EP2059559A1 - Adhésif ou agent d'étanchéité comportant des particules inorganiques modifiées - Google Patents

Adhésif ou agent d'étanchéité comportant des particules inorganiques modifiées

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Publication number
EP2059559A1
EP2059559A1 EP07802377A EP07802377A EP2059559A1 EP 2059559 A1 EP2059559 A1 EP 2059559A1 EP 07802377 A EP07802377 A EP 07802377A EP 07802377 A EP07802377 A EP 07802377A EP 2059559 A1 EP2059559 A1 EP 2059559A1
Authority
EP
European Patent Office
Prior art keywords
adhesive
groups
inorganic particles
sealant
reaction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07802377A
Other languages
German (de)
English (en)
Inventor
Winfried Wichelhaus
Rainer SCHÖNFELD
Stefan Kreiling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of EP2059559A1 publication Critical patent/EP2059559A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins

Definitions

  • the present invention relates to an epoxy-based adhesive or sealant containing, based on the total adhesive, from 5 to 30% by weight of inorganic particles whose surface has been coated by reaction with organic molecules carrying at least two terminal functional groups each functional group contains at least one heteroatom with at least one free electron pair.
  • This addition improves important performance properties, in particular the peel strength at low temperatures.
  • a special field of application is the use as structural adhesive in vehicle construction.
  • Reactive epoxy-based hot melt adhesives are known. In machine, vehicle or equipment construction, in particular in aircraft construction, rail vehicle construction or motor vehicle construction, the components made of the various metallic components and / or composite materials are increasingly joined with the aid of adhesives. For structural bonds with high strength requirements, epoxy adhesives are used extensively, in particular as hot-curing, one-component adhesives, which are often also formulated as reactive hot melt adhesives. Reactive hot melt adhesives are adhesives that are solid at room temperature and soften at temperatures up to about 80 to 90 0 C and behave like a thermoplastic material. Only at higher temperatures from about 100 0 C present in these hot melt adhesives latent curing agents are thermally activated, so that irreversible curing takes place to a thermoset. For joining the components, for.
  • the adhesive is first applied warm to at least one substrate surface, the components to be joined are then joined. Upon cooling, the adhesive then solidifies and provides by this physical solidification sufficient handling strength, ie, a preliminary connection. The such interconnected components are further treated in the various washing, phosphating and dip coating baths. Only then is the adhesive cured in an oven at higher temperatures.
  • a common, known modification of epoxy resins of the aforementioned type consists in the reaction of a polybutadiene-co-acrylonitrile copolymer having carboxyl end groups with an epoxy resin. This rubber-epoxy adduct is then dispersed in one or more different epoxy resins. The reaction of the epoxy resin with the carboxy-containing butadiene-acrylonitrile rubber must be conducted in such a way that it does not lead to premature curing of the adduct. Although such modified epoxy resin compositions already present a significant improvement in their impact resistance over the unmodified epoxy resins, their behavior towards peeling loads is still insufficient.
  • WO 01/94492 is to improve reactive adhesives of the type mentioned at the outset further that they have sufficient flexibility, increased peel strength have not only at room temperature but in particular also at low temperatures below 0 0 C, the task.
  • the peel strength at low temperatures and sudden load a have the highest possible value, so that structurally bonded components in the event of an accident (crash behavior) meet the modern safety requirements in vehicle construction.
  • the reactive adhesives must have sufficient leaching resistance immediately after application and before final curing.
  • the adhesive compositions must be formulated as a hot melt adhesive or as a highly viscous, warm adhesive to be processed. Another possibility is the formulation as an adhesive, which can be gelled by a thermal pre-reaction in the so-called "shell furnace” or by induction heating of the parts to be joined.
  • reaction product preparable from a difunctional amino-terminated polymer and a tri- or tetracarboxylic anhydride, characterized by an average of more than one imide group and carboxyl group per molecule, or
  • reaction product preparable from a tri- or polyfunctional polyol or a tri- or polyfunctional amino-terminated polymer and a cyclic carboxylic anhydride, wherein the reaction product contains on average more than one carboxyl group per molecule, or
  • Fillers may contain, such as the various milled or precipitated chalks, carbon black, calcium magnesium carbonates, heavy spar and in particular silicatic fillers of the type of aluminum-magnesium-calcium silicate, z. B. wollastonite, chlorite.
