EP2220731A1 - Dispositif laser à semi-conducteur - Google Patents

Dispositif laser à semi-conducteur

Info

Publication number
EP2220731A1
EP2220731A1 EP08864364A EP08864364A EP2220731A1 EP 2220731 A1 EP2220731 A1 EP 2220731A1 EP 08864364 A EP08864364 A EP 08864364A EP 08864364 A EP08864364 A EP 08864364A EP 2220731 A1 EP2220731 A1 EP 2220731A1
Authority
EP
European Patent Office
Prior art keywords
carrier body
semiconductor laser
laser device
laser bar
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08864364A
Other languages
German (de)
English (en)
Inventor
Frank Singer
Thomas Schwarz
Ulrich STEEGMÜLLER
Roland Schulz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of EP2220731A1 publication Critical patent/EP2220731A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/005—Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06825—Protecting the laser, e.g. during switch-on/off, detection of malfunctioning or degradation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07552—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/521—Structures or relative sizes of bond wires
    • H10W72/527—Multiple bond wires having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Definitions

  • the invention relates to a semiconductor laser device with a laser bar.
  • the radiation characteristic of a laser diode depends on the temperature of the laser diode. The warmer the laser diode becomes, the longer-wave the radiation characteristic. Therefore, especially in the long-term operation of a laser diode, a suitable removal of the heat generated during operation of the laser diode is required. This is especially true for laser bars consisting of multiple laser diodes grown on the same substrate.
  • the heat is usually dissipated by microcooling systems, which have, for example, microchannels through which a cooling fluid flows.
  • the invention is based on the object
  • a semiconductor laser device includes a laser bar, a flexible conductor carrier, a carrier body of a metal or a metal alloy and a heat sink, which is arranged between the carrier body and the laser bar, wherein the laser bar is electrically contacted by the flexible conductor carrier and the carrier body has a thickness of at least 2 mm.
  • the carrier body of a metal or a metal alloy with a thickness of at least 2 mm provides good heat dissipation by a high thermal conductivity.
  • An advantage of the use of the flexible Schmssträge ' rs is that the laser bar can be arranged arbitrarily on the support body and contacted by the flexible conductor support.
  • the carrier body is cuboidal.
  • the carrier body has a thickness of 3 mm to 4 mm.
  • the thickness is 0.35 times to 0.65 times the side length of a base area of the carrier body. Under the thickness of the carrier body, the distance between the surface of the carrier body on which the laser bar is arranged, and the opposite base surface is understood.
  • a material is used for the heat sink, which the thermal expansion of the laser bar is adjusted, more preferably copper tungsten (CuW).
  • the heat is transferred by means of the heat sink from the laser bar to the carrier body. It is advantageous in this case if the heat is distributed as homogeneously as possible on the side facing away from the laser bar, which is achieved by a sufficient thickness of the carrier body. Due to the thickness of the carrier body, there is a good areal spreading of the waste heat energy.
  • the carrier body has a base area lying opposite the laser bar, which is designed as a thermal outcoupling area of the semiconductor laser device.
  • a cooling device in particular with an actively cooled heat sink in the form of a micro channel cooler, which is flowed through by a coolant.
  • an electrical insulator on the base surface of the carrier body remote from the laser bar at the thermal outcoupling surface.
  • the electrical insulator is preferably formed as a thin layer and allows, for example, an electrically neutral connection of the semiconductor laser device to a cooling device.
  • the carrier body contains copper or consists thereof. Furthermore, it is advantageous if the heat sink contains or consists of copper tungsten.
  • the laser bar is preferably coupled to the heat sink by means of a brazing layer, preferably of gold-tin, and the heat sink is coupled to the carrier body by means of a further brazing layer, preferably of gold-tin.
  • the laser bar is followed by an optical element in a main emission direction. The optical element advantageously serves for beam shaping of the radiation emitted by the laser bar.
  • the optical element may have an optical holder, preferably made of glass, which enables a particularly cost-effective production.
  • the optical element can have one or more optical bodies, for example a diaphragm, a lens, a waveguide or combinations thereof.
  • the optical body preferably influences the radiation characteristic of the light emitted by the laser bar
  • the optical holder may be formed as a part of the carrier body.
