EP2220263A4 - Système et procédé de revêtement de film, mince - Google Patents

Système et procédé de revêtement de film, mince

Info

Publication number
EP2220263A4
EP2220263A4 EP08841116.0A EP08841116A EP2220263A4 EP 2220263 A4 EP2220263 A4 EP 2220263A4 EP 08841116 A EP08841116 A EP 08841116A EP 2220263 A4 EP2220263 A4 EP 2220263A4
Authority
EP
European Patent Office
Prior art keywords
thin film
film coating
coating system
thin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08841116.0A
Other languages
German (de)
English (en)
Other versions
EP2220263A1 (fr
Inventor
Norman L Boling
Miles Rains
Howard R Gray
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deposition Sciences Inc
Original Assignee
Deposition Sciences Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deposition Sciences Inc filed Critical Deposition Sciences Inc
Publication of EP2220263A1 publication Critical patent/EP2220263A1/fr
Publication of EP2220263A4 publication Critical patent/EP2220263A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3492—Variation of parameters during sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
EP08841116.0A 2007-10-26 2008-10-27 Système et procédé de revêtement de film, mince Withdrawn EP2220263A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US99606307P 2007-10-26 2007-10-26
PCT/US2008/012170 WO2009055065A1 (fr) 2007-10-26 2008-10-27 Système et procédé de revêtement de film, mince

Publications (2)

Publication Number Publication Date
EP2220263A1 EP2220263A1 (fr) 2010-08-25
EP2220263A4 true EP2220263A4 (fr) 2014-06-04

Family

ID=40579882

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08841116.0A Withdrawn EP2220263A4 (fr) 2007-10-26 2008-10-27 Système et procédé de revêtement de film, mince

Country Status (4)

Country Link
EP (1) EP2220263A4 (fr)
JP (1) JP2011500971A (fr)
CN (1) CN101809185B (fr)
WO (1) WO2009055065A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120019135A1 (en) * 2010-07-20 2012-01-26 Miles Rains Ir coatings and methods
US9512519B2 (en) * 2012-12-03 2016-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Atomic layer deposition apparatus and method
JP6566750B2 (ja) * 2015-07-02 2019-08-28 Cbc株式会社 不連続金属膜の形成方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0428358A2 (fr) * 1989-11-13 1991-05-22 Optical Coating Laboratory, Inc. Géométrie et configurations d'une appareillage de pulvérisation pour magnétron
WO2008153915A1 (fr) * 2007-06-05 2008-12-18 Deposition Sciences, Inc. Procédé et appareil pour outillage de dépôt à vitesse élevée et faible coût

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741940A (ja) * 1993-07-27 1995-02-10 Iwasaki Electric Co Ltd スパッタリング装置
US5849162A (en) * 1995-04-25 1998-12-15 Deposition Sciences, Inc. Sputtering device and method for reactive for reactive sputtering
US6485616B1 (en) * 1999-12-29 2002-11-26 Deposition Sciences, Inc. System and method for coating substrates with improved capacity and uniformity
US6440280B1 (en) * 2000-06-28 2002-08-27 Sola International, Inc. Multi-anode device and methods for sputter deposition
CN100540723C (zh) * 2003-04-25 2009-09-16 旭硝子株式会社 制造氧化硅薄膜和光学多层膜的方法
US20050092599A1 (en) * 2003-10-07 2005-05-05 Norm Boling Apparatus and process for high rate deposition of rutile titanium dioxide
CN1789482A (zh) * 2004-12-17 2006-06-21 上海广电电子股份有限公司 组分渐变薄膜的蒸发装置及方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0428358A2 (fr) * 1989-11-13 1991-05-22 Optical Coating Laboratory, Inc. Géométrie et configurations d'une appareillage de pulvérisation pour magnétron
WO2008153915A1 (fr) * 2007-06-05 2008-12-18 Deposition Sciences, Inc. Procédé et appareil pour outillage de dépôt à vitesse élevée et faible coût

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009055065A1 *

Also Published As

Publication number Publication date
CN101809185A (zh) 2010-08-18
EP2220263A1 (fr) 2010-08-25
CN101809185B (zh) 2013-05-08
JP2011500971A (ja) 2011-01-06
WO2009055065A1 (fr) 2009-04-30

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