  • the requirements for modern structural adhesives in vehicle construction are constantly increasing, since more and more structural elements are also joined to the load-bearing nature by adhesive bonding methods. Therefore, the adhesives must meet a practice-relevant aspects of manufacturing, this includes automated processing in short cycle times, adhesion to oiled sheets, adhesion to various types of sheet and compatibility with the process conditions of the paint line (resistance to washing and phosphating, curable during the stoving of the cathodic Primer, resistance to subsequent painting and drying operations).
  • modern structural adhesives must also meet increasing strength and deformation properties in the cured state. These include the high corrosion resistance or bending stiffness of the structural components as well as the deformability under mechanical stress of the bond.
  • the highest possible deformability of the components ensures a considerable safety advantage in case of impact load (crash behavior) in an accident.
  • This behavior can be best achieved by determining the impact energy for cured bonds determine this are desirable both at high temperatures of up to +90 0 C and in particular at low temperatures down to -40 0 C sufficiently high values for impact energy or impact peel or required.
  • the highest possible tensile shear strength should be achieved. Both strengths have on a variety of substrates, mainly oiled sheets, such.
  • As body steel sheet, galvanized sheet steel, sheets of various aluminum alloys or magnesium alloys and with organic coatings of the type "Bonazinc" or "Granocoat" in the coil coating-coated steel sheets can be achieved by a variety of methods.
  • the object of the present invention is to provide epoxy-based adhesives or sealants which, at least in some of the above-mentioned requirements, lead to improvements.
  • the present invention relates to an epoxy-based adhesive or sealant containing, based on the total adhesive, from 5 to 30% by weight of inorganic particles whose surface has been coated by reaction with organic molecules carrying at least two terminal functional groups each functional group contains at least one heteroatom with at least one lone pair of electrons.
  • the upper limit of the content of inorganic particles depends on the viscosity of the adhesive or sealant at the processing temperature. The viscosity increases with increasing content of inorganic particles. However, it must not become so high that the adhesive or sealant is no longer flowable at the intended application temperature.
  • An upper limit of 30% by weight of inorganic particles is a guideline value which can be exceeded if appropriate with particularly low-viscosity adhesives or sealants.
  • An upper limit of 20% by weight of inorganic particles generally still results in a suitable viscosity at the application temperature in the case of industrially customary epoxy-based adhesives or sealants and is therefore preferred as upper limit.
  • inorganic particles as fillers and / or reinforcing agents in adhesives or sealants. These particles must have a particle size which is compatible with the intended use of the adhesive or sealant.
  • the lower limit of the size of the inorganic particles is given on the one hand by their manufacturability and on the other hand by their influence on the viscosity of the adhesive or sealant. The smaller the particle size of the inorganic particles, the higher the viscosity of the adhesive or sealant at the same weight fraction of the inorganic particles.
  • a technically useful lower limit of the average particle size is 10 nm, preferably 50 nm and in particular 100 nm.
  • the upper limit of the particle size is given by the intended thickness of the adhesive joint. Usually, however, one chooses the upper limit much smaller than the thickness of the adhesive joint. Upper limits of 20 microns, in particular of 10 microns are common and suitable for the present invention.
  • the average particle size of the particles can be determined by conventional methods, for example by light scattering or electron microscopy. "Particles” are understood as meaning those particles which are dispersed in the organic matrix and which may represent agglomerates of smaller units.
  • functional groups are considered to be "terminal" when these groups are at the ends of a pure or heteroatom-interrupted hydrocarbon chain having at least 5 atoms in the chain
  • These functional groups may themselves be further organic radicals such as alkyl groups or alkanol groups, which may be the case for example with amino groups as “terminal groups”.
  • a pair of electrons in the valence shell which does not form a bond to another atom is referred to as a "free electron pair.”
  • such heteroatoms are in particular nitrogen, oxygen or sulfur atoms.
  • the functional groups are preferably selected from -OH groups (which may be part of an alcohol or a carboxylic acid), -SH groups, epoxy groups and -NHR groups, where R is hydrogen or an organic radical having 1 to 12 C- Atoms means.