  • the carrier body is produced by a metal injection molding process (tnetal injection molding).
  • the carrier body can be produced by a die-casting method or by a milling method.
  • Three-dimensional structures such as optic holders, panels or planar mounting surfaces at different heights can be formed inexpensively in the manufacture of the carrier body in the metal injection molding process or in the die casting process. Furthermore, in these manufacturing methods in a simple manner
  • Fastening devices are formed, for example, holes for screw can be provided. It is advantageous if the flexible conductor carrier is glued to the carrier body with an adhesive material and an electrically conductive connection is formed between the flexible conductor carrier and the carrier body. Furthermore, it is advantageous if the flexible conductor carrier is glued to the carrier body with an adhesive material and an electrically conductive connection is formed between the flexible conductor carrier and the carrier body. Furthermore, it is advantageous if the flexible conductor carrier is glued to the carrier body with an adhesive material and an electrically conductive connection is formed between the flexible conductor carrier and the carrier body. Furthermore, it is advantageous if the flexible
  • Wire carrier electrically contacted by means of wire connections the laser bar and an electrically conductive connection between the laser bar and the carrier body is formed.
  • a silver paint adhesive is used as the adhesive material for connecting the flexible cable carrier to the carrier body, and as a material for forming the electrically conductive connection between the laser bar and the carrier body, a gold-tin solder.
  • the flexible conductor carrier has conductor tracks on its upper side, which are electrically conductively connected to the laser bar, for example the cathode contact. Furthermore, the flexible cable carrier preferably has on its underside further interconnects, which are electrically conductive with the
  • Carrier body are connected, wherein an electrically conductive connection of the laser bar, for example, the anode contact, is formed with the carrier body.
  • an electrically conductive connection of the laser bar for example, the anode contact
  • Such an arrangement of the tracks on the top and bottom of the flexible cable carrier is particularly space-saving.
  • the laser bar radiates light in the visible spectrum.
  • the semiconductor laser device can then be used in a projection application, for example for the illumination of microdisplays.
  • the semiconductor laser device comprises a thermistor whose resistance depends on the temperature.
  • the thermistor may be an NTC resistor.
  • the thermistor is preferably arranged in the vicinity of the laser bar on the same side as this on the carrier body and electrically connected, for example with a copper wire, with lines on the flexible conductor carrier.
  • the thermistor is used to measure the temperature of the laser bar during operation. It can be achieved by a circuit arrangement that the laser bar is turned off or the operating current is reduced when overheating occurs.
  • the laser bar has, for example, a semiconductor layer sequence with an active layer and a growth substrate. It is advantageous if the growth substrate is arranged on the side facing away from the carrier body. As a result, the heat dissipation to the heat sink and the carrier body is improved.
  • the carrier body may be formed as part of a housing of the semiconductor laser device and the housing may have a lid which is arranged on the carrier body, wherein the laser bar is disposed within the housing of the semiconductor laser device.
  • the optical element is disposed within the housing.
  • the housing formed from the carrier body and the lid encloses the
  • Laser bar wherein at least two openings are provided in the housing. Through one of the openings, the flexible conductor carrier is guided into the housing and contacted by means of Wire connections the laser bar, wherein the wire connections are preferably arranged in the housing. Through the other opening, the radiation generated by the laser bar is emitted.
  • the laser bar, the optical element, the wire connections, the heat sink, and the thermistor within the housing, which is formed from the carrier body and the lid, arranged.
  • the laser bar is soldered by means of a brazing layer to the heat sink and the heat sink by means of a further brazing layer to the carrier body by a synchronous soldering process.
  • the brazing alloys are prepared at a brazing temperature of 250 0 C or more, especially at 350 0 C to 400 0 C, and are characterized by a high stability with temperature fluctuations.
  • the flexible conductor carrier is preferably glued to the carrier body after the synchronous soldering process has ended.
  • FIG. 1 is a schematic perspective view of a semiconductor laser device according to a first embodiment
  • FIG. 2 shows a development of FIG. 1
