at least a LED die and an encapsulant lens. In some LED packages the lens and the encapsulant are separate or made of different materials. Consequently, an LED package can have a die-encapsulant optical interface, an encapsulant-lens optical interface and a lens-air optical interface.
  • optical interfaces can reflect and transmit variable portions of light depending on the wavelength of the light, the incidence angle at an optical interface and the refractive indices of the two media on either side of an optical interface. Partial reflection and transmission at an optical interface of an LED package can cause a cascade of repeatedly reflected and transmitted rays. As a result, certain reflections may elongate the optical path which can increase the likelihood for undesired light absorption inside the LED package. Moreover, light can undergo total internal reflection (TIR) which can occur at certain incidence angles depending on the refractive index ratio.
  • TIR total internal reflection
  • the index of refraction of, for example, the LED dice can vary significantly. Most dice that are used today have refractive indices in the visible spectrum of higher than approximately 1.6. In addition, for example some blue and green LED dice have a refractive index of approximately 2.6 to 2.7. For example, if the ambient medium is air, which has a refractive index of approximately 1.0 and if the die refractive index is 1.6, the largest critical angle for TIR would be approximately 39 degrees to the optical interface normal. However, for other wavelengths the critical angle may be considerably smaller. Any light which hits the optical interface at larger angles will be totally internally reflected.
  • United States Patents No. 6,590,235 and 6,204,523 provide an LED component, with light emission in the green-to-near UV wavelength range.
  • the light- emitting semiconductor die is encapsulated with one or more silicone compounds, including a hard outer shell, an interior gel or resilient layer, or both.
  • the silicone material is stable over temperature and humidity ranges, and over exposure to ambient UV radiation.
  • the LED component has an advantageously long lifetime, in which it is free of "yellowing" attenuation which would reduce the green-to- near UV light output.
  • United States Patent No. 6,639,360 provides a high power radiation emitter device and heat dissipating package for electronic components.
  • the electronic component package includes a sealed chamber; a liquid or gel contained in the sealed chamber; at least one electronic component disposed in the sealed chamber in physical and thermal contact with the liquid or gel; and at least one electrical conductor electrically coupled to the electronic component and extending out of said sealed chamber.
  • the electronic component(s) may include any one or combination of a radiation emitter, a thermal or optical sensor, a resistor, and a microprocessor or other semiconductor component.
  • United States Patent No. 6,867,929 describes a light source device that is safe for human eyes and whose switching is performed at high speed.
  • the light source device comprises one or more laser light sources for emitting a monochromatic or polychromatic light beam, a diffuser, which may be transmissive, reflective, or a mixture thereof, for diffusing the light beam received directly from the laser light source or via an optical focusing system, and an optical collimator, which collimates the diffused light bundle emitted from the diffuser.
  • United States Patent No. 7,015,516 describes a light-emitting microelectronic package that includes a light-emitting diode having a first region of a first conductivity type, a second region of a second conductivity type, and a light-emitting p-n junction between the first and second regions.
  • the light-emitting diode defines a lower contact surface and a mesa projecting upwardly from the lower contact surface.
  • the first region of a first conductivity type is disposed in the mesa and defines a top surface of the mesa
  • the second region of a second conductivity type defines the lower contact surface that substantially surrounds the mesa.
  • the mesa includes at least one sidewall extending between the top surface of the mesa and the lower contact surface, the at least one sidewall having a roughened surface for optimizing light extraction from the package.
  • United States Patent No. 7,023,022 describes a light-emitting package that includes a substantially transparent substrate having a first surface and a second surface including a lens.
  • the package also includes a light-emitting diode (LED) adapted to emit light having a predetermined wavelength, the LED being secured over the first surface of the substantially transparent substrate.
  • the second surface of the substrate defines a principal light emitting surface of the package.
  • the lens at the second surface has a grating pattern that matches the predetermined wavelength of the light emitted from the
  • the LED for controlling the emission geometry of the light emitted by the package.
  • the grating pattern has a radial configuration including a series of circles that are concentric.
  • United States Patent No. 6,921,929 describes a light-emitting diode (LED) with amorphous fluoropolymer encapsulant and lens.
  • the lens and encapsulant are made of an amorphous fluoropolymer for a LED or diode laser, such as an ultraviolet LED.
  • a semiconductor diode die is formed by growing a diode on a substrate layer such as sapphire. The diode die is flipped so that it emits light through the face of the layer.
  • An amorphous fluoropolymer encapsulant encapsulates the emitting face of the diode die, and may be shaped as a lens to form an integral encapsulant/lens.
