EP2201625A1 - Dispositif pour la fabrication et/ou la conservation de diodes luminescentes et/ou de cellules solaires organiques et son procede de fabrication - Google Patents
Dispositif pour la fabrication et/ou la conservation de diodes luminescentes et/ou de cellules solaires organiques et son procede de fabricationInfo
- Publication number
- EP2201625A1 EP2201625A1 EP08839946A EP08839946A EP2201625A1 EP 2201625 A1 EP2201625 A1 EP 2201625A1 EP 08839946 A EP08839946 A EP 08839946A EP 08839946 A EP08839946 A EP 08839946A EP 2201625 A1 EP2201625 A1 EP 2201625A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- encapsulation
- electronic component
- water
- film
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000003860 storage Methods 0.000 title claims abstract description 6
- 238000000034 method Methods 0.000 title claims description 6
- 238000005538 encapsulation Methods 0.000 claims abstract description 41
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000007787 solid Substances 0.000 claims abstract description 3
- 239000011358 absorbing material Substances 0.000 claims abstract 2
- 239000011261 inert gas Substances 0.000 claims abstract 2
- 239000010408 film Substances 0.000 claims description 45
- 239000006096 absorbing agent Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 18
- 230000004888 barrier function Effects 0.000 claims description 17
- 239000002131 composite material Substances 0.000 claims description 14
- 239000011888 foil Substances 0.000 claims description 11
- 125000006850 spacer group Chemical group 0.000 claims description 8
- 239000013039 cover film Substances 0.000 claims description 6
- 239000004922 lacquer Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 238000001771 vacuum deposition Methods 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005566 electron beam evaporation Methods 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 239000002905 metal composite material Substances 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 238000005452 bending Methods 0.000 claims 2
- 239000002689 soil Substances 0.000 claims 1
- 239000012530 fluid Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 13
- -1 polyethylene Polymers 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000005023 polychlorotrifluoroethylene (PCTFE) polymer Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000003855 Adhesive Lamination Methods 0.000 description 2
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920002493 poly(chlorotrifluoroethylene) Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920004439 Aclar® Polymers 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229920001824 Barex® Polymers 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000009459 flexible packaging Methods 0.000 description 1
- RZXDTJIXPSCHCI-UHFFFAOYSA-N hexa-1,5-diene-2,5-diol Chemical compound OC(=C)CCC(O)=C RZXDTJIXPSCHCI-UHFFFAOYSA-N 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 229920001709 polysilazane Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 238000003856 thermoforming Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
Definitions
- the invention relates to a device for the production and / or storage of water vapor-sensitive electronic components, in particular organic light-emitting diodes or solar cells, according to the preamble of claim 1.
- the invention covers a method for producing this device.
- An OLED namely an "organic light-emitting diode” is a light-emitting diode designed as a thin-film luminous component made of organic, semiconducting materials and comprising several organic layers, which is preferably provided for screen inserts or for room lighting and can be used as a flexible display can be used.
- a double encapsulation with water vapor absorber of the usually water vapor-sensitive electronic component forms a cavity which, in addition to the OLED located in a second encapsulation, also contains an amount of moisture absorber material which is appropriate for the lifetime.
- the cavity is preferably filled with inert dry gas - N 2 , Ar -, but may also contain a liquid or a solid with very good water vapor conductivity. It is important that in the cavity of the water vapor can flow much easier to a moisture absorber than through the second encapsulation to the OLED.
- any moisture entering the outer first encapsulant is absorbed by the encapsulated moisture absorbers before it can pass through the second inner encapsulant to the actual OLED. This ensures - before the absorption of the absorber - a completely dry operation of the OLED.
- the cavity can be created by nubs or webs which are embossed in one of two film-like cover elements or by additionally printed or otherwise attached knobs or webs.
- At sufficiently high absorption rate of the moisture absorber and sufficiently good second encapsulation of the OLED can as Cavity also satisfy a customary Antiblockp
- spacers-also in transparent form-as a structure or to introduce them into the respective films as inorganic particles.
- the outer encapsulation consists of flexible barrier composite films; These light-transparent composite films preferably include an inorganic transparent barrier layer.
