EP2238608A4 - Procédé et appareil de formation de nanomotif de grande superficie - Google Patents

Procédé et appareil de formation de nanomotif de grande superficie

Info

Publication number
EP2238608A4
EP2238608A4 EP08871196A EP08871196A EP2238608A4 EP 2238608 A4 EP2238608 A4 EP 2238608A4 EP 08871196 A EP08871196 A EP 08871196A EP 08871196 A EP08871196 A EP 08871196A EP 2238608 A4 EP2238608 A4 EP 2238608A4
Authority
EP
European Patent Office
Prior art keywords
nanomotive
large area
forming large
forming
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08871196A
Other languages
German (de)
English (en)
Other versions
EP2238608A1 (fr
Inventor
Boris Kobrin
Igor Landau
Boris Volf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rolith Inc
Original Assignee
Rolith Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rolith Inc filed Critical Rolith Inc
Publication of EP2238608A1 publication Critical patent/EP2238608A1/fr
Publication of EP2238608A4 publication Critical patent/EP2238608A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/60—Substrates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/24—Curved surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
EP08871196A 2008-01-22 2008-11-18 Procédé et appareil de formation de nanomotif de grande superficie Withdrawn EP2238608A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US1186108P 2008-01-22 2008-01-22
PCT/US2008/012901 WO2009094009A1 (fr) 2008-01-22 2008-11-18 Procédé et appareil de formation de nanomotif de grande superficie

Publications (2)

Publication Number Publication Date
EP2238608A1 EP2238608A1 (fr) 2010-10-13
EP2238608A4 true EP2238608A4 (fr) 2012-02-22

Family

ID=40901352

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08871196A Withdrawn EP2238608A4 (fr) 2008-01-22 2008-11-18 Procédé et appareil de formation de nanomotif de grande superficie

Country Status (10)

Country Link
EP (1) EP2238608A4 (fr)
JP (1) JP5102879B2 (fr)
KR (1) KR20110008159A (fr)
CN (2) CN101911249A (fr)
AU (1) AU2008348353A1 (fr)
CA (1) CA2709718A1 (fr)
MX (1) MX2010007954A (fr)
RU (1) RU2488188C2 (fr)
TW (1) TWI518027B (fr)
WO (1) WO2009094009A1 (fr)