  • a lens of amorphous fluoropolymer may be joined to the encapsulant. Additional joined or separate lenses may also be used.
  • the encapsulant/lens is transmissive to UV light as well as infrared light. Encapsulating methods are also provided.
  • United States Patent No. 7,026,657 describes a high radiance LED chip and a method for producing same.
  • a light-emitting diode chip comprises a radiation-emitting active region and a window layer. To increase the luminous efficiency, the cross- sectional area of the radiation-emitting active region is smaller than the cross-sectional area of the window layer available for the decoupling of light.
  • the invention is further directed to a method for fabricating a lens structure on the surface of a light-emitting component.
  • United States Patent No. 6,903,380 describes a method and system for an LED package.
  • the LED package may comprise a leadframe having an annular contact and a base contact.
  • An LED die may be coupled to the annular and base contacts such that the P-type material portion is electrically connected to an annular contact and the N-type material portion is electrically connected to a base contact.
  • the N-type material portion may be electrically connected to the annular contact and the P-type material portion may be electrically connected to the base contact.
  • a lens may be coupled to the leadframe, and an optical material may be located in a cavity defined by the lens, the base contact, and the annular contact.
  • the optical material may be a gel, grease, a resilient material, a non-resilient material, a rigid material, a liquid material or a non-liquid material.
  • the method and system may further comprise a mounting device, wherein the LED package is mechanically coupled to the mounting device in a socket, bayonet, or threaded fashion.
  • the method and system may further comprise a strip comprising an array of annular contacts utilized to form an array of the LED packages and a carrier strip comprising receiving devices to receive the array of LED packages.
  • a portion of the lens may either be coated with or comprise light excitable material or the optical material may comprise light excitable material, such that the system emits white light.
  • United States Patent No. 6,480,389 describes a light emitting diode (LED) that includes a heat dissipation structure characterized by having a heat dissipating fluidic coolant filled in a hermetically sealed housing where at least one LED chip mounted on a metallic substrate is dwelled inside.
  • the heat dissipation structure is configured with a metallic wall erected from the metallic substrate, which is used to hold a transparent cap of the sealed housing in correct position.
  • the erected wall surrounds in proximity with the at least one LED chip, so that the joule heat generated therefrom can be quickly spread out, through the heat dissipating fluidic coolant, to the erected wall, and then diffused along the wall down to the metallic substrate which adjoins with a larger external heat sink for draining the heat, thus preventing the at least one LED from overheating.
  • the other characteristic of the invention resides in that the transparent cap of the sealed housing is made of transparent materials, wherein a convex portion contacted with the heat dissipating fluidic coolant is formed on the inner surface of the transparent cap.
  • United States Patent No. 5,077,587 describes a light-emitting diode with anti- reflection layer optimization. Improved light output from LEDs or the like are obtained by modifying the combined thickness dimensions of a transmissive diffusion mask layer and anti-reflection coating layer at the periphery of the window forming the light- emitting region.
  • the lens when an obtuse angle formed between a main axis of the lens and a tangent line of a point of the curved centermost surface is Al, and an acute angle formed between a straight line linking the center of the base to the point of the curved centermost surface and the main axis of the lens is A2, the lens satisfies the equation: Al + A2 ⁇ 90 + l/sin(l/n).
  • United States Patent Publication No. 2005/0221519 describes semiconductor light emitting devices including a luminescent conversion element and methods for packaging the same.
  • Methods of packaging the semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device.
  • the first quantity of encapsulant material in the cavity is treated to form a hardened upper surface thereof having a selected shape.
  • a luminescent conversion element is provided on the upper surface of the treated first quantity of encapsulant material.
  • the luminescent conversion element includes a wavelength conversion material and has a thickness at a middle region of the cavity greater than proximate a side wall of the cavity.
  • the die package includes a substrate, a reflector plate, and a lens.
  • the substrate may be made from thermally conductive but electrically insulating material or from a material that is both thermally and electrically conductive.
  • the substrate further includes an electrically insulating, thermally conductive material formed on the electrically conductive material.
  • the substrate has traces for connecting to a light emitting diode (LED) at a mounting pad.
  • the reflector plate is coupled to the substrate and substantially surrounds the mounting pad.
  • the lens substantially covers the mounting pad. Heat generated by the LED during operation is drawn away from the LED by both the substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink).
  • the reflector plate includes a reflective surface to direct light from the LED in a desired direction.
  • United States Patent Publication No. 2004/0041222 describes a power surface mount light emitting die package.
  • the die package includes a substrate, a reflector plate, and a lens.
  • the substrate is made from thermally conductive but electrically insulating material.
