EP2260977B1 - Appareil de rodage - Google Patents
Appareil de rodage Download PDFInfo
- Publication number
- EP2260977B1 EP2260977B1 EP09007778A EP09007778A EP2260977B1 EP 2260977 B1 EP2260977 B1 EP 2260977B1 EP 09007778 A EP09007778 A EP 09007778A EP 09007778 A EP09007778 A EP 09007778A EP 2260977 B1 EP2260977 B1 EP 2260977B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- cooler
- fixture
- grinding
- grinder
- heated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Not-in-force
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
Definitions
- the present invention in general relates to an apparatus for grinding a heated plane of a cooler
- a cooling device including vapor chamber or heat pipe
- a thermally conductive seat When operated, a cooling device, including vapor chamber or heat pipe, is first combined to a thermally conductive seat and is arranged a plurality of cooling fins thereon.
- one side of the thermally conductive seat is contacted closely with the heating electronic component.
- the heat generated from the heating electronic component is thermally conducted.
- the heated face of a general cooler is usually configured as a matte, which looks flat and smooth after machined.
- the roughness and flatness on the surface of the heated face is still poor, making the heated face and the heating component unable to be contacted closely, thereby, limiting the thermal conduction between the heated face and the heating electronic component. Therefore, if the roughness and the flatness on the heated face can be further improved, the contact tightness between the heated face and the heating electronic component will be thereby increased, so is the thermally conductive effect.
- Japan patent application publication No. 2003-188320 discloses a heat sink and its manufacturing method.
- the heat sink is provided with a heat-receiving surface, which is formed in a recessed state.
- a thermo-conductive medium is provided between the heat receiving surface and a heating surface of an element to be cooled.
- US 6,074,283 A discloses a lapping apparatus comprising a lapping plate, a fixture combined to the grinder and a pressure plate for pressing and clamping the work piece.
- this grinder does not disclose to press and clamp the work piece via a point contact manner and to arrange the fixture to the grinder elastically by means of an elastic element and to elevate and lower the fixture elastically with respect to the grinding plate.
- US 6,435,496 B1 is concerned with a low-profile rocking lever clamp that is provided with a workpiece-engaging edge that may be formed as a knife edge, an angled edge, a serrated edge, straight contact edge, and a rounded edge.
- a workpiece-engaging edge may be formed as a knife edge, an angled edge, a serrated edge, straight contact edge, and a rounded edge.
- the clamp is provided with a machinable workpiece engaging edge.
- the clamp is used for fixing a workpiece on a support.
- the invention is mainly to provide a grinding apparatus for grinding a heated plane of a cooler, so that the roughness and flatness on the surface of the heated plane is improved. Furthermore, the thermally conductive effect is enhanced due to a better contact relative to the heating electronic component.
- An apparatus for grinding the heated plane of a cooler in which a heated plane of a cooler is ground includes a grinder and a fixture, in which the grinder has a grinding plate and an abrasive supply barrel that is arranged above the grinding plate for supplying abrasive into the gap between the heated plane and the grinding plate.
- the fixture is combined to the grinder and has at least one pressure plate for arranging the cooler. Thereby, the pressure plate presses and clamps the cooler, making the heated plane of the cooler contact closely to the abrasive.
- the roughness on the surface of the heated plane can be under Ra 0.03 ⁇ m and the flatness can be under 10 ⁇ m.
- the invention is to arrange a fixture to a grinder.
- the fixture presses and clamps a cooler via a point contact manner, whereby the heated plane of the cooler can possess a better flatness and surface roughness after being ground. Therefore, the contact tightness between the heated plane and the heating electronic component is increased, further generating a better effect of thermal conduction and enhancing the practicability of the invention.
- Fig. 1 is an assembled illustration of a grinder and a fixture according to the present invention.
- the invention is to provide a method for grinding the heated plane of a cooler, in which a grinder 10 having grinding plate 11 and fixing frame 15 is provided.
- the grinding plate 11 is actuated by a motor 12 to rotate.
- the fixing frame 15 is fixed onto the grinder 10 and is arranged an abrasive supply barrel 13 thereon.
- the abrasive supply barrel 13 is filled with abrasive and has a nozzle 131 to inject the abrasive onto the grinding plate 11.
- the grinder 10 is additionally connected a fixture 20.
- At least one elastic element 14 e.g., spring, etc.
- the elastic element 14 keeps a gap 100 between the fixture 20 and the grinder 11, such that the fixture 20 can be displaced upwardly and downwardly in an elastic way.
- a driving device 21, such as hydraulic cylinder or pneumatic cylinder, is arranged on the fixing frame 15. The driving device 21 is connected by abutting against the fixture. By elevating or lowering the driving device 21, the fixture 20 is moved toward or far away the grinding plate 11.
