EP2177312B1 - Tampon à polir mécanique et chimique ayant une fenêtre avec fonction d'identification intégrale - Google Patents

Tampon à polir mécanique et chimique ayant une fenêtre avec fonction d'identification intégrale Download PDF

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Publication number
EP2177312B1
EP2177312B1 EP09155069A EP09155069A EP2177312B1 EP 2177312 B1 EP2177312 B1 EP 2177312B1 EP 09155069 A EP09155069 A EP 09155069A EP 09155069 A EP09155069 A EP 09155069A EP 2177312 B1 EP2177312 B1 EP 2177312B1
Authority
EP
European Patent Office
Prior art keywords
polishing
chemical mechanical
window
identification feature
mechanical polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP09155069A
Other languages
German (de)
English (en)
Other versions
EP2177312A1 (fr
Inventor
Mary Jo Kulp
Ethan Scott Simon
Darrell String
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/252,820 external-priority patent/US8118644B2/en
Priority claimed from US12/397,535 external-priority patent/US8118641B2/en
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of EP2177312A1 publication Critical patent/EP2177312A1/fr
Application granted granted Critical
Publication of EP2177312B1 publication Critical patent/EP2177312B1/fr
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face

Definitions

  • Figure 4 is a cross sectional cut away view of a chemical mechanical polishing pad of the present invention.
  • polishing medium encompasses particle-containing polishing solutions and non-particle-containing solutions, such as abrasive-free and reactive-liquid polishing solutions.
  • Non-color indicia suitable for use with the present invention are observable through the window at the polishing face throughout the useful life of the chemical mechanical polishing pad.
  • the non-color indicia is a two-dimensional shape or outline selected from a polygon, a reuleaux polygon, a circle, an oval, an ellipse, a lens, a lune, a superellipse, a squoval, a squircle, a quartic plane curve and a symbol.
  • the chemical mechanical polishing pad further comprises a central axis 12, wherein the chemical mechanical polishing pad is adapted for rotation about the central axis 12.
  • the polishing layer 10 is in a plane substantially perpendicular to the central axis 12 (i.e., ⁇ 10° from perpendicular).
  • the polishing layer 10 is adapted for rotation in a plane that is at an angle, ⁇ , of 85 to 95° to the central axis 12, more preferably of 90° from the central axis 12.
  • the polishing layer 10 has a polishing surface 14 that has a substantially circular cross section perpendicular to the central axis 12.
  • the longest radius, r, for a cross section of the polishing surface 14 perpendicular to the central axis 12 is preferably ⁇ 20% longer than the shortest radius, r, for the cross section.
  • the integral identification feature 30 is applied to or incorporated in at least a portion of the window 20. (see, e.g., Figure 6 ).
  • the integral identification feature 30 comprises a color based indicia 32.
  • the color based indicia 32 is not present at the polishing surface 42 of the polishing layer 40 or the polishing face 22 of the window 20.
  • the method of making the chemical mechanical polishing pad of the present invention having a window with an integral identification feature further comprises providing an intervening layer having an aperture and a subpad having an aperture, wherein the intervening layer is interposed between the polishing layer and the subpad.
  • the polishing layer, the intervening layer and the subpad are interfaced using at least one stack adhesive.
  • the at least one stack adhesive is selected from a pressure sensitive adhesive, a contact adhesive and a reactive hot melt adhesive.
  • the aperture in the intervening layer has a cross sectional area parallel to and smaller than the cross sectional area of the polishing face of the window and the integral identification feature is applied to or incorporated in at least a portion of the intervening layer adjacent to the aperture, wherein the integral identification feature is observable through the window at the polishing face.
  • the aperture in the intervening layer has a cross sectional area parallel to and smaller than the cross sectional area of the polishing face of the window and the integral identification feature is applied to or incorporated in at least a portion of (i) the stack adhesive interposed between the intervening layer and the polishing layer, or (ii) the stack adhesive interposed between the intervening layer and the subpad; wherein the integral identification feature is observable through the window at the polishing face.
  • the integral identification feature comprises a color based indicia observable through the window at the polishing face.
  • the color based indicia comprises a colorant that does not interfere with effective endpoint detection.
  • the window used in the methods of the invention can be selected from integral windows and plug-in-place windows.
  • a method of making the chemical mechanical polishing pad of the present invention having a plug-in-place window with an integral identification feature comprises: providing a chemical mechanical polishing layer with a polishing surface and an aperture, providing a subpad having an aperture; providing a plug-in-place window for endpoint detection, having a polishing face and a nonpolishing face; providing an integral identification feature; and, interfacing the plug-in-place window with the subpad such that the integral identification feature is observable through the plug-in-place window at the polishing face; wherein the polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate.