  • the organic molecules contain ether groups in addition to the mentioned terminal functional groups.
  • the organic molecules are selected from those which contain one or more ethylene oxide or propylene oxide group (s) incorporated with the opening of the epoxide ring as an ether, and terminal -OH groups, -SH groups, or -NHR groups where R is hydrogen or an organic radical having 1 to 12 carbon atoms. Specific examples are:
  • Y represents an organic moiety which is used to form z ether and / or or R 1 and R 2 are either H atoms or R 1 is an H atom and R 2 is a methyl group, or R 1 is a methyl group and R 2 is a hydrogen atom and n is a number in the range of 0 to 10 and z is an integer in the range of 2 to 6, especially 3 to 4. The number n may be the same or different in each of the z groups. d) compounds of the formula
  • Y [-O-CHR 1 -CHR 2 - [O-CHR 1 -CHR 2 ] n -O-CHR 2 - CHR 1 - NRH] 2 , wherein Y represents an organic moiety which is used to form e.g.
  • R is hydrogen or an organic n is 1 to 12 carbon atoms and R 1 and R 2 are either both H atoms or R 1 is an H atom and R 2 is a methyl group, or R 1 is a methyl group and R 2 is a hydrogen atom and n is a number in Range of 0 to 10 and z is an integer in the range of 2 to 6, especially 3 to 4. The number n may be the same or different in each of the z groups.
  • Organic Molecule Parts Y in the formulas c) and d) are the molecular radicals of ethylene glycol, 1,3-propylene glycol, 1,2-propylene glycol which are reduced by the H atoms of the OH groups and the position isomers of butyric glycol, glycerol, the positional isomers of tris-methylolethane and tris-methylolipropane, in particular 1,1,1-trismethylolpropane, erythritol, pentaerythritol, pentites and hexites, as well as sugars of the pentoses and hexoses type and the corresponding carboxylic acids which can be obtained from the abovementioned or polyhydric alcohols derived in that one or more -CH 2 -OH - groups is replaced by one carboxylate each.
  • n indicates the average number of ethylene oxide or propylene oxide groups ring-opened under ether formation in the abovementioned molecules. Therefore, n can also represent a fractional number.
  • organic molecules having epoxide groups may be selected those bearing glycidyl ether groups.
  • the glycidyl ether groups may be linked directly or indirectly to the phenyl rings of bisphenols.
  • Specific examples are bisphenol A glycidyl ethers in which the glycidyl lether groups in the 2- or 4-position on the phenyl rings, and the corresponding bisphenol-F-glycidyl ether.
  • the surface of the inorganic particles has been coated to such an extent with the inorganic molecules that at least 4 carbon atoms of the organic molecules are present per nm 2 surface.
  • at least 6 and in particular at least 8 carbon atoms of the organic molecules are present per nm 2 surface area. How the coverage density can be measured will be described below.
  • the inorganic particles are preferably selected from oxides, hydroxides, carbonates and silicas or silicates. Oxides of titanium in particular such as rutile or anatase are suitable as oxides. Aluminum oxides or hydroxides can also be used. Zinc oxides are also suitable.
  • the carbonates used are preferably carbonates of calcium and / or magnesium. Examples are chalk and dolomite.
  • the inorganic particles may also be mixed oxides / hydroxides such as basic aluminas or basic zinc oxides. Mixed carbonates / hydroxides such as basic zinc carbonate may also be used.
  • silicas or silicates refers to (hydroxide-containing) silicon oxides which can be obtained, for example, from silicon-halogen compounds by pyrolysis or by hydrolysis
  • Silicates can be salts of silicic acids with, in particular, alkaline-earth metals. Examples of these are bentonites, calcium silicates such as wollastonite are also suitable, as well as chlorites Other examples are mentioned below in connection with a specific method of preparation of organic particles coated with organic molecules.
  • the organic molecules are connected via silicon atoms to the surface of the inorganic particles. This can be done by a reaction sequence described in WO2005 / 061631 and EP 1526115 cited herein.
  • the particles may contain exclusively silicon as the semi-metal M, that is to say consist of silicon dioxide or "silicic acids.”