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FR2871366A1 (fr) 2004-06-09 2005-12-16 Ceravic Soc Par Actions Simpli Implant expansible prothetique osseux
WO2008153674A1 (fr) 2007-06-09 2008-12-18 Boris Kobrin Procédé et appareil de gravure anisotrope
US8518633B2 (en) 2008-01-22 2013-08-27 Rolith Inc. Large area nanopatterning method and apparatus
US8192920B2 (en) 2008-04-26 2012-06-05 Rolith Inc. Lithography method
US8334217B2 (en) 2008-06-09 2012-12-18 Rolith Inc. Material deposition over template
CN101692151B (zh) * 2009-09-17 2011-12-28 复旦大学 一种基于软模板纳米压印技术的硅纳米线制作方法
AU2011205582A1 (en) * 2010-01-12 2012-08-30 Rolith, Inc. Nanopatterning method and apparatus
US9465296B2 (en) * 2010-01-12 2016-10-11 Rolith, Inc. Nanopatterning method and apparatus
CN101846880B (zh) * 2010-05-12 2012-05-30 上海交通大学 激发表面等离子体的纳米光刻方法
AT510217B1 (de) * 2010-08-13 2013-12-15 Hueck Folien Gmbh Verfahren zur partiellen mattierung von uv-lackschichten
CA2807639A1 (fr) * 2010-08-23 2012-03-01 Rolith, Inc. Masque pour lithographie de champ proche et sa fabrication
US9187839B2 (en) * 2010-10-07 2015-11-17 Michael Sheehy Process for the manufacture of sealed anodized aluminum components
CN102169819B (zh) * 2011-01-14 2013-01-30 中国科学院物理研究所 一种制备纳米金属结构的方法
WO2013049367A2 (fr) * 2011-09-30 2013-04-04 Rolith, Inc. Lithographie plasmonique utilisant un masque de phase
KR101260221B1 (ko) * 2011-12-01 2013-05-06 주식회사 엘지화학 마스크
US9720330B2 (en) * 2012-04-17 2017-08-01 The Regents Of The University Of Michigan Methods for making micro- and nano-scale conductive grids for transparent electrodes and polarizers by roll to roll optical lithography
US9481112B2 (en) 2013-01-31 2016-11-01 Metamaterial Technologies Usa, Inc. Cylindrical master mold assembly for casting cylindrical masks
US20150336301A1 (en) 2012-05-02 2015-11-26 Rolith, Inc. Cylindrical polymer mask and method of fabrication
US9782917B2 (en) 2013-01-31 2017-10-10 Metamaterial Technologies Usa, Inc. Cylindrical master mold and method of fabrication
KR102243425B1 (ko) * 2012-05-02 2021-04-22 메타머트리얼 테크놀러지스 유에스에이, 인크. 원통형 고분자 마스크 및 제작 방법
CN102759855A (zh) * 2012-07-17 2012-10-31 西安交通大学 一种单码道绝对式光栅尺辊压印模具制造方法
TWI474432B (zh) * 2012-11-15 2015-02-21 隆達電子股份有限公司 晶粒定位裝置、具有晶粒定位裝置的晶粒定位系統與發光二極體顯示板的晶粒定位方法
RU2593463C2 (ru) * 2013-12-23 2016-08-10 Станислав Викторович Хартов Способ получения проводящих сетчатых микро- и наноструктур и структура для его реализации
US9244356B1 (en) 2014-04-03 2016-01-26 Rolith, Inc. Transparent metal mesh and method of manufacture
KR101636696B1 (ko) 2014-05-23 2016-07-06 연세대학교 산학협력단 플렉서블 나노박막 광구조를 이용하는 가변 대면적 나노이미징 광학헤드 및 이미징 장치
WO2015183243A1 (fr) 2014-05-27 2015-12-03 Rolith, Inc. Éléments anti-contrefaçon et procédés de fabrication et de détection
KR102252049B1 (ko) 2014-08-04 2021-05-18 삼성디스플레이 주식회사 노광용 마스크, 이의 제조 방법 및 이를 이용한 기판의 제조 방법
KR102240761B1 (ko) 2015-01-29 2021-04-15 삼성디스플레이 주식회사 가변 마스크
WO2017030151A1 (fr) * 2015-08-19 2017-02-23 国立大学法人 東京大学 Procédé de fabrication de matrice
TWI579640B (zh) * 2015-10-15 2017-04-21 許銘案 薄膜光罩、貼合輔具、貼合與曝光輔助裝置及將一薄膜光罩貼合於一曲面基板的方法
CN106773531B (zh) * 2017-01-03 2020-06-16 京东方科技集团股份有限公司 一种纳米压印装置中的压印滚轮及纳米压印装置
CN106547044B (zh) * 2017-01-24 2019-03-01 深圳市华星光电技术有限公司 一种偏光片的加工设备及制造方法
CN106647192A (zh) * 2017-03-10 2017-05-10 深圳市华星光电技术有限公司 曝光设备
US10510287B2 (en) * 2017-08-07 2019-12-17 Industrial Technology Research Institute Transfer method of expanding pitches of device and an apparatus for performing the same
CN109901362B (zh) 2017-12-11 2022-04-19 中国科学院光电技术研究所 二次成像光学光刻方法和设备
EP3732047A4 (fr) * 2017-12-29 2021-09-29 3M Innovative Properties Company Surface nanostructurée non plane à motif et procédés d'impression pour produire cette surface
KR102096606B1 (ko) * 2018-08-29 2020-04-02 부산대학교 산학협력단 실린더 표면의 나노구조 임프린트를 위한 소프트 몰드 제조 및 이를 이용한 나노임프린트 공정 방법
GB2576922B (en) * 2018-09-06 2021-10-27 Stensborg As An optical engine for an imprinter
CN109668631B (zh) * 2018-12-11 2021-06-01 中国科学院光电技术研究所 一种大面积、低成本的超导纳米线单光子探测器的制备方法
CN111807320B (zh) * 2019-04-10 2024-07-09 青岛九环新越新能源科技股份有限公司 用于轧制纳米尺度孔结构材料的轧辊及轧辊组和轧制生产线
EP4132767A4 (fr) * 2020-04-07 2024-07-24 Smart Material Solutions, Inc. Matrice conforme à micromotif ou à nanomotif de lithographie par nano-impression et ses procédés de fabrication et d'utilisation
TWI765276B (zh) * 2020-06-12 2022-05-21 光群雷射科技股份有限公司 透鏡的轉印式製造方法及透鏡轉印層的製造方法

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See also references of WO2009094009A1 *

Also Published As

Publication number Publication date
EP2238608A1 (fr) 2010-10-13
WO2009094009A1 (fr) 2009-07-30
CA2709718A1 (fr) 2009-07-30
RU2010134893A (ru) 2012-02-27
TWI518027B (zh) 2016-01-21
KR20110008159A (ko) 2011-01-26
AU2008348353A1 (en) 2009-07-30
RU2488188C2 (ru) 2013-07-20
JP5102879B2 (ja) 2012-12-19
CN105171985A (zh) 2015-12-23
JP2011526069A (ja) 2011-09-29
MX2010007954A (es) 2010-11-05
TW200932666A (en) 2009-08-01
CN101911249A (zh) 2010-12-08

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