EP2107592A3 - Appareil pour la production en série d'une couche mince à base de silicium et procédé de production en série d'une couche mince à base de silicium - Google Patents

Appareil pour la production en série d'une couche mince à base de silicium et procédé de production en série d'une couche mince à base de silicium Download PDF

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Publication number
EP2107592A3
EP2107592A3 EP09250883A EP09250883A EP2107592A3 EP 2107592 A3 EP2107592 A3 EP 2107592A3 EP 09250883 A EP09250883 A EP 09250883A EP 09250883 A EP09250883 A EP 09250883A EP 2107592 A3 EP2107592 A3 EP 2107592A3
Authority
EP
European Patent Office
Prior art keywords
based thin
thin film
silicon
mass
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09250883A
Other languages
German (de)
English (en)
Other versions
EP2107592A2 (fr
Inventor
Minoru Imaeda
Yuichiro Imanishi
Takao Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of EP2107592A2 publication Critical patent/EP2107592A2/fr
Publication of EP2107592A3 publication Critical patent/EP2107592A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32018—Glow discharge
    • H01J37/32027—DC powered
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32018—Glow discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32018—Glow discharge
    • H01J37/32045—Circuits specially adapted for controlling the glow discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Plasma Technology (AREA)
  • Photovoltaic Devices (AREA)
EP09250883A 2008-03-31 2009-03-27 Appareil pour la production en série d'une couche mince à base de silicium et procédé de production en série d'une couche mince à base de silicium Withdrawn EP2107592A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008091403 2008-03-31

Publications (2)

Publication Number Publication Date
EP2107592A2 EP2107592A2 (fr) 2009-10-07
EP2107592A3 true EP2107592A3 (fr) 2012-01-25

Family

ID=40873485

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09250883A Withdrawn EP2107592A3 (fr) 2008-03-31 2009-03-27 Appareil pour la production en série d'une couche mince à base de silicium et procédé de production en série d'une couche mince à base de silicium

Country Status (3)

Country Link
US (1) US7927982B2 (fr)
EP (1) EP2107592A3 (fr)
JP (2) JP5455405B2 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5443127B2 (ja) * 2009-10-28 2014-03-19 東京エレクトロン株式会社 プラズマ処理装置
CN101859801B (zh) * 2010-06-11 2013-02-20 深圳市创益科技发展有限公司 薄膜太阳能电池沉积用放电电极板阵列
JP2016502588A (ja) * 2012-10-09 2016-01-28 ユーロブラズマ エンヴェー 表面コーティングを塗布する装置及び方法
CN105070783B (zh) * 2015-07-16 2018-08-24 奥特斯维能源（太仓）有限公司 一种用于高温扩散炉的喷淋管及其应用
CN109065433A (zh) * 2018-08-16 2018-12-21 东华大学 一种常压脉冲辅助平板射频辉光放电的装置与方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3723865A1 (de) * 1986-07-18 1988-01-28 Sando Iron Works Co Reaktor fuer eine plasmabehandlung
US20020056415A1 (en) * 1999-01-29 2002-05-16 Sharp Kabushiki Kaisha Apparatus and method for production of solar cells
EP1376868A2 (fr) * 2002-06-12 2004-01-02 Ngk Insulators, Ltd. Circuit générateur d'impulsions à tension élevée
US20070175587A1 (en) * 2006-01-20 2007-08-02 Ngk Insulators, Ltd. Method of generating discharge plasma
EP2107593A2 (fr) * 2008-03-31 2009-10-07 NGK Insulators, Ltd. Appareil pour déposer une couche mince à base de silicium et procédé pour déposer une couche mince à base de silicium

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2708864B2 (ja) * 1989-03-22 1998-02-04 富士電機 株式会社 非晶質半導体の生成方法
JP3420960B2 (ja) 1999-01-29 2003-06-30 シャープ株式会社 電子デバイス製造装置および電子デバイス製造方法
JP3560134B2 (ja) * 1999-03-08 2004-09-02 富士電機ホールディングス株式会社 薄膜半導体の製造装置
JP2002151508A (ja) * 2000-11-15 2002-05-24 Sekisui Chem Co Ltd 半導体素子の製造方法及びその装置
JP4738724B2 (ja) * 2003-02-18 2011-08-03 日本碍子株式会社 薄膜の製造方法
JP2004259853A (ja) * 2003-02-25 2004-09-16 Kanegafuchi Chem Ind Co Ltd 結晶質シリコン系薄膜光電変換装置の製造装置及び製造方法
JP2008004814A (ja) * 2006-06-23 2008-01-10 Sharp Corp プラズマ処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3723865A1 (de) * 1986-07-18 1988-01-28 Sando Iron Works Co Reaktor fuer eine plasmabehandlung
US20020056415A1 (en) * 1999-01-29 2002-05-16 Sharp Kabushiki Kaisha Apparatus and method for production of solar cells
EP1376868A2 (fr) * 2002-06-12 2004-01-02 Ngk Insulators, Ltd. Circuit générateur d'impulsions à tension élevée
US20070175587A1 (en) * 2006-01-20 2007-08-02 Ngk Insulators, Ltd. Method of generating discharge plasma
EP2107593A2 (fr) * 2008-03-31 2009-10-07 NGK Insulators, Ltd. Appareil pour déposer une couche mince à base de silicium et procédé pour déposer une couche mince à base de silicium

Also Published As

Publication number Publication date
EP2107592A2 (fr) 2009-10-07
US7927982B2 (en) 2011-04-19
JP2013258412A (ja) 2013-12-26
US20090246943A1 (en) 2009-10-01
JP2009267383A (ja) 2009-11-12
JP5732491B2 (ja) 2015-06-10
JP5455405B2 (ja) 2014-03-26

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