- the latter is in particular of SiOx, where x is a number of 1.6-2.0, preferably 2.0 -, but may also consist of AlyOz, where y: z is a number of 0.5-1.0 - preferred , 0.66 -, optionally also of ZnO, MgO, TiO 2, Si 3 N 4, AIN o. The like.
- the transparent layers are applied by means of vacuum coating methods, such as sputtering, plasma CVD (chemical vapor deposition), PVD (physical vapor deposition), thermal evaporation or electron beam evaporation, the abovementioned processes are carried out in particular under reduced pressure. Particularly preferred is the electron beam evaporation of silicon oxide. Moreover, this transparent film is used in the encapsulation only in non-plastically deformed state.
- the inorganic barrier layer is expediently combined with a lacquer layer.
- the organic layers can also be vapor-deposited and crosslinked, for example, via EB or UV radiation.
- the two composite films are bonded together by thermal or ultrasonic sealing.
- the respective position of the composite film to be joined must consist of a suitable sealing medium.
- barrier films examples include EVOH films (ethylene vinyl alcohol), PVcD films (polyvinylidene chloride), films of halogenated polyethylene such as chlorinated and / or fluorinated polyethylenes, for example polychlorotrifluoroethylene (PCTFE), also known under the trade name ACLAR, or Films of acrylonitrile / methacrylate copolymers, also known under the brand name BAREX.
- EVOH films ethylene vinyl alcohol
- PVcD films polyvinylidene chloride
- films of halogenated polyethylene such as chlorinated and / or fluorinated polyethylenes
- PCTFE polychlorotrifluoroethylene
- ACLAR acrylonitrile / methacrylate copolymers
- an encapsulation for example by means of injection molding of polymers or by means of thermoforming, and then to provide this encapsulation with inorganic barrier layers, preferably by vacuum. These vacuum barrier layers can then in turn be combined with barrier-improving paints. Again, so-called. Multilayer are possible!
- first encapsulation of the back of a metal composite foil in particular an aluminum composite foil.
- cavities for receiving moisture absorption material and also webs and nubs as spacers or fixing elements for the second OLED to be encapsulated can also be contained by cold forming.
- the in the Area completely impermeable composite film can also be glued directly to the OLED - or connected in another way - be.
- the film can even be the substrate for the actual OLED production. It is important for an encapsulation according to the invention that there is a space or cavity with good water vapor transport properties and water vapor absorber material between the OLED and the transparent top side foil so that the luminous area is covered only to a small extent or not at all.
- the back can also be formed by the transparent cover materials described above. In this case, since these are not 100% moisture impermeable, it must again be ensured that the penetrating film can be diverted to the moisture absorber material via a cavity or a filler with high moisture conductivity between the OLED and the film.
- the outer encapsulation is constructed like a conventional blister pack;
- the blister is formed by cold forming of multilayer film-shaped material.
- Examples are aluminum foils which are covered on both sides with plastic layers or on one side with plastic and on the other side with lacquer.
- the aluminum foils are in a thickness of about 7 to 100 ⁇ m.
- the plastics applied to one side of the aluminum foil are, for example, the series of polyamides or polyolefins, such as polyethylene and polypropylene, polyvinyl chloride, polyester, etc. and can be produced by extrusion or as films or film composites by film lamination, occasionally by means of a primer and / or adhesive be applied.
- the polyolefins such as polyethylene or polypropylene, the polyamides, the polyester and / or the Cycloolefin ethylene copolymers, etc. by extrusion or as films or film composites by film lamination, occasionally applied by means of a primer and / or adhesive.
- the thickness of the layers of the extrusion lamination or the thickness of the films or film composites may, for example, be 10 ⁇ m to 100 ⁇ m.
- the film-shaped material contains cavities, the water vapor absorber z. B. in tablet form, also webs or nubs that allow the most free storage of the OLED.
- the lidding film or the OLED nubs webs o. The like. molded, which prevent contact of the transparent lid foil with the OLED. The aim of this arrangement is to allow the best possible gas exchange around the OLED.