  • the metallic or semimetallic component M may consist only proportionally of silicon, as is the case, for example, with aluminosilicate minerals Compounds such as layered silicates such as mica, bentonites, etc. are included in the present invention as "inorganic particles”.
  • oxidic compounds such as, for example, titanium dioxide, zirconium oxides, zinc oxide, iron oxides, nickel oxides, manganese oxides, cerium oxides, aluminum oxides or else mixed oxides which contain the metals titanium, zinc, Zirconium, iron, cobalt, nickel, cerium and / or aluminum.
  • Variable parameters for this are in particular the strength of the acid, the reaction temperature and the reaction time.
  • strong acids are acids of the strength of phosphoric acid and stronger acids such as sulfuric acid in particular suitable.
  • the silicon-halogen compounds which are brought into contact with the inorganic particles in reaction step b) are preferably selected from silicon chlorides and silicon bromides, for example from silicon tetrachloride and silicon tetrabromide.
  • the reaction is possible from the gas phase, but is preferably carried out in the liquid phase in an anhydrous medium as possible.
  • the liquid phase should therefore contain as little water as technically possible.
  • the water content should be below 1 ppm. This ensures that the Si-halogen bonds are not hydrolyzed by water or at least only to a minor extent, while the majority of the silicon-halogen molecules are bound to the particle surface by reaction with the surface MOH groups.
  • the reaction is preferably controlled such that 1 to 3 MO-Si bonds are formed per silicon atom, while 3 to 1, preferably 1 to 2 Si-halogen bonds are retained. These are then available for further functionalization reactions.
  • the silicon-halogen compounds to be reacted with the oxidic particles, even considered. These serve not only as a reagent, but at the same time as a reaction medium.
  • halogen-containing compounds can also be brought into contact with the particles of the oxidic compounds in dry non-protic solvents.
  • suitable non-protic solvents are cyclohexane and diethyl ether.
  • other non-protic solvents are liquid aromatic or aliphatic hydrocarbons such as benzene, toluene or petroleum ether into consideration.
  • the next process step consists in carrying out, after reaction step b), in a further reaction step c), the particles having at least one organic compound whose molecules carry at least two terminal functional groups, each functional group containing at least one heteroatom having at least one lone pair of electrons, under such conditions that Si-X bonds are cleaved and instead bonds of Si to the organic compound or to a residue thereof are formed.
  • organic molecules which are suitable in the context of the present invention have been mentioned above.
  • Particularly suitable for this reaction step are those organic molecules which carry terminal -OH groups, -SH groups or -NHR groups.
  • reaction step c a mixture of different compounds can be used in reaction step c). This then leads to inorganic particles that carry different organic radicals on their surface.
  • the particle surface and, if necessary, the porosity are first measured by the BET method (for example using nitrogen).
  • the total content of organic radicals or of the carbon atoms herein and / or of silicon on the particles can be determined by elemental analysis.
  • a thermogravimetric analysis and / or DSC measurement can also be used.
  • the organic radicals burn at elevated temperature, which leads to a loss of mass. This combustion reaction shows in an exothermic effect in a DSC measurement.
  • the comparison can be made with a thermogravimetric analysis and / or DSC measurement of the non-occupied with the silicon-containing groups starting material.
  • the total number of organic radicals in moles and hence the occupation density can be determined from the weight loss. This analysis can be supported or supplemented by catching up the carbon dioxide and water produced during the combustion of the organic residues in the course of a combustion analysis and deducing the amount of collected carbon back to the number of organic residues. If the chemical nature of the organic radicals and / or their number per Si atom is unknown in the case of an unknown sample, then at least the number of carbon atoms per nm 2 surface can be deduced from such analyzes. In addition, mass spectroscopic techniques can be used to elucidate the chemical nature of the organic radicals.
  • the coverage density in groups per nm 2 can be calculated. Further details can be found in the cited EP patent application EP 1526115. Instead of the number of C atoms per nm 2 surface, the coverage density can also be characterized, as described in EP 1526115 and in WO2005 / 061631, by the number of bound organic molecules per nm 2 surface. In the context of the present invention, this is preferably at least 2, in particular at least 3 and particularly preferably at least 4, in accordance with the two aforementioned documents EP 1526115 and WO2005 / 061631.