  • Figure 3 is a schematic perspective view of a second embodiment of a
  • FIG. 4 shows a development of FIG. 3
  • Figure 5 is a schematic sectional view of another embodiment of a semiconductor laser device
  • Figure 1 is an embodiment of a
  • Semiconductor laser device 1 which has a laser bar 2, which is arranged on a support body 3 made of copper, wherein between the laser bar 2 and the support body 3, a heat sink 4 is made of copper tungsten.
  • the semiconductor laser device 1 further includes an optical element 5 which is disposed downstream of the laser bar 2.
  • the optical element 5 comprises an optical holder 6 and an optical body 7.
  • the semiconductor laser device 1 comprises a thermistor 8, which in the vicinity of the laser bar 2 on _ g _
  • the thermistor 8 is contacted by a copper wire 9 electrically conductive, for example.
  • Wire connections 11 is electrically connected to the laser bar 2.
  • dowel pins 12 are arranged, which serve for fastening a lid.
  • the semiconductor laser device 1 comprises laterally protruding from the support body 2 fastening devices 13 which are provided with screw holes 14.
  • Carrier body 3 is preferably provided with an insulating layer 15.
  • the carrier body 3 is made of copper in this embodiment. Alternatively, he can use more metals or
  • the carrier body 3 is formed, for example cuboid.
  • the surface on which the laser bar 2 is arranged for example, has a square base area of about 50 cm 2 .
  • the surface of the carrier body 3, on which the laser bar 2 is arranged, and the opposite base surface determine the thickness of the carrier body 3.
  • Carrier body 3 is preferably 3 mm to 4 mm thick, which results in a good spreading of the heat loss of the laser bar 2 on the laser bar 2 opposite Side is coming.
  • the heat dissipation through the carrier body 3 advantageously reduces the temperature in the active zone of the laser bar 2 so much that a continuous load over several 1000 hours is possible at high light output.
  • the carrier body 3 is preferably produced by a metal injection molding process.
  • the metal injection molding method is a molding process with which large numbers of the support body 3 can be manufactured with excellent tolerances.
  • Starting material for the injection molding of metal is metal powder with a suitable particle size. By slow heating, the metal powder is melted and injected through a machine into a mold.
  • Alternative manufacturing methods include die casting and milling.
  • the carrier body 3 has a recess 16, an optical holder 6 and the dowel pins 12, which pass through the
  • the thickness D of the carrier body 3 is advantageously 35% to 65% of the side length of the base of the carrier body.
  • the thickness D is preferably at least 2 mm and more preferably 3 mm to 4 mm. Under the thickness of the carrier body is the distance between the surface of the
  • Carrier body 3 on which the laser bar is arranged, and the opposite base surface of the support body 3 understood.
  • moldings of the Carrier body as the dowel pins 12 or the optical holder 6 is not considered in the determination of the thickness.
  • the flexible conductor carrier 10 preferably comprises a polyimide film approximately 100 ⁇ m thick and copper conductor tracks
  • the conductor tracks of the flexible conductor carrier 10 are preferably dimensioned for a current flow of 2 A to 10 A.
  • the flexible cable carrier 10 may have a plug contact with terminals 18, whereby it can be used in particular as a plug-in element in a zero-force connector.
  • the flexible cable carrier 10 can be soldered to an electronic board, wherein an electrical connection is made in this case without a plug.
  • the flexible conductor carrier 10 On the underside 19, the flexible conductor carrier 10 has an anode terminal contact. This is glued by means of an adhesive material over a large area on the support body 3.
  • the adhesive material used is preferably silver-conductive adhesive.
  • Anode conductors are redirected from the lower side 19 to the upper side 21 of the flexible conductor carrier 10 at via sites 20, where the anode conductor conductors run parallel next to the cathode conductor paths. Characterized in that in the vicinity of the semiconductor laser device 1, both the bottom 19 and the top 21 of the flexible conductor carrier 10 used for the conductor tracks can be kept small, the width of the flexible conductor carrier 10 in the vicinity of the semiconductor laser device 1.
  • the cathodes of the laser bar 2 are electrically connected to the flexible conductor carrier 10 by means of the wire connections 11. They are formed, for example, as gold wires with a thickness of about 50 microns.
  • wire connections 11 are formed, for example, as gold wires with a thickness of about 50 microns.
  • the optical holder 6 is designed as a lens holder and is preferably made of glass. To the optical holder 6, an optical body 7 is glued, which as a fast axis
  • Collimating lens (FAC lens) is formed.