- moisture absorber materials may also be incorporated into the inner polymer / lacquer layer of the reverse side composite film or applied to the film. As a result, with sufficiently good tightness of the outer encapsulation, no cavities are required for receiving the moisture absorber material and a substantially more flexible overall structure is obtained.
- one of the encapsulating materials can also be used as substrate for the application of the OLED serve.
- the other side of the encapsulation may also be by vacuum coating, painting with a barrier varnish or adhesive lamination with a foil - metal and / or plastic. A combination of the methods is possible.
- the diffusion of water vapor and oxygen in the second encapsulation is at least two orders of magnitude worse than in the surrounding cavity, which is in direct communication with the water vapor absorber.
- Fig. 1 an open front view of a
- Fig. 2 the partially cut
- Fig. 3 a plan view of a semi-flexible solar cell whose profile corresponds approximately to that of Figure 1;
- FIG. 4 shows the sketch of a front view of another device with a diode device
- Fig. 5 a plan view of a
- a box-like device 10 has a groove-like bottom profile 12 of the cross-sectional length a, from the flat bottom surface 14 at both ends approximately at right angles to this edge web 16 of the free height c is formed out.
- the two edge webs 16 lie in each case one foot strip 18 of the cross-sectional length ai parallel to the bottom surface 14 next to its free longitudinal edge 19, which is part of a longitudinal wall profile 20 of the device 10; perpendicular to the foot strip 18 includes a vertical strip-like wall plate 22 of height h, the upper end of which is also formed by a wall panel 22 at right angles cantilevering outward ridge strip 24 of the Kragrienes k.
- Both the bottom profile 12 and the - with its edge web 16 a groove space 26 rectangular cross-section of the clear width e delimiting - longitudinal wall profile 20 are formed from blister material.
- each groove space 26 Within each groove space 26 are moisture absorbers 28 - arranged according to FIG. 2 of the length f and the width g - for moisture absorption, whose height i ends above the bottom surface 14.
- the latter is supported by an electronics or OLED film 30 which extends from the left-hand edge web 16 of the bottom profile 12 in FIG. 1 to the right-hand row of the moisture absorbers 28.
- a transparent cover film 40 extends horizontally, which rests on the ridge strip 24 on both sides and delimits a firewall 34 at the top.
- the structure of the device 10a of FIG. 3 corresponds to i.W. the device 10 of Figures 1, 2, wherein the longitudinal axes B of the moisture absorber 28 here cross the longitudinal axis A of the device 10; in the example of FIGS. 1, 2, the latter runs parallel to the longitudinal axes B of the moisture absorbers 28.
- the here semi-flexible running OLED film 30a is in comparison to the OLED film 30 of FIG. 1, 2 of substantially smaller width b.
- the device 11 shown in Fig. 4, 5 carries on a plate-shaped bottom profile 12a near its end edges 15 of which vertically upstanding longitudinal wall profiles 20a of the height hi, which each have an outwardly abkragender ridge strip 24 and approximately in half of the height hi an inwardly directed Kragst Shape 25 are formed.
- the latter serve to define the longitudinal edges 31 of the OLED film 30, which in turn delimits a firewall 34 with a cover film 40 stretched in parallel at a distance n.
- the measure of this distance n corresponds approximately to the clearance q between the OLED film 30 and the surface 13 of the bottom profile 12a.
- moisture absorbers 28 are also arranged here, specifically in four intermediate spaces 35, which are determined by spacers 38 carrying the OLED film 30. These are also of V-shaped cross-section as the opposing spacers 38a between the OLED film 30 and the cover film 40 parallel thereto.
- the spacers 38, 38a are vertically aligned with each other, and each one of their cross-sectional tip end edge 37 extends on the OLED film 30.
- the two cross-sectional edges extending parallel to the other cross-sectional end are designated by 39.
- the above-mentioned distance n is greater than the vertical distance ni of the inner KragstMails 25 of the longitudinal wall section 20a of the outer ridge strip 24, which is why between the longitudinal wall section 20a and the adjacent spacer 38a, the cover sheet 40 with a cross-sectional edge strip 41 in an angle w - for example, 10 ° - is inclined by a crease line 42 of the cover sheet 40 to the longitudinal wall section 20a downwards.
