EP2143048A2 - Chipkarte mit doppelter kommunikationsschnittstelle - Google Patents

Chipkarte mit doppelter kommunikationsschnittstelle

Info

Publication number
EP2143048A2
EP2143048A2 EP08787875A EP08787875A EP2143048A2 EP 2143048 A2 EP2143048 A2 EP 2143048A2 EP 08787875 A EP08787875 A EP 08787875A EP 08787875 A EP08787875 A EP 08787875A EP 2143048 A2 EP2143048 A2 EP 2143048A2
Authority
EP
European Patent Office
Prior art keywords
module
antenna
card
card body
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08787875A
Other languages
English (en)
French (fr)
Inventor
Philippe Patrice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Smart Packaging Solutions SAS
Original Assignee
Smart Packaging Solutions SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions SAS filed Critical Smart Packaging Solutions SAS
Publication of EP2143048A2 publication Critical patent/EP2143048A2/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making

Definitions

  • This structure will improve the performance of the final card, and increase manufacturing efficiencies. It should be noted that in this configuration, no electrical interconnection between the electronic module and this amplification device is to be performed, which makes it possible to retain all the advantages relating to the reliability of the module's collage processes used to contact cards.
  • a good module (tested as such) is inserted in a good map, without the step of sticking the module, well controlled in itself, is likely to deliver Significantly, the manufacturing yield, which therefore has a gain of the order of 10-15% compared to known methods, with a similar gain on the manufacturing cost. While in the method according to the state of the art, if the connection test module is wrong, we will have lost two good chips during this manufacturing step.
  • this device for concentrating and / or amplifying the electromagnetic waves is constituted by a metal sheet disposed in the card body under the cavity receiving the microelectronic module. Those skilled in the art will have no difficulty in sizing this metal sheet according to the desired performance.
  • This module structure has the advantage of minimizing or even eliminating the electromagnetic shielding effects of the contacts 4 with respect to the turns 13 of the antenna.
  • FIG 4 which shows in section A-A of Figure 2, the structure of the smart card according to the invention.
  • the module 11 has been represented in this figure with its substrate 15, carrying the first chip 9 dedicated to contact operation, and which is therefore connected to the terminal block of electrical connections 4.
  • the module 11 also carries the second chip 10, which is connected to the antenna 13 of the module and which is therefore dedicated to non-contact operation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)
  • Details Of Aerials (AREA)
EP08787875A 2007-03-29 2008-03-28 Chipkarte mit doppelter kommunikationsschnittstelle Withdrawn EP2143048A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0702299A FR2915011B1 (fr) 2007-03-29 2007-03-29 Carte a puce a double interface de communication
PCT/FR2008/000435 WO2008142245A2 (fr) 2007-03-29 2008-03-28 Carte à puce à double interface de communication

Publications (1)

Publication Number Publication Date
EP2143048A2 true EP2143048A2 (de) 2010-01-13

Family

ID=38610900

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08787875A Withdrawn EP2143048A2 (de) 2007-03-29 2008-03-28 Chipkarte mit doppelter kommunikationsschnittstelle

Country Status (9)

Country Link
US (1) US8317108B2 (de)
EP (1) EP2143048A2 (de)
JP (1) JP2010522919A (de)
KR (1) KR101494916B1 (de)
BR (1) BRPI0809495A2 (de)
FR (1) FR2915011B1 (de)
MX (1) MX2009010433A (de)
MY (1) MY151844A (de)
WO (1) WO2008142245A2 (de)

