EP2135281A4 - Dissipation thermique dans des substrats de puce - Google Patents

Dissipation thermique dans des substrats de puce

Info

Publication number
EP2135281A4
EP2135281A4 EP08744555A EP08744555A EP2135281A4 EP 2135281 A4 EP2135281 A4 EP 2135281A4 EP 08744555 A EP08744555 A EP 08744555A EP 08744555 A EP08744555 A EP 08744555A EP 2135281 A4 EP2135281 A4 EP 2135281A4
Authority
EP
European Patent Office
Prior art keywords
substrate
microchip
opening
thermal dissipation
chip substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08744555A
Other languages
German (de)
English (en)
Other versions
EP2135281A1 (fr
Inventor
Iyad Alhayek
Gerry Bianco
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aumovio Systems Inc
Original Assignee
Temic Automotive of North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temic Automotive of North America Inc filed Critical Temic Automotive of North America Inc
Publication of EP2135281A1 publication Critical patent/EP2135281A1/fr
Publication of EP2135281A4 publication Critical patent/EP2135281A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP08744555A 2007-03-29 2008-03-28 Dissipation thermique dans des substrats de puce Withdrawn EP2135281A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/693,280 US8373266B2 (en) 2007-03-29 2007-03-29 Heat sink mounted on a vehicle-transmission case
PCT/US2008/058597 WO2008121780A1 (fr) 2007-03-29 2008-03-28 Dissipation thermique dans des substrats de puce

Publications (2)

Publication Number Publication Date
EP2135281A1 EP2135281A1 (fr) 2009-12-23
EP2135281A4 true EP2135281A4 (fr) 2010-06-02

Family

ID=39792262

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08744555A Withdrawn EP2135281A4 (fr) 2007-03-29 2008-03-28 Dissipation thermique dans des substrats de puce

Country Status (5)

Country Link
US (1) US8373266B2 (fr)
EP (1) EP2135281A4 (fr)
JP (1) JP2010523005A (fr)
KR (1) KR101489699B1 (fr)
WO (1) WO2008121780A1 (fr)

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US7982307B2 (en) * 2006-11-22 2011-07-19 Agere Systems Inc. Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate
US9193466B2 (en) * 2012-07-13 2015-11-24 Mra Systems, Inc. Aircraft ice protection system and method
KR101950976B1 (ko) * 2012-10-25 2019-02-25 에스케이하이닉스 주식회사 반도체 패키지
JP6380027B2 (ja) * 2014-11-13 2018-08-29 株式会社デンソー 電子装置
US9826574B2 (en) * 2015-10-28 2017-11-21 Watlow Electric Manufacturing Company Integrated heater and sensor system
KR102376939B1 (ko) 2020-04-23 2022-03-18 이근형 고선명 오프셋 인쇄시트 및 이의 제조 방법
WO2024014911A1 (fr) * 2022-07-13 2024-01-18 삼성전자 주식회사 Dispositif électronique comprenant une pluralité de cartes de circuit imprimé

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EP1530234A2 (fr) * 2003-11-04 2005-05-11 Delphi Technologies, Inc. Boítier pour un dispositif de puissance muni d'un dissipateur thermique
US20060084254A1 (en) * 2004-01-06 2006-04-20 Attarwala Abbas I Method for making electronic packages

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Publication number Priority date Publication date Assignee Title
EP1122786A2 (fr) * 2000-02-04 2001-08-08 Lucent Technologies Inc. Boítier à multi-puces à haute performance
US20050056942A1 (en) * 2003-09-15 2005-03-17 International Business Machines Corporation Method of fabricating integrated electronic chip with an interconnect device
EP1530234A2 (fr) * 2003-11-04 2005-05-11 Delphi Technologies, Inc. Boítier pour un dispositif de puissance muni d'un dissipateur thermique
US20060084254A1 (en) * 2004-01-06 2006-04-20 Attarwala Abbas I Method for making electronic packages

Non-Patent Citations (2)

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Title
No further relevant documents disclosed *
See also references of WO2008121780A1 *

Also Published As

Publication number Publication date
KR101489699B1 (ko) 2015-02-04
KR20090130087A (ko) 2009-12-17
US8373266B2 (en) 2013-02-12
JP2010523005A (ja) 2010-07-08
WO2008121780A1 (fr) 2008-10-09
EP2135281A1 (fr) 2009-12-23
US20080236782A1 (en) 2008-10-02

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