  • the integral identification feature comprises a color based indicia observable through the plug-in-place window at the polishing face.
  • the color based indicia comprises a colorant that does not interfere with effective endpoint detection.
  • the method of making the chemical mechanical polishing pad of the present invention having a plug-in-place window with an integral identification feature further comprises applying an integral identification feature to or incorporating an integral identification feature in at least a portion of the plug-in-place window.
  • the portion of the window to which the integral identification feature is applied does not include the polishing face.
  • the integral identification feature is applied to the nonpolishing face of the plug-in-place window.
  • the integral identification feature is applied to or incorporated in at least a portion of the plug-in-place window before it is interfaced with another component of the chemical mechanical polishing pad (e.g., the polishing layer, the subpad, an intervening layer, an adhesive).
  • the integral identification feature is applied to or incorporated in at least a portion of the plug-in-place window after it is interfaced with another component of the chemical mechanical polishing pad.
  • the aperture in the subpad has a cross sectional area parallel to and smaller than the cross sectional area of at least a slice of the plug-in-place window at or between the polishing face and the nonpolishing face and the integral identification feature is applied to or incorporated in at least a portion of the subpad adjacent to the aperture, wherein the integral identification feature is observable through the plug-in-place window at the polishing face.
  • the aperture in the intervening layer has a cross sectional area parallel to and smaller than the cross sectional area of at least a slice of the plug-in-place window at or between the polishing face and the nonpolishing face and the integral identification feature is applied to or incorporated in at least a portion of the intervening layer adjacent to the aperture, wherein the integral identification feature is observable through the window at the polishing face.
  • the method for chemical mechanical polishing of a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate comprises: providing a chemical mechanical polishing apparatus having a platen; providing at least one substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate; providing at least two polishing operations; providing a plurality of types of chemical mechanical polishing pads having a window; wherein each type of chemical mechanical polishing pad has different polishing properties and an integral identification feature to distinguish each type of chemical mechanical polishing pad from the other types of chemical mechanical polishing pads in the plurality of types; wherein the integral identification feature is non-polish active; optionally, wherein the integral identification feature comprises a color based indicia; and, optionally, wherein the integral identification feature is selected to be observable through the window and to uniquely identify each type of chemical mechanical polishing pad in the plurality of types; providing at least two polishing recipes, wherein each polishing recipe corresponds to one of the at least two polishing operations and wherein each polishing recipe includes an identification of the integral identification feature associated with the type
  • the method may optionally further comprise: selecting a subsequent polishing operation from the at least two polishing operations ("the subsequent polishing operation") and a corresponding subsequent polishing recipe ("the subsequent recipe”); installing onto the platen the type of chemical mechanical polishing pad identified in the subsequent recipe ("the subsequently installed polishing pad”); observing the integral identification feature of the subsequently installed polishing pad and verifying that it corresponds with that identified in the subsequent recipe; and performing the subsequent polishing operation on the at least one substrate.
  • the multiple polishing operations can be performed using a single chemical mechanical polishing apparatus, wherein the multiple polishing operations are performed on the same substrate using at least two different types of chemical mechanical polishing pads (e.g., multiple polishing operations on a given semiconductor wafer).
  • the method for chemical mechanical polishing of a substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate comprises: providing a chemical mechanical polishing apparatus having a platen; providing at least one substrate selected from a magnetic substrate, an optical substrate and a semiconductor substrate; providing at least two polishing operations; providing at least two types of chemical mechanical polishing pads having a window, wherein each type of chemical mechanical polishing pad has different polishing properties and an integral identification feature, wherein the integral identification feature is nonpolish active, wherein the integral identification feature comprises a color based indicia, wherein the color based indicia is selected to be observable through the window and to uniquely identify each type of chemical mechanical polishing pad in the plurality of types, and wherein the color based indicia is unique for each type of chemical mechanical polishing pad in the plurality of types; providing at least two polishing recipes, wherein each polishing recipe corresponds to one of the at least two polishing operations and wherein each polishing recipe includes an identification of the integral identification feature for the type of