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WO2010066955A1 (fr) 2008-12-11 2010-06-17 Yves Eray Circuit d'antenne rfid
US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
US8366009B2 (en) * 2010-08-12 2013-02-05 Féinics Amatech Teoranta Coupling in and to RFID smart cards
FR2963137B1 (fr) * 2010-07-20 2016-02-19 Oberthur Technologies Insert a transpondeur et dispositif comprenant un tel insert
US8991712B2 (en) 2010-08-12 2015-03-31 Féinics Amatech Teoranta Coupling in and to RFID smart cards
US8870080B2 (en) 2010-08-12 2014-10-28 Féinics Amatech Teoranta RFID antenna modules and methods
US9195932B2 (en) 2010-08-12 2015-11-24 Féinics Amatech Teoranta Booster antenna configurations and methods
US8789762B2 (en) 2010-08-12 2014-07-29 Feinics Amatech Teoranta RFID antenna modules and methods of making
WO2012020073A2 (en) 2010-08-12 2012-02-16 Féinics Amatech Teoranta Limited Rfid antenna modules and increasing coupling
US9112272B2 (en) 2010-08-12 2015-08-18 Feinics Amatech Teoranta Antenna modules for dual interface smart cards, booster antenna configurations, and methods
US9033250B2 (en) 2010-08-12 2015-05-19 Féinics Amatech Teoranta Dual interface smart cards, and methods of manufacturing
EP2426627B1 (de) * 2010-09-02 2016-10-12 Oberthur Technologies Leuchtmodul für Mikroschaltungsvorrichtung
FR2964487B1 (fr) * 2010-09-02 2013-07-12 Oberthur Technologies Carte a microcircuit comprenant un moyen lumineux
EP2525304A1 (de) 2011-05-17 2012-11-21 Gemalto SA Funkfrequenz-Transpondervorrichtung mit optimiertem passivem Resonanzkreis
USD686214S1 (en) * 2011-07-28 2013-07-16 Lifenexus, Inc. Smartcard with iChip contact pad
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US10867235B2 (en) 2011-08-08 2020-12-15 Féinics Amatech Teoranta Metallized smartcard constructions and methods
KR20140082647A (ko) 2011-08-08 2014-07-02 페이닉스 아마테크 테오란타 Ｒｆｉｄ 스마트 카드에서/에 대한 커플링 개선
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US9390364B2 (en) 2011-08-08 2016-07-12 Féinics Amatech Teoranta Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
CN103907125A (zh) 2011-08-08 2014-07-02 菲尼克斯阿美特克有限公司 改进rfid智能卡中的耦合和与rfid智能卡的耦合
KR20140071423A (ko) 2011-09-11 2014-06-11 페이닉스 아마테크 테오란타 Ｒｆｉｄ 안테나 모듈 및 그 제조 방법
BR112014018042A8 (pt) 2012-01-23 2017-07-11 Feinics Amatech Teoranta Deslocando blindagem e aprimorando acoplamento em cartões inteligentes metalizados
CN104137335A (zh) 2012-02-05 2014-11-05 菲尼克斯阿美特克有限公司 Rfid天线模块和方法
FR2996944B1 (fr) * 2012-10-15 2018-05-04 Smart Packaging Solutions Sps Module electronique simplifie pour carte a puce a double interface de communication
US11551051B2 (en) 2013-01-18 2023-01-10 Amatech Group Limiied Coupling frames for smartcards with various module opening shapes
US11354560B2 (en) 2013-01-18 2022-06-07 Amatech Group Limited Smartcards with multiple coupling frames
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
US10599972B2 (en) * 2013-01-18 2020-03-24 Féinics Amatech Teoranta Smartcard constructions and methods
US11928537B2 (en) 2013-01-18 2024-03-12 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
US11341389B2 (en) 2013-01-18 2022-05-24 Amatech Group Limited Manufacturing metal inlays for dual interface metal cards
WO2014191123A1 (en) 2013-05-28 2014-12-04 Féinics Amatech Teoranta Antenna modules for dual interface smartcards, booster antenna configurations, and methods
ES3007784T3 (en) 2013-11-13 2025-03-20 Feinics Amatech Teoranta Smartcard with coupling frame and method of increasing activation distance of a transponder chip module
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
WO2015144261A1 (en) * 2014-03-26 2015-10-01 Féinics Amatech Teoranta Transponder chip module with coupling frame on a common substrate for secure and non-secure smartcards and tags
US10381707B2 (en) * 2016-02-04 2019-08-13 Advantest Corporation Multiple waveguide structure with single flange for automatic test equipment for semiconductor testing
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Also Published As

Publication number Publication date
BRPI0809495A2 (pt) 2014-09-23
JP2010522919A (ja) 2010-07-08
US8317108B2 (en) 2012-11-27
FR2915011B1 (fr) 2009-06-05
MY151844A (en) 2014-07-14
US20100176205A1 (en) 2010-07-15
MX2009010433A (es) 2010-09-14
WO2008142245A2 (fr) 2008-11-27
FR2915011A1 (fr) 2008-10-17
KR101494916B1 (ko) 2015-03-02
KR20100022453A (ko) 2010-03-02
WO2008142245A3 (fr) 2009-01-29

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