  • the substrate has traces for connecting an external electrical power source to a light emitting diode (LED) at a mounting pad.
  • the reflector plate is coupled to the substrate and substantially surrounds the mounting pad.
  • the lens is free to move relative to the reflector plate and is capable of being raised or lowered by the encapsulant that wets and adheres to it and is placed at an optimal distance from the LED chip(s).
  • the lens can be coated with an optical system comprising optical chemicals that affect the performance of the device.
  • a cover element of single piece plastic may be formed in a moulding process whereby all three of these optical elements, i.e. the Fresnel lens, the negative lens and the reflector, are formed into the single plastic piece. Further, the plastic piece may be arranged to also accommodate auxiliary systems such as alignment indexing and fastening means as well as interlocking peripheral configurations.
  • International Patent Publication No. 2005/107420 describes a light-emitting apparatus including a source of light for emitting light; a down conversion material receiving the emitted light, and converting the emitted light into transmitted light and backward transmitted light; and an optic device configured to receive the backward transmitted light and transfer the backward transmitted light outside of the optic device.
  • the source of light is a semiconductor light emitting diode, which may include alight emitting diode, a laser diode, or a resonant cavity light emitting diode.
  • the down conversion material includes one of phosphor or other material for absorbing light in one spectral region and emitting light in another spectral region.
  • the optic device, or lens includes a light-transmissive material.
  • An object of the invention is to provide a lighting device package.
  • a lighting device package comprising: one or more light-emitting elements operatively coupled to a substrate; a compound lens with a surface facing the one or more light-emitting elements, the compound lens including at least an inner lens element and an outer lens element, the inner lens element having a first index of refraction and the outer lens element having a second index of refraction, the first index of refraction being greater than the second index of refraction; the compound lens, the one or more light-emitting elements and the substrate defining an enclosed space between them; and an encapsulation material filling at least part of said space, the encapsulation material having a third index of refraction equal or greater than the first index of refraction.
  • a lighting device package comprising: one or more light-emitting elements operatively coupled to a substrate; a compound lens disposed to interact with light emitted by the one or more light-emitting elements, the compound lens including at least an inner lens element and an outer lens element, the inner lens element having a first index of refraction and the outer lens element having a second index of refraction, the first index of refraction being greater than the second index of refraction; the compound lens, the one or more light- emitting elements and the substrate defining an enclosed space between them; and an encapsulation material filling at least part of said space, the encapsulation material having a third index of refraction equal or greater than the first index of refraction.
  • Figure 1 schematically illustrates a cross section of a lighting device package according to one embodiment of the invention.
  • Figure 2 schematically illustrates a cross section of a lighting device package according to one embodiment of the invention. DETAILED DESCRIPTION OF THE INVENTION
  • the term "light-emitting element” is used to define a device that emits radiation in a region or combination of regions of the electromagnetic spectrum for example, the visible region, infrared and/or ultraviolet region, when activated by applying a potential difference across it or passing a current through it, for example. Therefore a light-emitting element can have monochromatic, quasi-monochromatic, polychromatic or broadband spectral emission characteristics. Examples of light- emitting elements include semiconductor, organic, or polymer/polymeric light-emitting diodes, optically pumped phosphor coated light-emitting diodes, optically pumped nano- crystal light-emitting diodes or other similar devices as would be readily understood by a worker skilled in the art. Furthermore, the term light-emitting element is used to define the specific device that emits the radiation, for example a LED die.
  • the term "about” refers to a +/-10% variation from the nominal value. It is to be understood that such a variation is always included in any given value provided herein, whether or not it is specifically referred to.
  • the invention provides a lighting device package which comprises one or more light-emitting elements operatively coupled to a substrate, and a compound lens disposed so to interact with light emitted by the one or more light-emitting elements, either directly, for example via a surface of the lens facing the one or more light- emitting elements, or indirectly, for example via one or more optical elements such as reflectors, diffusers, windows and the like.
  • the compound lens can be formed from two or more lens elements, for example, each element can be an adequately thick lens layer with homogenous or non-homogenous thickness.
  • the index of refraction of the outermost lens element of the compound lens is typically smaller than the index of refraction of the innermost lens element, i.e. the lens element closest to the LEEs.
  • An encapsulation material fills an enclosed space located between the compound lens, the substrate and the one or more light-emitting elements.
  • the encapsulation material is selected to have an index of refraction equal to or greater than the innermost lens element of the compound lens but smaller than the refractive index of the LEEs.
  • the refractive indices decrease with distance of the respective components from the light-emitting elements in order to reduce the chances for (total) internal reflection of the light emitted by the LEEs within the light-emitting element package.