  • epoxy-based adhesives or sealants it is also preferred within the scope of the present invention that it be present in two components, one component A consisting of or containing one or more epoxides and a second Component B consists of one or more curing agents for epoxides or contains. Immediately before application, these two components are mixed together.
  • epoxies and curing systems suitable which are commonly used in the art as adhesives or sealants.
  • the components A and B are composed so that the same volume can be mixed for application.
  • component B contains said inorganic particles in an amount such that the proportion of inorganic particles in the total adhesive or sealant after mixing components A and B is in the range of 5 to 30 wt .-%, preferably from 5 to 20 wt .-%, wherein the surface of the inorganic particles has been occupied by reaction with organic molecules which carry at least two terminal functional groups selected from -OH groups, -SH groups and -NHR groups, where R is hydrogen or an organic radical having 1 to 12 C atoms.
  • These functional groups correspond to typical functional groups in hardener systems and can react with the epoxide component A to open the oxirane ring and add the organic molecule.
  • the component A contains the said inorganic particles in such an amount that the proportion of the inorganic particles in the entire adhesive or sealant after mixing the components A and B in the range of 5 to 30 wt. %, preferably in the range of 5 to 20% by weight, wherein the surface of the inorganic particles has been coated by reaction with organic molecules carrying at least two terminal functional groups selected from epoxide groups.
  • the occupied inorganic particles "epoxy resin-like" and can react with the hardener molecules of the component B opening the oxirane ring and addition of the organic molecule.
  • the adhesives or sealants according to the invention can also be present as one-component systems, the epoxy resins and activatable or latent hardeners contain.
  • the stated inorganic particles are contained in proportions ranging from 5 to 30 wt .-%, preferably from 5 to 20 wt .-%.
  • epoxy resins are a variety of polyepoxides having at least 2 1, 2-epoxy groups per molecule.
  • the epoxide equivalent of these polyepoxides can vary between 150 and 4000.
  • the polyepoxides may in principle be saturated, unsaturated, cyclic or acyclic, aliphatic, alicyclic, aromatic or heterocyclic polyepoxide compounds.
  • suitable polyepoxides include the polyglycidyl ethers prepared by reaction of epichlorohydrin or epibromohydrin with a polyphenol in the presence of alkali.
  • polyphenols examples include resorcinol, pyrocatechol, hydroquinone, bisphenol A (bis (4-hydroxyphenyl) -2,2-propane), bisphenol F (bis (4-hydroxyphenyl) methane), bis (4-hydroxyphenyl) 1,1-isobutane, 4,4'-dihydroxybenzophenone, bis (4-hydroxyphenyl) -1,1-ethane, 1,5-hydroxynaphthalene.
  • polyglycidyl ethers of polyalcohols or diamines are suitable polyepoxides. These polyglycidyl ethers are derived from polyhydric alcohols such as ethylene glycol, diethylene glycol, triethylene glycol, 1,2-propylene glycol, 1,4-butylene glycol, triethylene glycol, 1,5-pentanediol, 1,6-hexanediol or trimethylolpropane.
  • polyepoxides are polyglycidyl esters of polycarboxylic acids, for example reactions of glycidol or epichlorohydrin with aliphatic or aromatic polycarboxylic acids such as oxalic acid, succinic acid, glutaric acid, terephthalic acid or dimer fatty acid.
  • epoxides are derived from the epoxidation products of olefinically unsaturated cycloaliphatic compounds or of native oils and fats.
  • liquid epoxy resins which are derived by reaction of bisphenol A or bisphenol F and epichlorohydrin. It will be in the Usually mixtures of liquid and solid epoxy resins used, wherein the liquid epoxy resins are preferably based on bisphenol A and have a sufficiently low molecular weight.
  • liquid epoxy resins are used at room temperature, which generally have an epoxide equivalent weight of 150 to about 220, more preferably an epoxide equivalent weight range of 182 to 192.
  • Guanidines, substituted guanidines, substituted ureas, melamine resins, guanamine derivatives, cyclic tertiary amines, aromatic amines and / or mixtures thereof can be used as thermally activatable or latent hardeners for the epoxy resin in the case of the one-component systems.
  • the hardeners may be involved stoichiometrically in the curing reaction, but they may also be catalytically active.
