EP2052263A1 - Sonde d'oscilloscope - Google Patents

Sonde d'oscilloscope

Info

Publication number
EP2052263A1
EP2052263A1 EP07765099A EP07765099A EP2052263A1 EP 2052263 A1 EP2052263 A1 EP 2052263A1 EP 07765099 A EP07765099 A EP 07765099A EP 07765099 A EP07765099 A EP 07765099A EP 2052263 A1 EP2052263 A1 EP 2052263A1
Authority
EP
European Patent Office
Prior art keywords
voltage divider
oscilloscope probe
semiconductor substrate
resistor
input voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP07765099A
Other languages
German (de)
English (en)
Inventor
Martin Peschke
Alexander Schild
Gerhard Kahmen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohde and Schwarz GmbH and Co KG
Original Assignee
Rohde and Schwarz GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohde and Schwarz GmbH and Co KG filed Critical Rohde and Schwarz GmbH and Co KG
Publication of EP2052263A1 publication Critical patent/EP2052263A1/fr
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/20—Modifications of basic electric elements for use in electric measuring instruments; Structural combinations of such elements with such instruments
    • G01R1/203—Resistors used for electric measuring, e.g. decade resistors standards, resistors for comparators, series resistors, shunts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06766—Input circuits therefor

Definitions

  • the invention relates to an oscilloscope probe according to the preamble of the main claim.
  • Active probes for ground-based or differential oscilloscopes contain an impedance converter, which picks up the signal to be measured via the probe tip with high impedance and supplies it to the input of the oscilloscope at the output with a characteristic impedance of usually 50 ohms via a suitable RF cable.
  • an input voltage divider which is composed of resistors and capacitors and serves to increase the linear range of the amplifier and to compensate for its input capacitance.
  • This input divider provides the limiting element for further miniaturization of such active probes.
  • it produces parasitic effects which limit the bandwidth of such active probes.
  • such an amplifier may tend to oscillate if it is not low-impedance matched at the input. This is the case when the amplifier input is connected via a bonding wire to the input divider, which has a high impedance for high frequencies.
  • voltage dividers are used, which are either constructed of discrete components or realized in thick or thin film technology (for example, according to US Patent US 5,172,051, US 6,483,284, US 6,949,919, US 6,982,550, US 5,061,892, US 5,796,308 , US 6,720,828, US 6,967,473 or US 6,828,769).
  • the elements of the voltage divider are on a ceramic or PCB substrate arranged together with the intended as a separate component amplifier chip.
  • the adjustment of the voltage divider via potentiometers, varactor diodes or by laser alignment of resistor or capacitor surfaces on the substrate. In all these known arrangements, a large part of the substrate surface is occupied by the tunable voltage divider.
  • parasitic elements of the voltage divider generate unwanted frequency responses, which reduce the bandwidth to a few GHz. Such parasitic
  • At least a part, preferably the entire voltage divider, is constructed in integrated circuit technology together with the amplifier on the semiconductor substrate.
  • the voltage divider can be adjusted. This can be done for example by additional arrays of parallel and / or series-connected resistors or capacitors whose leads are selectively separated, for example in laser technology.
  • the components integrated on the semiconductor chip are substantially smaller than those in thick-film technology or as individual components, they are in the range of about 10 ⁇ m.
  • such a voltage divider can be constructed in a frequency range up to, for example, 10 GHz almost free from interfering parasitic elements.
  • the semiconductor chip can be placed directly on the substrate edge of the measuring head, which significantly reduces the dimension of the signal path of the probe and allow further miniaturization of the probes.
  • the immediate integration of input dividers and amplifiers also eliminates a hitherto conventional connection wire and a resulting previously disturbing high impedance at high frequencies.
  • the dimensions of the amplifier chip increase by the integration of this divider not or only slightly, since the chip area is usually limited by the size of the contact surfaces.
  • the entire input voltage divider is integrated on the amplifier chip, but alternatively only a part of this voltage divider can be integrated on the semiconductor chip, while the smallest possible part is implemented using conventional technology.
  • the capacitors and low-resistance resistors can be integrated on the semiconductor chip, while the high-resistance resistors (up to 2 MOhm) can be realized further in thick-film technology or as hybrid components on the substrate.
  • the invention can both be applied to both ground-based and differential probes.
  • Fig. 1 is a schematic sectional view of the probe according to the invention.
  • the invention shows an incorporated in a probe for an oscilloscope substrate 1 made of ceramic or in the form of a printed circuit board piece, on which a semiconductor chip is placed, on which z. B. as an ASIC on a corresponding semiconductor substrate 2, an amplifier 3 is integrated together with an input voltage divider 4.
  • the input of the voltage divider 4 is connected to a conductor track 5, which leads to the probe tip of the probe.
  • the output of the amplifier 3 is connected to a conductive track 6, which forms the output of the probe, which is connected via a cable to the actual oscilloscope, not shown.
  • resistors and capacitors voltage divider 4 In the region of the consisting of resistors and capacitors voltage divider 4, additional matrices of parallel and / or series-connected resistors or capacitors are preferably provided whose leads can be separated selectively in laser technology, so that trimmed the input voltage divider even after assembly of the probe can be.
  • These matrices are preferably semiconductor technology formed on the semiconductor substrate.
  • the resistor and capacitor elements constructed in semiconductor technology can also be characterized that their areas are selectively trimmed.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

