EP2126159A4 - Solution de galvanisation à base d'étain et de bore (sn-b) et procédé de galvanisation mettant en uvre une telle solution - Google Patents

Solution de galvanisation à base d'étain et de bore (sn-b) et procédé de galvanisation mettant en uvre une telle solution

Info

Publication number
EP2126159A4
EP2126159A4 EP07860736A EP07860736A EP2126159A4 EP 2126159 A4 EP2126159 A4 EP 2126159A4 EP 07860736 A EP07860736 A EP 07860736A EP 07860736 A EP07860736 A EP 07860736A EP 2126159 A4 EP2126159 A4 EP 2126159A4
Authority
EP
European Patent Office
Prior art keywords
plating
solution
plating solution
plating method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07860736A
Other languages
German (de)
English (en)
Other versions
EP2126159A1 (fr
Inventor
Dong-Nyung Lee
Sang-Beom Kim
Kyoo-Sik Kang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Iljin Copper Foil Co Ltd
Original Assignee
Iljin Copper Foil Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iljin Copper Foil Co Ltd filed Critical Iljin Copper Foil Co Ltd
Publication of EP2126159A1 publication Critical patent/EP2126159A1/fr
Publication of EP2126159A4 publication Critical patent/EP2126159A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
    • C25C3/00—Electrolytic production, recovery or refining of metals by electrolysis of melts
    • C25C3/30—Electrolytic production, recovery or refining of metals by electrolysis of melts of manganese
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
EP07860736A 2006-12-29 2007-12-28 Solution de galvanisation à base d'étain et de bore (sn-b) et procédé de galvanisation mettant en uvre une telle solution Withdrawn EP2126159A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20060138526 2006-12-29
KR1020070139768A KR101016415B1 (ko) 2006-12-29 2007-12-28 전기 도금용 Ｓｎ-Ｂ 도금액 및 이를 이용한 Ｓｎ-Ｂ 전기 도금 방법
PCT/KR2007/006952 WO2008082192A1 (fr) 2006-12-29 2007-12-28 Solution de galvanisation à base d'étain et de bore (sn-b) et procédé de galvanisation mettant en œuvre une telle solution

Publications (2)

Publication Number Publication Date
EP2126159A1 EP2126159A1 (fr) 2009-12-02
EP2126159A4 true EP2126159A4 (fr) 2010-06-02

Family

ID=39815105

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07860736A Withdrawn EP2126159A4 (fr) 2006-12-29 2007-12-28 Solution de galvanisation à base d'étain et de bore (sn-b) et procédé de galvanisation mettant en uvre une telle solution

Country Status (7)

Country Link
US (1) US20100038255A1 (fr)
EP (1) EP2126159A4 (fr)
JP (1) JP5033197B2 (fr)
KR (1) KR101016415B1 (fr)
CN (1) CN101595248B (fr)
TW (1) TWI386523B (fr)
WO (1) WO2008082192A1 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9017528B2 (en) 2011-04-14 2015-04-28 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US9005409B2 (en) 2011-04-14 2015-04-14 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US10072347B2 (en) * 2012-07-31 2018-09-11 The Boeing Company Systems and methods for tin antimony plating
US9303329B2 (en) 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management
CN105908227A (zh) * 2016-06-03 2016-08-31 河海大学 一种提高Ni-B合金耐蚀耐磨性能的CMMA结构电化学制备方法
CN106011955A (zh) * 2016-06-03 2016-10-12 河海大学 一种海工机械耐蚀耐磨Ni-W/Al2O3 CMMA防护层及其制备方法
CN105887148A (zh) * 2016-06-03 2016-08-24 河海大学 一种海洋装备用Ni-B/SiC CMMA涂层及其制备方法
CN106011956A (zh) * 2016-06-03 2016-10-12 河海大学 一种提高Ni-W合金耐蚀性的CMMA结构电化学制备方法
CN105908228A (zh) * 2016-06-03 2016-08-31 河海大学 一种镍合金cmma镀层及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB842826A (en) * 1957-11-15 1960-07-27 Du Pont Improvements in or relating to chemical plating
US3063850A (en) * 1959-09-11 1962-11-13 Metal Hydrides Inc Metal plating by chemical reduction with amine boranes
GB1502057A (en) * 1975-07-15 1978-02-22 Sumitomo Electric Industries Tin electro-plating solution
JP2005002368A (ja) * 2003-06-09 2005-01-06 Ishihara Chem Co Ltd ホイスカー防止用スズメッキ浴
EP1566855A1 (fr) * 2002-11-29 2005-08-24 Mitsui Mining & Smelting Co., Ltd. Electrode negative pour element d'accumulateur secondaire a electrolyte non aqueux et procede de fabrication de cet electrode, et element d'accumulateur secondaire a electrolyte non aqueux