  • the invention can provide a lighting device package with reduced total internal reflection (TIR) compared to existing package design technologies.
  • the lighting device package has a number of optical components made of materials which provide appropriate refractive indices.
  • the optical components can be shaped and disposed to generally control the propagation of light inside the lighting device package and specifically to control the propagation of light emitted by the LEEs.
  • the light- emitting element package can have one or more light-emitting elements, for example LED dice, which emit light under operating conditions.
  • the light-emitting elements can be of different types and can emit light which can be nominally different in color or brightness.
  • the configuration of the lighting device package determines how light that originates from the one or more light-emitting elements, is guided to the outside of the light-emitting element package.
  • Many light-emitting elements for example LED dice are made of compound materials which can have high refractive indices.
  • a way to effectively guide the light from a light-emitting element to the ambient medium outside the light-emitting element package is to have the light consecutively propagate through a succession of materials with relatively small discontinuities between their indices of refraction. The closer the refractive indices are of adjacent materials at an optical interface, the smaller the solid angle within which total internal reflection can occur at that interface.
  • Light-propagation in lighting device package can also be affected by the type of light-emitting element, for example, by how an LED die is mechanically and electrically connected to a substrate. It is noted that light-emitting elements can be disposed and operatively connected using a number of different technologies, as is known in the art. For example, LEEs can be wire-bonded from the top of a substrate or surface mounted using a ball grid for a flip chip. Also, there can be one or more LED dice inside one light-emitting element, for example.
  • TIR at each optical interface can be reduced, if the refractive index profile, for example, across the elements of a compound lens is characterised by small discontinuities or small gradients.
  • the same considerations apply to the refractive index profile along the whole optical path from the one or more light- emitting elements to the ambient medium.
  • the compound lens can have a number of elements, each element having a different refractive index, in which the refractive indices vary with distance from the LEEs in order to approach the refractive index of the ambient medium.
  • the ambient medium has a low refractive index close to 1.0, such as air has, for example. If the refractive index of the ambient medium is lower than the refractive index or indices of the LEEs, the elements of the compound lens can be designed to have refractive indices which decrease with increasing distance from the LEEs.
  • a compound lens is positioned relative to the substrate such that it can effectively optically interact with the light emitted by the one or more light-emitting elements.
  • the compound lens may be disposed to interact directly with the emitted light, namely via a surface of the lens facing the one or more light- emitting elements.
  • the compound lens may be disposed to interact indirectly with the emitted light, namely via one or more reflectors, diffusers, windows and other such optical elements.
  • the compound lens can be disposed to interact directly and indirectly with the emitted light.
  • the compound lens can be formed from two or more elements of materials with different refractive indices.
  • the refractive index of the outermost element of the compound lens is typically smaller than the index of refraction of the one or more inner elements of material.
  • the compound lens comprises one or a combination of solid, gel, liquid materials, encapsulation materials or the like.
  • the exterior surface of the light-emitting element package has a hemispherical shape and can be defined by a compound lens.
  • a compound lens can offer better light extraction for a lighting device package with two or more light-emitting elements, or for large area light-emitting elements, for example LED dice. Consequently, the improved light extraction can allow lighting device packages with higher light-emitting element densities.
  • hemispherical lenses can be used to manufacture lighting device packages which can emit light with Lambertian emission patterns. If it is desired that the lighting device package can emit light which has other than Lambertian emission patterns, the optical component of the compound lens can be adequately shaped or the thicknesses of, or relative distances between the optical components adequately dimensioned to provide optical interfaces different from the spherical shape.
  • the inner radius of the lens cavity may be about three or more times the size of the circular area inscribing the one or more light-emitting elements.
  • the hemispherical lens can be disposed relative to the substrate such that the light-emitting elements are positioned close to the spherical center of the internal hemispherical lens cavity.
  • Typical lens and encapsulation materials with suitable refractive indices can include PMMA, polycarbonate, nylon, COC, BK7 glass and silicone, for example, which typically absorb little visible light and only some ultra violet (UV) light. Some of these types of materials can provide resistance to discoloration under prolonged exposure to UV light and a range of suitable indices of refraction.
  • the compound lens can be manufactured in a number of different ways, for example, by shot moulding or other suitable manufacturing processes as would be known to a worker skilled in the art.
  • two, three or more element lens can be manufactured using a multi-shot moulding process.
  • dual shot moulding can be used to fabricate a two element compound lens.
  • Dual shot moulding can be used to manufacture components which provide additional mechanical interlocking elements.
  • the interlocking elements can be formed during the moulding process and provide subsequent mechanical stability by locking the two components of the compound lens relative to each other.