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Claims (10)

  1. Feutre de polissage mécano-chimique pour polir un substrat choisi parmi un substrat magnétique, un substrat optique et un substrat semi-conducteur ; comprenant :
    une couche de polissage (10 ; 40 ; 140) ayant une surface de polissage (14 ; 42 ; 142) adaptée pour polir le substrat, une fenêtre (16; 20 ; 120) et une caractéristique d'identification intégrale (11 ; 30) ; et
    où la fenêtre (16 ; 20 ; 120) a une face de polissage (22 ; 122) et une face de non polissage (24 ; 124), où la caractéristique d'identification intégrale (11 ; 30) est observable à travers la fenêtre (16 ; 20 ; 120), où la caractéristique d'identification intégrale (11 ; 30) identifie le feutre de polissage mécano-chimique comme un type de feutre de polissage mécano-chimique choisi parmi une pluralité de types de feutres de polissage mécano-chimique.
  2. Feutre de polissage mécano-chimique selon la revendication 1 où la caractéristique d'identification intégrale (11 ; 30) n'est pas incorporée dans la couche de polissage.
  3. Feutre de polissage mécano-chimique selon la revendication 1 où la caractéristique d'identification intégrale (11 ; 30) comprend un indice à base de couleur (32) appliqué à une partie d'identification de la face de non polissage (24 ; 124) de la fenêtre (16 ; 20 ; 120).
  4. Feutre de polissage mécano-chimique selon la revendication 1 où la fenêtre (16 ; 20 ; 120) est choisie parmi une fenêtre mise en place et une fenêtre intégrale.
  5. Procédé de production du feutre de polissage mécano-chimique ayant une fenêtre (16 ; 20 ; 120) avec une caractéristique d'identification intégrale (11 ; 30), comprenant :
    la fourniture d'une couche de polissage (10 ; 40 ; 140) avec une surface de polissage (14 ; 42 ; 142) et une fenêtre (16 ; 20 ; 120), où la fenêtre (16 ; 20 ; 120) a une face de polissage (22 ; 122) et une face de non plissage (24 ; 124) et où la face de polissage (22 ; 122) est parallèle à la surface de polissage (14 ; 42 ; 142) ;
    la fourniture d'une caractéristique d'identification intégrale (11; 30) ; et
    la liaison de la caractéristique d'identification intégrale (11 ; 30) avec la couche de polissage (10 ; 40 ; 140) ;
    où la caractéristique d'identification intégrale (11 ; 30) est observable à travers la fenêtre (16 ; 20 ; 120) au niveau de la face de polissage (22 ; 122) ; et
    où la surface de polissage (14 ; 42 ; 142) est adaptée pour polir le substrat.
  6. Procédé selon la revendication 5 où la caractéristique d'identification intégrale (11 ; 30) comprend un indice à base de couleur (32) appliqué à une partie de la face de non polissage (22 ; 122) de la fenêtre (16 ; 20 ; 120).
  7. Procédé selon la revendication 5 comprenant en outre :
    la fourniture d'un sous-feutre (60 ; 160) ayant une ouverture (62 ; 162) ; et
    la liaison du sous-feutre (60 ; 160) et de la couche de polissage (10 ; 40 ; 140).
  8. Procédé selon la revendication 7 où l'ouverture (62 ; 162) est dimensionnellement plus petite que la face de polissage (22 ; 122) de la fenêtre (16 ; 20 ; 120) ; où la caractéristique d'identification intégrale (11 ; 30) comprend un indice à base de couleur (32) appliqué à une partie du sous-feutre (60 ; 160) adjacente à l'ouverture (62 ; 162).
  9. Procédé selon la revendication 5 où la fenêtre (16 ; 20 ; 120) est choisie parmi une fenêtre intégrale et une fenêtre mise en place.
  10. Procédé pour le polissage mécano-chimique d'un substrat choisi parmi un substrat magnétique, un substrat optique et un substrat semi-conducteur, comprenant :