  • substituted guanidines are methylguanidine, dimethylguanidine, trimethylguanidine, tetramethylguanidine, methylisobiguanidine, dimethylisobiguanidine, tetramethylisobiguanidine, hexamethylisobiguanidine, hepamethylisobiguanidine, and especially cyanguanidine (dicyandiamide).
  • suitable guanamine derivatives its alkylated benzoguanamine resins, benzoguanamine resins or methoxymethyl-ethoxymethyl-benzoguanamine called.
  • thermosetting hotmelt adhesives For the one-component, thermosetting hotmelt adhesives, the criterion of choice is of course the low solubility of these substances at room temperature in the resin system, so that solid, finely ground hardening agents are preferred, in particular dicyandiamide is suitable. This ensures good storage stability of the composition.
  • catalytically active substituted ureas can be used. These are in particular the p-chlorophenyl-N, N-dimethylurea (monuron), 3-phenyl-1, 1-dimethylurea (fenuron) or 3,4-dichlorophenyl-N, N-dimethylurea (diuron).
  • catalytically active tertiary aryl or alkyl amines such as, for example, the benzyldimethylamine, tris (dimethylamino) phenol, piperidine or piperidine derivatives, but these often have too high a solubility in the adhesive system, so that no usable one here Storage stability of the incom- ponentigen system is achieved.
  • various, preferably solid, imidazole derivatives can be used as catalytically active accelerators. Representative examples include 2-ethyl-2-methylimidazole, N-butylimidazole, benzimidazole and NC 1 to C 12 -Alkyiimidazole or N-arylimidazoles.
  • the adhesives according to the invention can be formulated, on the one hand, as one-component adhesives, it being possible for these to be formulated both as highly viscous, warm adhesives and as thermally curable hot melt adhesives. Furthermore, these adhesives can be formulated as one-component, pre-gelling adhesives, in the latter case, the compositions contain either finely divided thermoplastic powders, such. As polymethacrylates, polyvinyl butyral or other thermoplastic (co) polymers or the curing system is tuned so that a two-stage curing process takes place, the gelling step causes only a partial curing of the adhesive and the final curing in vehicle z. B. in one of the paint ovens, preferably in the KTL furnace takes place.
  • the adhesive compositions according to the invention can also be formulated as two-component epoxy adhesives in which the two reaction components are mixed together shortly before application, the curing then taking place at room temperature or moderately elevated temperature.
  • the reaction components known per se for two-component epoxy adhesives for example di- or polyamines, amino-terminated polyalkylene glycols (for example Jeffamine, amino-poly-THF) or polyaminoamides, may be used as the second reaction component.
  • Other reactive partners may be mercapto-functional prepolymers such.
  • the epoxy compositions can also be cured with carboxylic acid anhydrides as the second reaction component in two-component adhesive formulations.
  • the adhesive compositions according to the invention can be customary other auxiliaries and additives such.
  • plasticizers reactive diluents, Rheolo- pouring aids, wetting agents, anti-aging agents, stabilizers and / or color pigments.
  • adhesive or sealant matrix which according to the invention contains the inorganic solids coated with said organic molecules, in particular:
  • reaction product preparable from a difunctional amino-terminated polymer and a tri- or tetracarboxylic anhydride, characterized by an average of more than one imide group and carboxyl group per molecule, or
  • reaction product prepared from a tri- or polyfunctional polyol or a tri- or polyfunctional amino-terminated polymer and a cyclic carboxylic anhydride, wherein the reaction product contains on average more than one carboxyl group per molecule, or F) a mixture of the reaction products according to D) and E). More detailed information can be found in said WO 01/94492.