- a glass pane can also be used.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Packaging Frangible Articles (AREA)
- Photovoltaic Devices (AREA)
- Laminated Bodies (AREA)
Abstract
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10010431A EP2267817A1 (fr) | 2007-10-12 | 2008-09-29 | Dispositif pour la fabrication et/ou la conservation de diodes luminescentes et/ou de cellules solaires organiques et son procédé de fabrication |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007049293 | 2007-10-12 | ||
| DE102008006816A DE102008006816A1 (de) | 2007-10-12 | 2008-01-29 | Vorrichtung für die Herstellung und/oder Aufbewahrung von organischen Leuchtdioden bzw. Solarzellen sowie Verfahren zur Herstellung der Vorrichtung |
| PCT/EP2008/008254 WO2009049765A1 (fr) | 2007-10-12 | 2008-09-29 | Dispositif pour la fabrication et/ou la conservation de diodes luminescentes et/ou de cellules solaires organiques et son procédé de fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2201625A1 true EP2201625A1 (fr) | 2010-06-30 |
Family
ID=40435582
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP08839946A Withdrawn EP2201625A1 (fr) | 2007-10-12 | 2008-09-29 | Dispositif pour la fabrication et/ou la conservation de diodes luminescentes et/ou de cellules solaires organiques et son procede de fabrication |
| EP10010431A Withdrawn EP2267817A1 (fr) | 2007-10-12 | 2008-09-29 | Dispositif pour la fabrication et/ou la conservation de diodes luminescentes et/ou de cellules solaires organiques et son procédé de fabrication |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP10010431A Withdrawn EP2267817A1 (fr) | 2007-10-12 | 2008-09-29 | Dispositif pour la fabrication et/ou la conservation de diodes luminescentes et/ou de cellules solaires organiques et son procédé de fabrication |
Country Status (5)
| Country | Link |
|---|---|
| EP (2) | EP2201625A1 (fr) |
| DE (1) | DE102008006816A1 (fr) |
| EA (1) | EA201000553A1 (fr) |
| TW (1) | TW200935638A (fr) |
| WO (1) | WO2009049765A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102019124349A1 (de) * | 2019-09-11 | 2021-03-11 | Rehau Ag + Co | Verfahren zur Herstellung eines elektrifizierten Kunststoffprofils sowie elektrifiziertes Kunststoffprofil |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5964353A (en) * | 1996-05-20 | 1999-10-12 | Ilinois Tool Works Inc. | Energy absorbing carrier tape |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100266532B1 (ko) * | 1997-02-03 | 2000-09-15 | 가네꼬 히사시 | 유기 el 소자 |
| US6080031A (en) * | 1998-09-02 | 2000-06-27 | Motorola, Inc. | Methods of encapsulating electroluminescent apparatus |
| US6737753B2 (en) * | 2001-09-28 | 2004-05-18 | Osram Opto Semiconductor Gmbh | Barrier stack |
| US20050098457A1 (en) * | 2002-01-23 | 2005-05-12 | Hamel Steven V. | Packaging |
| US20030235664A1 (en) * | 2002-06-20 | 2003-12-25 | Rick Merical | Films having a desiccant material incorporated therein and methods of use and manufacture |
| KR100667358B1 (ko) * | 2004-02-04 | 2007-01-12 | 엘지전자 주식회사 | 일렉트로-루미네센스 표시장치 |
| US7316756B2 (en) * | 2004-07-27 | 2008-01-08 | Eastman Kodak Company | Desiccant for top-emitting OLED |
| JP4605499B2 (ja) * | 2004-10-28 | 2011-01-05 | 富士電機ホールディングス株式会社 | 有機elディスプレイの封止構造 |
-
2008
- 2008-01-29 DE DE102008006816A patent/DE102008006816A1/de not_active Withdrawn
- 2008-09-29 EP EP08839946A patent/EP2201625A1/fr not_active Withdrawn
- 2008-09-29 EA EA201000553A patent/EA201000553A1/ru unknown
- 2008-09-29 WO PCT/EP2008/008254 patent/WO2009049765A1/fr not_active Ceased
- 2008-09-29 EP EP10010431A patent/EP2267817A1/fr not_active Withdrawn