  • the type of interlocking can either be a destructively or non- destructively releasable bond depending on the shapes of the interlocking elements, the nature of the employed materials and the nature of the moulding process.
  • Typical compound lens materials that are adequate for lighting device packages can have refractive indices of approximately 1.40 or greater although materials with other refractive indices may be used.
  • An encapsulation material fills all or a portion of a space between the one or more light-emitting elements and the compound lens.
  • the encapsulation material is selected to have an index of refraction equal to or greater than the index of refraction of the innermost element of the compound lens and smaller than the refractive index of the LEEs.
  • encapsulation materials will have refractive indices of about 1.55.
  • Total internal reflection can be reduced when there are no undesired voids included at interfaces or within the encapsulation material, for example.
  • the encapsulation material may have an index of refraction similar to one of the LEEs. Encapsulation materials with adequate refractive indices slightly lower than the index of refraction of the LEEs can reduce the chances of light undergoing TIR at the optical interface between an LEE and the encapsulation material.
  • soft or fluid encapsulation materials or optical silicone can be sealed, for example, between an adjacent solid optical component such as compound lens and other elements such as the substrate. It is noted that encapsulation material may or may not be in direct thermal contact with one or more light-emitting elements.
  • the one or more light-emitting elements are operatively coupled to a substrate.
  • the substrate can be a ceramic board, for example, AlN, a metal clad PC board, a LTCC on metal ceramic, an attach pad for insert moulded lead frame LEDs or the like as would be known in the art.
  • the surface of the substrate facing the cavity, or certain areas of it, can be diffuse or specular reflective, for example.
  • the reflective properties can result from, for example, aluminium or silver coatings and applied reflective films, for example. Evaluation of Index of Refraction
  • the combination of refractive indices that reduces TIR may be governed by different formula for non-planar or non-parallel adjacent optical interfaces.
  • the LEEs for example the LED dice
  • the LEEs can be coated with an anti-reflective, for example, conformal coating with an index of refraction between that of the medium surrounding the coating and that of the light- emitting elements.
  • the coating material has good transmissivity, particularly for visible light, resistance to discoloration, and good adhesion to the light-emitting element.
  • Figure 2 schematically illustrates a cross section of another LED package 200 according to another embodiment of the invention.
  • This embodiment is similar to the one illustrated in Figure 1 but comprises a compound lens 210 with a solid hemi- spherical interior lens element 232 which is covered by an outer lens layer 234.
  • the outer lens layer 234 is attached to the solid hemi-spherical interior lens element 232 by interlocking elements 250.

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un emballage de dispositif d'éclairage ayant un ou plusieurs éléments émettant de la lumière couplée de façon opérationnelle à un substrat ; une lentille composite disposée pour interagir avec la lumière émise par les éléments émettant de la lumière, la lentille composite comprenant au moins un élément de lentille interne et un élément de lentille externe, l'élément de lentille interne ayant un premier indice de réfraction et l'élément de lentille externe ayant un second indice de réfraction, le premier indice de réfraction étant supérieur au second indice de réfraction ; la lentille composite, les éléments émettant de la lumière et le substrat définissant un espace fermé entre eux ; et une matière d'encapsulation remplissant au moins une partie dudit espace, la matière d'encapsulation ayant un troisième indice de réfraction égal ou supérieur au premier indice de réfraction.
EP07763859A 2006-07-06 2007-07-06 Emballage de dispositif d'eclairage Withdrawn EP2041805A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80669406P 2006-07-06 2006-07-06
PCT/CA2007/001196 WO2008003176A1 (fr) 2006-07-06 2007-07-06 Emballage de dispositif d'éclairage

Publications (1)

Publication Number Publication Date
EP2041805A1 true EP2041805A1 (fr) 2009-04-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP07763859A Withdrawn EP2041805A1 (fr) 2006-07-06 2007-07-06 Emballage de dispositif d'eclairage

Country Status (7)

Country Link
EP (1) EP2041805A1 (fr)
JP (1) JP5178714B2 (fr)
KR (1) KR20090031446A (fr)
CN (1) CN101485004B (fr)
BR (1) BRPI0714026A2 (fr)
RU (1) RU2009103911A (fr)
WO (1) WO2008003176A1 (fr)

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KR101484488B1 (ko) 2006-10-31 2015-01-20 코닌클리케 필립스 엔.브이. 조명 장치 패키지
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CN101485004B (zh) 2012-05-02
RU2009103911A (ru) 2010-08-20
BRPI0714026A2 (pt) 2012-12-18
JP5178714B2 (ja) 2013-04-10
CN101485004A (zh) 2009-07-15

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