  • the FAC lens collimates the highly divergent radiation of the laser bar 2. Mounting the lens requires high precision. It must be achieved as little as possible displacement of the lens during assembly.
  • thin adhesive gaps are used, which have a low shrinkage during curing and a low elongation during operation. The thicknesses of the adhesive gaps are between 5 ⁇ m and 20 ⁇ m.
  • the thermistor 8 is formed, for example, as an NTC resistor whose resistance decreases as the temperature rises. An electrical circuit of the thermistor 8 is used the temperature determination in the vicinity of the laser bar 2. In an overheating, the semiconductor laser device is switched off, wherein the overheating is detected by the thermistor 8.
  • heat is generated which flows off via the heat sink 4 to the carrier body 3.
  • a further derivation of the heat loss can on the bottom 23 of the support body 3 by attaching a cooling device, which has, for example, heat pipes (heat pipes) or a fan done.
  • Semiconductor laser device 1 comprises a cover 24, which is arranged on the carrier body 3.
  • the lid 24 is fixedly connected to the carrier body 3.
  • the lid 24 and the carrier body 3 enclose the laser bar and the wire connections, the optical element and the thermistor (all not shown) and thus form a housing 25 for the components.
  • the flexible conductor carrier 10 extends through a first opening 26 into the housing 25, where it electrically contacts the laser bar (not shown).
  • a second opening 27 is formed, in which a window 28 is inserted.
  • the window 28 is formed as a glass window with an antireflection coating. It follows the optical element (not shown) in the propagation direction of the laser light.
  • the second Opening 27 exits the radiation from the semiconductor laser device 1.
  • the housing 25 protects the sensitive laser bar from dust and other environmental influences.
  • the fastening devices 13 of the carrier body comprise screw holes 14, through which the semiconductor laser device 1 can be screwed to a cooling device (not shown).
  • a cooling device for example, comprising a heat pipe (heat pipe), a heat sink and / or a fan can be achieved.
  • FIG. 3 shows a further exemplary embodiment of a semiconductor laser device 1, which comprises a flexible conductor carrier 10, of which only a detail is shown, which is adhesively bonded to the carrier body 3.
  • the carrier body 3 is formed as a cuboid without recess.
  • the optical body 7 is arranged on the carrier body 3 without ' optics holder.
  • the semiconductor laser device 1 comprises four screw holes 14 in the corners of the carrier body 3, by means of which the semiconductor laser device 1 can be coupled to a cooling system.
  • the laser bar 2 is thermally connected to the carrier body 3 via a heat sink 4.
  • the electrical contacting of the laser bar 2 by the flexible conductor carrier 10 is not shown, but it can be done, for example, as in the embodiment shown in Figure 1.
  • 4 shows a development of the embodiment shown in Figure 3 is shown, in which the housing 25 has a cover 24 which is fixedly connected to the carrier body 3.
  • the lid 24 has recesses 29 at its corners, through which screw holes 14 in the carrier body 3 are accessible, through which the semiconductor laser device 1 can be attached, for example, to a cooling system.
  • the opening 26 of the housing 25 serves the electrical
  • FIG. 5 shows a schematic sectional view of a further semiconductor laser device with a laser bar 2, a heat sink 4 and a carrier body 3.
  • the laser bar 2 is soldered onto the heat sink 4 by means of a brazing layer 30 and the heat sink is soldered onto the carrier body 3 with a further brazing layer 31.
  • the preparation of the two braze joints is preferably carried out with a synchronous soldering.
  • the laser bar 2 comprises a growth substrate 32 and epitaxial layers 33, 34, which contain an active layer 34.
  • the epitaxial layers 33, 34 preferably contain at least one III-V semiconductor material, in particular In x GayAli_ x _yP, In x GayAli_ x _yN or In x Gay ⁇ l 1 _ ⁇ _yAs, each with O ⁇ x ⁇ l, O ⁇ y ⁇ l and x + y ⁇ 1
  • the laser bar 2 may emit light in the range of 630 to 645 nm wavelength.
  • advantageous light powers of 2 W to 10 W or more can be generated.
  • the laser bar 2 is preferably arranged "upside-down" on the heat sink 4, that is to say the growth substrate 32 is arranged on a side of the laser bar 2 facing away from the heat sink 4, and the active layer 34 is on a side of the laser bar 2 facing the heat sink 4 arranged. As a result, a direct coupling of the active layer 34 of the laser bar 2 with the heat sink 4 is achieved.
  • the heat sink 4 is arranged between the laser bar 2 and the carrier body 3 and fixed with the brazing layers 30, 31 on the laser bar 2 and on the carrier body 3. During the soldering process, temperatures of 350 0 C up to
  • brazing layers 30, 31 is preferably used gold tin.
  • the brazing layers are characterized in particular by a high cycle resistance.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)