La présente invention concerne une sonde d'oscilloscope comprenant un amplificateur à transistors (3) monté sous forme de circuit intégré sur un substrat semi-conducteur (2). Selon cette invention, au moins une partie du diviseur de tension d'entrée (4) est également montée sous forme de circuit intégré sur le substrat semi-conducteur (2) avec l'amplificateur (3).
EP07765099A 2006-08-14 2007-07-05 Sonde d'oscilloscope Ceased EP2052263A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006038027 2006-08-14
DE102006052748A DE102006052748A1 (de) 2006-08-14 2006-11-08 Oszilloskop-Tastkopf
PCT/EP2007/005981 WO2008019732A1 (fr) 2006-08-14 2007-07-05 Sonde d'oscilloscope

Publications (1)

Publication Number Publication Date
EP2052263A1 true EP2052263A1 (fr) 2009-04-29

Family

ID=38800941

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07765099A Ceased EP2052263A1 (fr) 2006-08-14 2007-07-05 Sonde d'oscilloscope

Country Status (4)

Country Link
US (1) US8278953B2 (fr)
EP (1) EP2052263A1 (fr)
DE (1) DE102006052748A1 (fr)
WO (1) WO2008019732A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9155198B2 (en) 2012-05-17 2015-10-06 Eagantu Ltd. Electronic module allowing fine tuning after assembly
US9470753B2 (en) 2012-11-07 2016-10-18 Cascade Microtech, Inc. Systems and methods for testing electronic devices that include low power output drivers
CN108333393B (zh) * 2017-01-20 2021-12-24 罗德施瓦兹两合股份有限公司 探针和校正方法
CN108107241B (zh) * 2017-12-01 2018-12-04 浙江大学 一种稳定漏电压的新型探针结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3441804A (en) * 1966-05-02 1969-04-29 Hughes Aircraft Co Thin-film resistors
EP0327078A2 (fr) * 1988-02-04 1989-08-09 Kabushiki Kaisha Toshiba Réseau de résistances d'équilibrages
US5225776A (en) * 1991-10-07 1993-07-06 Tektronix, Inc. Method and apparatus for probing and sampling an electrical signal
US6373348B1 (en) * 2000-08-11 2002-04-16 Tektronix, Inc. High speed differential attenuator using a low temperature co-fired ceramic substrate
US20020074319A1 (en) * 2000-12-16 2002-06-20 Wilbur Mark Steven Laser-trimmable digital resistor