    la fourniture d'un appareil de polissage mécano-chimique ayant un plateau ;
    la fourniture d'au moins un substrat choisi parmi un substrat magnétique, un substrat optique et un substrat semi-conducteur ;
    la fourniture d'au moins deux opérations de polissage ;
    la fourniture d'une pluralité de types de feutres de polissage mécano-chimique ayant une fenêtre (16 ; 20 ; 120), où chaque type de feutre de polissage mécano-chimique a des propriétés de polissage différentes et une caractéristique d'identification intégrale (11 ; 30) pour distinguer chaque type de feutre de polissage mécano-chimique des autres types de feutres de polissage mécano-chimique dans la pluralité de types, où la caractéristique d'identification intégrale (11 ; 30) n'est pas active pour le polissage,
    où la caractéristique d'identification intégrale (11 ; 30) est choisie pour être observable à travers la fenêtre (16 ; 20 ; 120) et pour identifier de manière unique chaque type de feutre de polissage mécano-chimique dans la pluralité de types ;
    la fourniture d'au moins deux formulations de polissage, où chaque formulation de polissage correspond à l'une des au moins deux opérations de polissage et où chaque formulation de polissage inclut une identification de la caractéristique d'identification intégrale (11 ; 30) associée avec le type de feutre de polissage mécano-chimique à utiliser ;
    le choix d'une opération de polissage à réaliser parmi les au moins deux opérations de polissage ("l'opération de polissage choisie") et d'une formulation de polissage correspondante ("la formulation choisie") ;
    l'installation sur le plateau du type de feutre de polissage mécano-chimique identifié dans la formulation choisie ;
    l'observation de la caractéristique d'identification intégrale (11 ; 30) du feutre de polissage mécano-chimique installé et la vérification de ce qu'elle correspond avec celle identifiée dans la formulation choisie ; et la mise en oeuvre de l'opération de polissage choisie sur le au moins un substrat.
EP09155069A 2008-10-16 2009-03-13 Tampon à polir mécanique et chimique ayant une fenêtre avec fonction d'identification intégrale Ceased EP2177312B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/252,820 US8118644B2 (en) 2008-10-16 2008-10-16 Chemical mechanical polishing pad having integral identification feature
US12/397,535 US8118641B2 (en) 2009-03-04 2009-03-04 Chemical mechanical polishing pad having window with integral identification feature

Publications (2)

Publication Number Publication Date
EP2177312A1 EP2177312A1 (fr) 2010-04-21
EP2177312B1 true EP2177312B1 (fr) 2011-04-27

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EP09155069A Ceased EP2177312B1 (fr) 2008-10-16 2009-03-13 Tampon à polir mécanique et chimique ayant une fenêtre avec fonction d'identification intégrale

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EP (1) EP2177312B1 (fr)
DE (1) DE602009001168D1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9238295B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
KR102624629B1 (ko) 2021-11-19 2024-01-15 에스케이하이닉스 주식회사 윈도우 삽입형 연마패드 및 이의 제조방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5533923A (en) 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization

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Publication number Publication date
DE602009001168D1 (de) 2011-06-09
EP2177312A1 (fr) 2010-04-21

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