EP2184772A4 - Procédé de fabrication de particules fines de semi-conducteur et particules fines - Google Patents
Procédé de fabrication de particules fines de semi-conducteur et particules finesInfo
- Publication number
- EP2184772A4 EP2184772A4 EP08827049A EP08827049A EP2184772A4 EP 2184772 A4 EP2184772 A4 EP 2184772A4 EP 08827049 A EP08827049 A EP 08827049A EP 08827049 A EP08827049 A EP 08827049A EP 2184772 A4 EP2184772 A4 EP 2184772A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- fine particles
- manufacturing semiconductor
- semiconductor fine
- manufacturing
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/012—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group II-IV materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F27/00—Mixers with rotary stirring devices in fixed receptacles; Kneaders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F27/00—Mixers with rotary stirring devices in fixed receptacles; Kneaders
- B01F27/27—Mixers with stator-rotor systems, e.g. with intermeshing teeth or cylinders or having orifices
- B01F27/271—Mixers with stator-rotor systems, e.g. with intermeshing teeth or cylinders or having orifices with means for moving the materials to be mixed radially between the surfaces of the rotor and the stator
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G9/00—Compounds of zinc
- C01G9/08—Sulfides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/823—Materials of the light-emitting regions comprising only Group II-VI materials, e.g. ZnO
- H10H20/8232—Materials of the light-emitting regions comprising only Group II-VI materials, e.g. ZnO characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F27/00—Mixers with rotary stirring devices in fixed receptacles; Kneaders
- B01F27/27—Mixers with stator-rotor systems, e.g. with intermeshing teeth or cylinders or having orifices
- B01F27/271—Mixers with stator-rotor systems, e.g. with intermeshing teeth or cylinders or having orifices with means for moving the materials to be mixed radially between the surfaces of the rotor and the stator
- B01F27/2714—Mixers with stator-rotor systems, e.g. with intermeshing teeth or cylinders or having orifices with means for moving the materials to be mixed radially between the surfaces of the rotor and the stator the relative position of the stator and the rotor, gap in between or gap with the walls being adjustable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y35/00—Methods or apparatus for measurement or analysis of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
- H10P14/265—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using solutions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3451—Structure
- H10P14/3452—Microstructure
- H10P14/3461—Nanoparticles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S516/00—Colloid systems and wetting agents; subcombinations thereof; processes of
- Y10S516/924—Significant dispersive or manipulative operation or step in making or stabilizing colloid system
- Y10S516/927—Significant dispersive or manipulative operation or step in making or stabilizing colloid system in situ formation of a colloid system making or stabilizing agent which chemical reaction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S516/00—Colloid systems and wetting agents; subcombinations thereof; processes of
- Y10S516/924—Significant dispersive or manipulative operation or step in making or stabilizing colloid system
- Y10S516/928—Mixing combined with non-mixing operation or step, successively or simultaneously, e.g. heating, cooling, ph change, ageing, milling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/895—Manufacture, treatment, or detection of nanostructure having step or means utilizing chemical property