- 2008-10-09 TW TW097139024A patent/TW200935638A/zh unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5964353A (en) * | 1996-05-20 | 1999-10-12 | Ilinois Tool Works Inc. | Energy absorbing carrier tape |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2267817A1 (fr) | 2010-12-29 |
| TW200935638A (en) | 2009-08-16 |
| DE102008006816A1 (de) | 2009-04-16 |
| WO2009049765A1 (fr) | 2009-04-23 |
| EA201000553A1 (ru) | 2010-10-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2477809B1 (fr) | Élément à structure alvéolaire | |
| DE102012214411B4 (de) | Vorrichtung und verfahren zum herstellen hermetisch dichter kavitäten | |
| WO2009138218A1 (fr) | Feuille de couverture d'emballage, contenant, emballage et unité produit-emballage | |
| WO2007113247A2 (fr) | Module d'électricité solaire dépourvu de verre, présentant au moins une cellule solaire à couche mince souple, et son procédé de fabrication | |
| DE102008056123A1 (de) | Mehrschichtfolie | |
| DE102014221245A1 (de) | Dünnglasfolienverbundbahn mit Versteifungsstreifen | |
| WO2012049195A1 (fr) | Feuille tubulaire stratifiée comprenant au moins une couche barrière orientée et emballage tubulaire formé au moins en partie à partir de celle-ci | |
| WO2012142639A1 (fr) | Emballage doté d'une barrière thermique enveloppante | |
| EP3077277A1 (fr) | Coffre pour véhicule utilitaire | |
| EP2145758B2 (fr) | Emballage et unité de matériau à emballer | |
| EP1488921A1 (fr) | Laminé déformable à froid | |
| DE102015116418A1 (de) | Verfahren zum Aufbringen der Schutzschicht, Schutzschicht selbst und Halbfabrikat mit einer Schutzschicht | |
| AT520524B1 (de) | Thermisches Isolationselement | |
| DE102008018629A1 (de) | Verpackungsfolienabschnitt, Verpackungsfolie, Verpackung sowie Verpackungs-Produkt-Einheit | |
| WO2009049765A1 (fr) | Dispositif pour la fabrication et/ou la conservation de diodes luminescentes et/ou de cellules solaires organiques et son procédé de fabrication | |
| EP2898108B1 (fr) | Dispositif pour fabriquer un film anti-adhésif formant barrière aux gaz munie d'une couche barrière céramique | |
| DE1937998A1 (de) | Aus Kunstharzfilmen aufgebaute Druckluft-Schichtkoerper und Verfahren zu ihrer Herstellung | |
| EP2633995B1 (fr) | Film multicouche | |
| EP1818170A1 (fr) | Feuilles barrières thermoformables pour applications de refroidissement | |
| EP4088329A1 (fr) | Système d'encapsulation conçu pour un composant optoélectronique, comportant au moins une première encapsulation et une deuxième encapsulation, composant optoélectronique équipé d'un tel système d'encapsulation | |
| DE102015100106A1 (de) | Laminat, insbesondere zur Herstellung von Deckelmaterial, Verfahren zu dessen Herstellung sowie Deckelmaterial aus einem solchen Laminat | |
| EP3273490B1 (fr) | Film de paroi arrière en couches pour panneau solaire, panneau solaire et procédé de fabrication de film et du panneau | |
| EP1520796A1 (fr) | Tube en matière plastique avec une couche intérieure et méthodes pour sa fabrication | |
| DE102013111164B4 (de) | Verfahren zur Herstellung von Kontaktlöchern | |
| WO2019219435A1 (fr) | Stratifié d'emballage déformable à froid |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| 17P | Request for examination filed |
Effective date: 20100512 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR |
|
| AX | Request for extension of the european patent |
Extension state: AL BA MK RS |
|
| RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: LOHWASSER, WOLFGANG Inventor name: KIY, MICHAEL |
|
| 17Q | First examination report despatched |
Effective date: 20101123 |
|
| DAX | Request for extension of the european patent (deleted) | ||
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
| 18W | Application withdrawn |
Effective date: 20141013 |