- Fig. 2 and Fig. 3 are an illustration and a cross-sectional view of a cooler that is pressed and clamped by a fixture.
- the fixture 20 can correspond to the grinding plate 11 and is shown as a disk configuration.
- the circumference of the fixture 20 is divided equally to project out a plurality of pressure plates 22, each of which is arranged a cooler 30.
- the bottom portion of the pressure plate 22 is arranged a pointed bulge 221 that is abutted against the center of the cooler 30, thereby, the fixture 20 pressing and clamping the cooler 30 via a point contact manner.
- the cooler 30 includes a thermally conductive seat 31, at least one heat pipe 32 and a plurality of cooling fins 33.
- the heat pipe 32 has a flat evaporation section 321 and a condensation section 322.
- the thermally conductive seat 31 is arranged at least one slot 310, into which the flat evaporation section 321 is inset.
- the plural cooling fins 33 are arranged by being passed through by the condensation section 322 of the heat pipe 32.
- the flat evaporation section 321 is formed as a heated plane 34 provided for contacting the heat source.
- a cooler 30 is separately arranged under each pressure plate 22 of the fixture 20.
- an abrasive 132 is injected into the gap 100 between the grinder 11 and the heated plane 34.
- the abrasive 132 includes grinding liquid 1321 and grinding particle 1322, as shown in Fig. 7 .
- the driving device 21 is actuated, making the fixture 20 lowered down and the pressure plate 22 separately press and clamp the top portion of each thermally conductive seat 31.
- the pointed bulge 221 presses and clamps at the center of the thermally conductive seat 31, making each heated plane 34 touch the abrasive 132 and closely contact the grinding plate 11.
- the motor 12 is actuated to bring along the grinding plate 11 to make a circular rotation.
- the abrasive 132 can uniformly grind the heated plane 34.
- the flatness of the heated plane 34 is improved to obtain a best value of roughness on the surface.
- the driving device 21 is actuated again and lifted up. In so doing, the fixture 20 is rid of press and clamp and lifted up due to the elastically recovering force of the elastic element 14. Finally, the heated plane 34 of the cooler 30 gets rid of the relative contact with the grinding plate 11.
- the coolers 30 can be moved to another grinding machine to undergo next grinding.
- a series of grinding can be made in a grinder by separately injecting different abrasives 132 with different particle sizes.
- a grinding process can first be undergone by injecting an abrasive 132 with larger particles. After the first grinding process, another abrasive 132 with finer particle is then injected to undergo a second grinding process. Following each grinding process, a finer abrasive 132 is injected until the required accuracy of the heated plane 34 is reached.
- the value of the surface roughness is under Ra 0.03 ⁇ m, preferably, between Ra 0.03 ⁇ m and Ra 0.01 ⁇ m and the flatness is between 0.3 ⁇ m and 10 ⁇ m.
- Fig. 8 is a flowchart diagram showing a grinding method , in which a heated plane of a cooler is ground.
- a grinder 10 and a fixture 20, with a grinding plate 11 is first provided (step 61); next, a cooler 30 with a heated plane 34 is further provided (step 62); then, an abrasive 132 is injected into the gap between the grinding plate 11 and the heated plane 34 (step 63); during a series of grindings, different abrasives 132 with different particle sizes can be injected and, in the meantime, the fixture 20 presses and clamps the cooler 30 via a point contact manner, for example, another side of the heated plane 34 being pressed and clamped, making the heated plane 34 contact closely to the grinding plate 11 to touch the abrasive 132 (step 64); finally, the grinding plate 11 is rotated, making the heated plane 34 undergone at least one grinding process (step 65).
- the thermally conductive seat 31 has a bottom plane 311 that is arranged at least one slot 310, into which the flat evaporation section 321 of the heat pipe 32 is inset.
- the flat evaporation sections 321 are the heated plane 34. Nonetheless, when the surface of the flat evaporation sections 321 is flush with the bottom plane 311 of the thermally conductive seat 31, the heated plane 34 then includes the flat evaporation sections 321 and the bottom plane 311.
- a delicate plane like mirror is obtained, which is provided for closely contacting a heating electronic component to dissipate the heat thereof.
- Fig. 10 showing another cooler with ground heated plane .
- This embodiment is substantially same as the first embodiment. The differences are that the bottom plane 311' of the thermally conductive seat 31' is only arranged an accommodating groove 310'; the cooler 30' has three heat pipes 32', each of which has a flat evaporation section 321' passing through a plurality of cooling fins 33'; the three heat pipes 32' arranged in parallel and pressed (clamped) in the accommodating groove 310' are flush with each other to form a flat evaporation section 321'; similarly, when the surface of the flat evaporation sections 321' is higher than the bottom plane 311' of the thermally conductive seat 31', the flat evaporation sections 321' are the heated plane 34'; on the other hand, when the surface of the flat evaporation sections 321' is flush with the bottom plane 311' of the thermally conductive seat 31', the heated plane 34' then includes the flat evaporation sections 321' and the bottom plane 311'.