- Y10S977/896—Chemical synthesis, e.g. chemical bonding or breaking
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Composite Materials (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Luminescent Compositions (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP16174263.0A EP3106227A1 (fr) | 2007-08-09 | 2008-08-07 | Procédé de fabrication de particules fines de semi-conducteurs et lesdites fines particules |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007207426 | 2007-08-09 | ||
| JP2008062315 | 2008-03-12 | ||
| PCT/JP2008/064246 WO2009020188A1 (fr) | 2007-08-09 | 2008-08-07 | Procédé de fabrication de particules fines de semi-conducteur et particules fines |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP16174263.0A Division-Into EP3106227A1 (fr) | 2007-08-09 | 2008-08-07 | Procédé de fabrication de particules fines de semi-conducteurs et lesdites fines particules |
| EP16174263.0A Division EP3106227A1 (fr) | 2007-08-09 | 2008-08-07 | Procédé de fabrication de particules fines de semi-conducteurs et lesdites fines particules |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2184772A1 EP2184772A1 (fr) | 2010-05-12 |
| EP2184772A4 true EP2184772A4 (fr) | 2012-12-26 |
| EP2184772B1 EP2184772B1 (fr) | 2016-08-03 |
Family
ID=40341417
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP16174263.0A Withdrawn EP3106227A1 (fr) | 2007-08-09 | 2008-08-07 | Procédé de fabrication de particules fines de semi-conducteurs et lesdites fines particules |
| EP08827049.1A Active EP2184772B1 (fr) | 2007-08-09 | 2008-08-07 | Procédé de fabrication de particules fines de semi-conducteur et particules fines |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP16174263.0A Withdrawn EP3106227A1 (fr) | 2007-08-09 | 2008-08-07 | Procédé de fabrication de particules fines de semi-conducteurs et lesdites fines particules |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US8841352B2 (fr) |
| EP (2) | EP3106227A1 (fr) |
| JP (1) | JP4458202B2 (fr) |
| KR (2) | KR101432093B1 (fr) |
| CN (1) | CN101855713B (fr) |
| WO (1) | WO2009020188A1 (fr) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4817154B2 (ja) * | 2007-07-06 | 2011-11-16 | エム・テクニック株式会社 | 強制超薄膜回転式処理法を用いたナノ粒子の製造方法 |
| JP4849648B2 (ja) * | 2007-11-09 | 2012-01-11 | エム・テクニック株式会社 | エマルションの製造方法 |
| US8865055B2 (en) | 2008-07-16 | 2014-10-21 | Materials And Electrochemical Research (Mer) Corporation | Production of sintered three-dimensional ceramic bodies |
| US20100144510A1 (en) * | 2008-07-16 | 2010-06-10 | Sepulveda Juan L | Production of sintered three-dimensional ceramic bodies |
| EP2418015B1 (fr) * | 2008-11-25 | 2016-01-06 | M. Technique Co., Ltd. | Matériel de traitement de fluide et procédé de traitement |
| CN102905783B (zh) * | 2010-05-25 | 2016-04-27 | M技术株式会社 | 控制了掺杂元素量的析出物质的制造方法 |
| KR101892948B1 (ko) * | 2010-11-24 | 2018-08-29 | 엠. 테크닉 가부시키가이샤 | 고용체 안료 나노 입자 및 고용비가 제어된 고용체 안료 나노 입자의 제조 방법 |
| WO2012137628A1 (fr) | 2011-04-01 | 2012-10-11 | エム・テクニック株式会社 | Procédés de fabrication d'un sel baryum titanyle et de titanate de baryum |
| WO2012147209A1 (fr) * | 2011-04-28 | 2012-11-01 | エム・テクニック株式会社 | Procédé pour la production d'oxyde/d'hydroxyde |
| WO2012165000A1 (fr) * | 2011-05-28 | 2012-12-06 | エム・テクニック株式会社 | Procédé anti-adhésion de matériau à traiter mettant en œuvre un dispositif de traitement à fluide de type film mince forcé |
| US20150005429A1 (en) * | 2012-02-13 | 2015-01-01 | Kyowa Chemical Industry Co., Ltd. | Magnesium hydroxide fine particles |
| JP6014521B2 (ja) * | 2013-03-11 | 2016-10-25 | 株式会社日立製作所 | 相変化メモリおよび半導体記録再生装置 |