  • reaction product preparable by reacting a carboxylic anhydride or dianhydride with a di- or polyamine and a polyphenol or aminophenol
  • thermosetting structural adhesive with multiphase polymer morphology wherein the binder matrix of the cured reaction adhesive a) a continuous phase consisting of an optionally crosslinked polymer P1 having a glass transition temperature above 100 0 C, preferably above 120 0 C, b) a Heterodisperse phase consisting of individual continuous regions of a thermoplastic or elastomeric polymer P2 having a glass transition temperature of less than -30 0 C and an average particle size between 0.5 and 50 microns, which in turn separated phases of another thermoplastic or elastomeric polymer P3 having a glass transition temperature of less than -30 0 C and a size between 1 nm and 100nm, which may be partially aggregated to larger agglomerates, and c) embedded in the continuous phase further heterodisperse phase consisting of areas of a ther moplastic or elastomeric polymers P3 with a glass transition temperature of less than -30 0 C, which are at least partially
  • an epoxy component comprising a) at least one epoxy resin having an epoxy functionality greater than 1, b) at least one heat-activatable hardener for the epoxy resin,
  • the adhesive compositions according to the invention can also be used as potting compounds in the electrical or electronics industry, as a die-attach adhesive in electronics for bonding components to printed circuit boards. Further possible uses of the compositions of the invention are matrix materials for composites such. B. fiber reinforced composites.
  • compositions according to the invention both in one-component thermosetting form and in two-component form are their use as structural foam, for example for forming internal reinforcements of cavities in vehicle construction, wherein the expanding structural foams stiffen the cavity structure of the vehicle or increase its degree of energy absorption.
  • the compositions can be used for the production of so-called “stiffening pads” or for stiffening coatings of thin-walled metal sheets or plastic components, preferably in vehicle construction.
  • a very particularly preferred field of application of the adhesives according to the invention are structural bonds in vehicle construction.
  • the adhesive When used according to the invention as a structural adhesive, the adhesive is thermally cured after the connection of the metal parts at a temperature in the range of 100 to 150 0 C for a period in the range of 30 to 120 minutes.
  • the curing may be carried out for a period in the range of 50 to 70 minutes at a temperature in the range of 110 to 130 0 C.
  • curing was carried out at 120 ° C. for one hour. The optimum curing time and curing temperature depend on the particular epoxy-hardener system used and can be optimized by routine experiments.
  • the metal parts to be bonded may consist of those metals that are currently customary in automotive engineering. Examples include steel, galvanized or alloy-galvanized steel and aluminum. Also a bonding of magnesium parts is possible.
  • the metal parts to be bonded may be subjected to anticorrosive treatment prior to bonding or may have been coated with an organic primer, as is currently the practice in the art. Non-pretreated, possibly even oiled parts can also be bonded.
  • the different fillers mentioned below were coated with the following functional groups ("nucleophiles") according to the method described in WO2005 / 061631.
  • the filled fillers (and blank fillers for comparison) were mixed in different amounts (expressed in wt .-% based on the filler-containing end product) incorporated into a 2-component epoxy adhesive:

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Abstract

L'invention concerne un adhésif ou un agent d'étanchéité à base d'époxyde, comportant, par rapport à la quantité totale d'adhésif, de 5 à 30 % en poids de particules inorganiques dont la surface a été enduite par réaction avec des molécules organiques, portant au moins deux groupements fonctionnels terminaux. Selon l'invention chaque groupement fonctionnel comporte au moins un hétéroatome avec au moins une paire d'électrons libres.
EP07802377A 2006-09-08 2007-07-16 Adhésif ou agent d'étanchéité comportant des particules inorganiques modifiées Withdrawn EP2059559A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200610042796 DE102006042796A1 (de) 2006-09-08 2006-09-08 Kleb- oder Dichtstoff mit modifizierten anorganischen Partikeln
PCT/EP2007/057313 WO2008028719A1 (fr) 2006-09-08 2007-07-16 Adhésif ou agent d'étanchéité comportant des particules inorganiques modifiées

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EP2059559A1 true EP2059559A1 (fr) 2009-05-20

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DE (1) DE102006042796A1 (fr)
WO (1) WO2008028719A1 (fr)

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DE102008028638A1 (de) * 2008-06-18 2009-12-24 Henkel Ag & Co. Kgaa Kleb- und Dichtstoff oder Strukturschaum auf Epoxidbasis enthaltend anorganische Nanopartikel mit Acrylsäureester-haltiger Hülle
DE102008031555A1 (de) 2008-07-07 2010-01-14 Henkel Ag & Co. Kgaa Polymerisierbare Zusammensetzung enthaltend anorganische Partikel mit organischer Hülle
TWI595045B (zh) * 2016-09-23 2017-08-11 適用於軟硬結合板之樹脂組成物及其應用
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