Abstract

L'invention concerne un dispositif laser à semi-conducteur comportant un barreau laser (2), un porte-conducteurs flexible (10), un corps de support (3) en métal ou en alliage métallique et un dissipateur thermique (4) qui est disposé entre le corps de support (3) et le barreau laser (2). Le barreau laser (2) est mis en contact électrique par l'intermédiaire du porte-conducteurs flexible (10), et le corps de support (3) présente une épaisseur d'au moins 2 mm. L'invention concerne en outre un procédé de fabrication de ce dispositif laser à semi-conducteur selon lequel le barreau laser (2) est brasé sur le dissipateur thermique (4) au moyen d'une couche (30) de métal d'apport de brasage fort et le dissipateur thermique (4) est brasé sur le corps de support (3) au moyen d'une autre couche (31) de métal d'apport de brasage fort, par un processus de brasage synchrone.
EP08864364A 2007-12-21 2008-11-19 Dispositif laser à semi-conducteur Withdrawn EP2220731A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007062044A DE102007062044A1 (de) 2007-12-21 2007-12-21 Halbleiterlaservorrichtung
PCT/DE2008/001910 WO2009079968A1 (fr) 2007-12-21 2008-11-19 Dispositif laser à semi-conducteur

Publications (1)

Publication Number Publication Date
EP2220731A1 true EP2220731A1 (fr) 2010-08-25

Family

ID=40474205

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08864364A Withdrawn EP2220731A1 (fr) 2007-12-21 2008-11-19 Dispositif laser à semi-conducteur

Country Status (5)

Country Link
US (1) US8411715B2 (fr)
EP (1) EP2220731A1 (fr)
KR (1) KR20100102661A (fr)
DE (1) DE102007062044A1 (fr)
WO (1) WO2009079968A1 (fr)

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DE102015109323A1 (de) * 2015-06-11 2016-12-15 Osram Opto Semiconductors Gmbh Anordnung, System und Verfahren zum Betrieb solch einer Anordnung
US10739538B2 (en) 2017-01-31 2020-08-11 Fujikura Ltd. Light guiding device, laser module, and method for manufacturing light guiding device
US11291120B2 (en) * 2018-09-07 2022-03-29 Mitsubishi Electric Corporation Optical module
JP7426839B2 (ja) * 2020-01-28 2024-02-02 古河電気工業株式会社 光モジュールの製造方法
US20220291462A1 (en) * 2021-03-11 2022-09-15 Intel Corporation Method to couple light using integrated heat spreader

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US20110032962A1 (en) 2011-02-10
DE102007062044A1 (de) 2009-06-25
KR20100102661A (ko) 2010-09-24
US8411715B2 (en) 2013-04-02
WO2009079968A1 (fr) 2009-07-02

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