| KR20240053033A (ko) | 2021-08-31 | 2024-04-23 | 디아이씨 가부시끼가이샤 | 발광 입자 및 발광 입자 함유 조성물의 제조 방법 |
| KR102779630B1 (ko) * | 2022-05-12 | 2025-03-12 | 엠. 테크닉 가부시키가이샤 | 단결정 구상 실리콘 나노 입자 |
| JPWO2024057464A1 (fr) | 2022-09-14 | 2024-03-21 | ||
| WO2024180594A1 (fr) * | 2023-02-27 | 2024-09-06 | エム・テクニック株式会社 | Méthode de production de nanoparticules de carbone sphériques monocristallines supportant du platine |
| WO2024224517A1 (fr) | 2023-04-26 | 2024-10-31 | エム・テクニック株式会社 | Procédé de production de nanoparticules de sodium métal sphériques monocristallines |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040115123A1 (en) * | 2001-03-07 | 2004-06-17 | Yingyan Zhou | Process for producing nanometer grade powders |
| US20040241430A1 (en) * | 2001-07-20 | 2004-12-02 | Jachuck Roshan Jeet Jee | Methods of manufacturing particles |
| JP2006341232A (ja) * | 2005-06-10 | 2006-12-21 | Canon Inc | 流体処理装置および流体処理方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1112091A (ja) | 1997-06-20 | 1999-01-19 | Shin Etsu Chem Co Ltd | 球状単結晶シリコンの製造方法 |
| JP2001302399A (ja) | 2000-04-19 | 2001-10-31 | Mitsubishi Chemicals Corp | 半導体超微粒子の製造方法 |
| JP2002224557A (ja) * | 2001-02-01 | 2002-08-13 | Mitsubishi Chemicals Corp | 半導体超微粒子の製造方法 |
| JP4038083B2 (ja) | 2002-07-16 | 2008-01-23 | エム・テクニック株式会社 | 分散乳化装置及び分散乳化方法 |
| CN1483515B (zh) * | 2002-07-16 | 2010-07-28 | M技术株式会社 | 流动体的处理装置、流动体的处理方法及带有微细化装置的脱气机 |
| JP3955254B2 (ja) * | 2002-11-25 | 2007-08-08 | エム・テクニック株式会社 | 微細化装置付脱気機及び微細化による脱気方法 |
| JP3923000B2 (ja) * | 2002-11-11 | 2007-05-30 | 株式会社日本ボロン | 微小物質分離乾燥方法および装置 |
| JP2005272516A (ja) | 2004-03-23 | 2005-10-06 | Sumitomo Osaka Cement Co Ltd | 化合物半導体超微粒子の製造方法 |
| JP5001529B2 (ja) * | 2005-06-10 | 2012-08-15 | 富士フイルム株式会社 | 有機顔料微粒子の製造方法 |
| JP4504267B2 (ja) | 2005-06-28 | 2010-07-14 | 株式会社東芝 | 半導体ナノ粒子の製造方法及び半導体材料の表面を被覆する方法 |
| JP2007197382A (ja) | 2006-01-27 | 2007-08-09 | Konica Minolta Medical & Graphic Inc | 半導体ナノ粒子 |
-
2008
- 2008-08-07 CN CN2008801110410A patent/CN101855713B/zh active Active
- 2008-08-07 KR KR1020147001276A patent/KR101432093B1/ko active Active
- 2008-08-07 EP EP16174263.0A patent/EP3106227A1/fr not_active Withdrawn
- 2008-08-07 KR KR1020107005163A patent/KR101378413B1/ko active Active
- 2008-08-07 JP JP2009526491A patent/JP4458202B2/ja active Active
- 2008-08-07 US US12/672,836 patent/US8841352B2/en active Active
- 2008-08-07 WO PCT/JP2008/064246 patent/WO2009020188A1/fr not_active Ceased
- 2008-08-07 EP EP08827049.1A patent/EP2184772B1/fr active Active
-
2014
- 2014-08-22 US US14/466,803 patent/US9337382B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040115123A1 (en) * | 2001-03-07 | 2004-06-17 | Yingyan Zhou | Process for producing nanometer grade powders |
| US20040241430A1 (en) * | 2001-07-20 | 2004-12-02 | Jachuck Roshan Jeet Jee | Methods of manufacturing particles |
| JP2006341232A (ja) * | 2005-06-10 | 2006-12-21 | Canon Inc | 流体処理装置および流体処理方法 |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2009020188A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4458202B2 (ja) | 2010-04-28 |
| US20150034884A1 (en) | 2015-02-05 |
| JPWO2009020188A1 (ja) | 2010-11-04 |
| US8841352B2 (en) | 2014-09-23 |
| KR101378413B1 (ko) | 2014-03-27 |
| KR20100053629A (ko) | 2010-05-20 |
| EP2184772B1 (fr) | 2016-08-03 |
| KR20140013113A (ko) | 2014-02-04 |
| EP3106227A1 (fr) | 2016-12-21 |
| US9337382B2 (en) | 2016-05-10 |
| EP2184772A1 (fr) | 2010-05-12 |
| CN101855713B (zh) | 2013-02-13 |
| WO2009020188A1 (fr) | 2009-02-12 |
| KR101432093B1 (ko) | 2014-08-21 |
| US20110042626A1 (en) | 2011-02-24 |
| CN101855713A (zh) | 2010-10-06 |
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Legal Events
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