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US3863149A (en) * 1973-10-30 1975-01-28 Us Navy Rf hazard detector
US4646005A (en) * 1984-03-16 1987-02-24 Motorola, Inc. Signal probe
US4739259A (en) * 1986-08-01 1988-04-19 Tektronix, Inc. Telescoping pin probe
US4745365A (en) * 1986-12-31 1988-05-17 Grumman Aerospace Corporation Digital receiver with dual references
US5061892A (en) 1990-06-13 1991-10-29 Tektronix, Inc. Electrical test probe having integral strain relief and ground connection
US5200717A (en) * 1991-04-11 1993-04-06 Tektronix, Inc. Active electrical circuitry interconnected and shielded by elastomer means
US5172051A (en) 1991-04-24 1992-12-15 Hewlett-Packard Company Wide bandwidth passive probe
GB2264788B (en) * 1992-02-11 1996-06-05 Armex Electronics Ltd A Wideband switchable gain active probe
DE4217408C1 (de) * 1992-05-26 1993-11-25 Texas Instruments Deutschland Integrierter Spannungsteiler
US5420515A (en) * 1992-08-28 1995-05-30 Hewlett-Packard Company Active circuit trimming with AC and DC response trims relative to a known response
US5629617A (en) 1995-01-06 1997-05-13 Hewlett-Packard Company Multiplexing electronic test probe
US5600278A (en) * 1995-02-03 1997-02-04 Hewlett-Packard Company Programmable instrumentation amplifier
US5796308A (en) * 1996-06-28 1998-08-18 Tektronix, Inc. Differential attenuator common mode rejection correction circuit
US6605934B1 (en) 2000-07-31 2003-08-12 Lecroy Corporation Cartridge system for a probing head for an electrical test probe
JP3958532B2 (ja) * 2001-04-16 2007-08-15 ローム株式会社 チップ抵抗器の製造方法
US6552523B2 (en) * 2001-05-24 2003-04-22 Tektronix, Inc. Combination low capacitance probe tip and socket for a measurement probe
US6483284B1 (en) * 2001-06-20 2002-11-19 Agilent Technologies, Inc. Wide-bandwidth probe using pole-zero cancellation
US6720828B2 (en) * 2001-11-21 2004-04-13 Tektronix, Inc. Apparatus and method for compensating a high impedance attenuator
US6870359B1 (en) * 2001-12-14 2005-03-22 Le Croy Corporation Self-calibrating electrical test probe
EP1335207B1 (fr) * 2002-02-11 2012-10-10 Tektronix, Inc. Procédé et appareil de capture d'un signal
JP2003332842A (ja) * 2002-05-13 2003-11-21 Fujitsu Media Device Kk 発振器
US6828802B2 (en) * 2002-08-16 2004-12-07 Rosemount Inc. Pressure measurement device including a capacitive sensor in an amplifier feedback path
US7259545B2 (en) * 2003-02-11 2007-08-21 Allegro Microsystems, Inc. Integrated sensor
US6949919B1 (en) * 2004-04-28 2005-09-27 Agilent Technologies, Inc. Unbreakable micro-browser
US6967473B1 (en) 2004-05-27 2005-11-22 Tektronix, Inc. Attachable/detachable variable spacing probing tip system
US7504841B2 (en) * 2005-05-17 2009-03-17 Analog Devices, Inc. High-impedance attenuator

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3441804A (en) * 1966-05-02 1969-04-29 Hughes Aircraft Co Thin-film resistors
EP0327078A2 (fr) * 1988-02-04 1989-08-09 Kabushiki Kaisha Toshiba Réseau de résistances d'équilibrages
US5225776A (en) * 1991-10-07 1993-07-06 Tektronix, Inc. Method and apparatus for probing and sampling an electrical signal
US6373348B1 (en) * 2000-08-11 2002-04-16 Tektronix, Inc. High speed differential attenuator using a low temperature co-fired ceramic substrate
US20020074319A1 (en) * 2000-12-16 2002-06-20 Wilbur Mark Steven Laser-trimmable digital resistor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2008019732A1 *

Also Published As

Publication number Publication date
US20100231199A1 (en) 2010-09-16
US8278953B2 (en) 2012-10-02
WO2008019732A1 (fr) 2008-02-21
DE102006052748A1 (de) 2008-04-30

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