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US4955909A (en) * 1989-01-31 1990-09-11 Bioplasty, Inc. Textured silicone implant prosthesis
US5207709A (en) * 1991-11-13 1993-05-04 Picha George J Implant with textured surface
CN1094099A (zh) * 1994-03-24 1994-10-26 天津大学 一种酸性镀锡的方法
KR100223320B1 (ko) 1996-03-06 1999-10-15 이계철 전기접점용 주석-납 합금도금 제조방법
GB9805214D0 (en) * 1998-03-11 1998-05-06 Univ Glasgow Cell adhesion
KR100392528B1 (ko) 1998-09-11 2003-07-23 닛코 킨조쿠 가부시키가이샤 금속재료, 금속재료의 제조방법 및 금속재료를 이용한 단자 및 커넥터
JP2000144482A (ja) * 1998-09-11 2000-05-26 Nippon Mining & Metals Co Ltd 金属材料
JP2000169997A (ja) * 1998-09-28 2000-06-20 Nippon Mining & Metals Co Ltd 金属材料
JP2000169996A (ja) * 1998-09-28 2000-06-20 Nippon Mining & Metals Co Ltd 金属材料
JP4489232B2 (ja) * 1999-06-14 2010-06-23 日鉱金属株式会社 コネクタ用めっき材料
JP4698904B2 (ja) * 2001-09-20 2011-06-08 株式会社大和化成研究所 錫又は錫系合金めっき浴、該めっき浴の建浴用又は維持・補給用の錫塩及び酸又は錯化剤溶液並びに該めっき浴を用いて製作した電気・電子部品
JP3513709B2 (ja) * 2001-10-16 2004-03-31 石原薬品株式会社 前処理によるスズホイスカーの防止方法
US6860981B2 (en) * 2002-04-30 2005-03-01 Technic, Inc. Minimizing whisker growth in tin electrodeposits
JP2004204308A (ja) * 2002-12-25 2004-07-22 Nec Semiconductors Kyushu Ltd 鉛フリー錫合金めっき方法
US7332193B2 (en) * 2004-10-18 2008-02-19 Enthone, Inc. Cobalt and nickel electroless plating in microelectronic devices
ES2354045T3 (es) * 2005-02-28 2011-03-09 Rohm And Haas Electronic Materials, Llc Procedimientos con fundente mejorados.
US20080275546A1 (en) * 2007-05-03 2008-11-06 Chameleon Scientific Corp Inhibitory cell adhesion surfaces

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB842826A (en) * 1957-11-15 1960-07-27 Du Pont Improvements in or relating to chemical plating
US3063850A (en) * 1959-09-11 1962-11-13 Metal Hydrides Inc Metal plating by chemical reduction with amine boranes
GB1502057A (en) * 1975-07-15 1978-02-22 Sumitomo Electric Industries Tin electro-plating solution
EP1566855A1 (fr) * 2002-11-29 2005-08-24 Mitsui Mining & Smelting Co., Ltd. Electrode negative pour element d'accumulateur secondaire a electrolyte non aqueux et procede de fabrication de cet electrode, et element d'accumulateur secondaire a electrolyte non aqueux
JP2005002368A (ja) * 2003-06-09 2005-01-06 Ishihara Chem Co Ltd ホイスカー防止用スズメッキ浴

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
H. SHIMAUSCHI AND AL: "Preparation of Ni-Sn alloys by electroless-deposition method", JOURNAL OF ELECTROCHEMICAL SOCIETY, vol. 141, no. 6, 1 June 1994 (1994-06-01), pages 1471 - 1476, XP002579875 *
MORDECHAY SCLESINGER AND MILAN PAUNOVIC: "Modern electroplating (fouth edition)", 1 February 2000, JOHN WILEY § SONS, article YUN ZHANG AND JOSEPH A. ABYS: "Tin and Tin alloys for lead-free solder", pages: 247 - 261, XP002579876 *
See also references of WO2008082192A1 *

Also Published As

Publication number Publication date
KR101016415B1 (ko) 2011-02-21
JP5033197B2 (ja) 2012-09-26
TW200928006A (en) 2009-07-01
TWI386523B (zh) 2013-02-21
CN101595248B (zh) 2011-04-27
EP2126159A1 (fr) 2009-12-02
JP2010514932A (ja) 2010-05-06
KR20080063177A (ko) 2008-07-03
WO2008082192A1 (fr) 2008-07-10
CN101595248A (zh) 2009-12-02
US20100038255A1 (en) 2010-02-18

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