- the cooler 40 is a flat-plate heat pipe 41 that has a flat evaporation section 411 and is arranged a plurality of cooling fins 43.
- the flat evaporation section 411 is the heated plane 42 that is ground to make its surface possess better surface roughness and flatness, thereby, the heated plane 42 contacting the heating electronic component further closely to increase its thermally conductive effect.
- the ground heated plane is an indispensably design for a cooler indeed, which may positively reach the expected usage objective for solving the drawbacks of the prior arts.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Claims (1)
- Appareil pour meuler un plan chauffé d'un dispositif de refroidissement, dans lequel un plan chauffé (34, 34', 42) d'un dispositif de refroidissement (30, 30', 40) est meulé, et qui inclut :une meuleuse (10) qui comprend une plaque de meulage (11) et un tambour d'alimentation d'abrasif (13) qui est agencé au-dessus de la plaque de meulage (11) pour alimenter un abrasif (132) dans un intervalle entre le plan chauffé (34, 34', 42) et la plaque de meulage (11) ; etune monture (20), qui est combinée à la meuleuse (10) et qui possède au moins une plaque de pression (22) pour agencer le dispositif de refroidissement (30, 30', 40) ;de sorte que la plaque de pression (22) qui presse et qui serre le dispositif de refroidissement (30, 30', 40), fait que le plan chauffé (34, 34', 42) vient en contact intime avec l'abrasif (132) caractérisé en ce queun cadre de fixation (15) est fixé à la meuleuse (10) et au moins un élément élastique (14) est agencé entre la monture (20) et la meuleuse (10) pour agencer élastiquement la monture (20) sur la meuleuse (10), et la meuleuse (10) inclut en outre un dispositif d'entraînement (21) agencé sur le cadre de fixation (15) et en butée contre la monture (20) pour entraîner la monture (20) qui est élevé et abaissé élastiquement pour presser et serrer le dispositif de refroidissement (30, 30', 40) et en correspondance de la plaque de meulage (11) la meuleuse (20) se présente sous une configuration en disque, dont une circonférence est divisée en parties égales pour se projeter hors d'une pluralité de plaques de pression (22), avec au moins un renflement pointu (221) agencé à une partie inférieure de chacune des plaques de pression, ce renflement pressant et serrant le dispositif de refroidissement (30, 30', 40), de telle façon que la plaque de pression (22) peut presser et serrer le dispositif de refroidissement (30, 30', 40) via un contact de type ponctuel, etl'abrasif (132) inclut un liquide abrasif (1321) et des particules abrasives (1322), et le tambour d'alimentation d'abrasif (13) possède une buse (131).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09007778A EP2260977B1 (fr) | 2009-06-12 | 2009-06-12 | Appareil de rodage |
| AT09007778T ATE534489T1 (de) | 2009-06-12 | 2009-06-12 | Läppvorrichtung |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP09007778A EP2260977B1 (fr) | 2009-06-12 | 2009-06-12 | Appareil de rodage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2260977A1 EP2260977A1 (fr) | 2010-12-15 |
| EP2260977B1 true EP2260977B1 (fr) | 2011-11-23 |
Family
ID=41302734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP09007778A Not-in-force EP2260977B1 (fr) | 2009-06-12 | 2009-06-12 | Appareil de rodage |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP2260977B1 (fr) |
| AT (1) | ATE534489T1 (fr) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06104817B2 (ja) * | 1990-10-09 | 1994-12-21 | 日本研磨材工業株式会社 | アルミナ―ジルコニア系ラップ研磨材とその製造方法及び研磨用組成物 |
| JP3982890B2 (ja) * | 1997-08-06 | 2007-09-26 | 富士通株式会社 | 研磨装置、この装置に用いられる研磨治具、及び、この研磨治具に取り付けられる被研磨物取付部材 |
| WO2001007205A1 (fr) | 1999-07-23 | 2001-02-01 | Phillips Steven E | Dispositif de fixation a levier basculant de faible epaisseur |
| JP2003188320A (ja) | 2001-12-17 | 2003-07-04 | Matsushita Electric Ind Co Ltd | 電子部品用ヒートシンクおよびその製造方法 |
-
2009
- 2009-06-12 EP EP09007778A patent/EP2260977B1/fr not_active Not-in-force
- 2009-06-12 AT AT09007778T patent/ATE534489T1/de active
Also Published As
| Publication number | Publication date |
|---|---|
| EP2260977A1 (fr) | 2010-12-15 |
| ATE534489T1 (de) | 2011-12-15 |
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