EP2267765A4 - Stützvorrichtung für einen resonator - Google Patents

Stützvorrichtung für einen resonator

Info

Publication number
EP2267765A4
EP2267765A4 EP09731400.9A EP09731400A EP2267765A4 EP 2267765 A4 EP2267765 A4 EP 2267765A4 EP 09731400 A EP09731400 A EP 09731400A EP 2267765 A4 EP2267765 A4 EP 2267765A4
Authority
EP
European Patent Office
Prior art keywords
resonator
support device
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09731400.9A
Other languages
English (en)
French (fr)
Other versions
EP2267765B1 (de
EP2267765A1 (de
Inventor
Seiya Nakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adwelds Corp
Original Assignee
Adwelds Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adwelds Corp filed Critical Adwelds Corp
Priority to PL09731400T priority Critical patent/PL2267765T3/pl
Publication of EP2267765A1 publication Critical patent/EP2267765A1/de
Publication of EP2267765A4 publication Critical patent/EP2267765A4/de
Application granted granted Critical
Publication of EP2267765B1 publication Critical patent/EP2267765B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B3/00—Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07221—Aligning
    • H10W72/07223—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07232—Compression bonding, e.g. thermocompression bonding
    • H10W72/07233—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
EP09731400.9A 2008-04-07 2009-04-06 Stützvorrichtung für einen resonator Active EP2267765B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL09731400T PL2267765T3 (pl) 2008-04-07 2009-04-06 Urządzenie podpierające rezonator

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008099390 2008-04-07
JP2008220890A JP4311582B1 (ja) 2008-04-07 2008-08-29 共振器の支持装置
PCT/JP2009/057068 WO2009125748A1 (ja) 2008-04-07 2009-04-06 共振器の支持装置

Publications (3)

Publication Number Publication Date
EP2267765A1 EP2267765A1 (de) 2010-12-29
EP2267765A4 true EP2267765A4 (de) 2016-09-14
EP2267765B1 EP2267765B1 (de) 2019-01-16

Family

ID=41036702

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09731400.9A Active EP2267765B1 (de) 2008-04-07 2009-04-06 Stützvorrichtung für einen resonator

Country Status (8)

Country Link
US (1) US8353442B2 (de)
EP (1) EP2267765B1 (de)
JP (1) JP4311582B1 (de)
KR (1) KR101161724B1 (de)
CN (1) CN101978484B (de)
HU (1) HUE042957T2 (de)
PL (1) PL2267765T3 (de)
WO (1) WO2009125748A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2327534A1 (de) * 2009-11-25 2011-06-01 Telsonic Holding AG Vorrichtung und Verfahren zum Verschweißen von Werkstücken
DE102010029395A1 (de) * 2010-05-07 2011-11-10 Telsonic Holding Ag Torsionssonotrode, Ultraschall-Schweißvorrichtung und Verfahren zur Herstellung einer Schweißverbindung mittels Ultraschall
JP5783811B2 (ja) * 2010-07-06 2015-09-24 キヤノン株式会社 成膜装置
JP5737562B2 (ja) * 2011-02-09 2015-06-17 株式会社アドウェルズ 共振器の支持装置
US8408445B1 (en) * 2011-09-30 2013-04-02 GM Global Technology Operations LLC Actively controlled vibration welding system and method
SG11201504793TA (en) * 2012-12-21 2015-07-30 Shinkawa Kk Flip chip bonder and method for correcting flatness and deformation amount of bonding stage
JP6063263B2 (ja) * 2013-01-15 2017-01-18 日産自動車株式会社 超音波接合装置
JP6236957B2 (ja) * 2013-07-23 2017-11-29 セイコーエプソン株式会社 電子部品搬送装置、電子部品検査装置および冷却システム
JP2015065328A (ja) * 2013-09-25 2015-04-09 東レエンジニアリング株式会社 ボンディング装置
US9136243B2 (en) * 2013-12-03 2015-09-15 Kulicke And Soffa Industries, Inc. Systems and methods for determining and adjusting a level of parallelism related to bonding of semiconductor elements
JP2015130414A (ja) * 2014-01-08 2015-07-16 東レエンジニアリング株式会社 自動ボンディング装置
DE102014101627A1 (de) * 2014-02-10 2015-08-13 Ms Spaichingen Gmbh Gestell für eine Maschine
US9573221B2 (en) * 2014-06-25 2017-02-21 GM Global Technology Operations LLC Elimination of tool adhesion in an ultrasonic welding process
WO2016059688A1 (ja) 2014-10-15 2016-04-21 日産自動車株式会社 超音波接合装置および超音波接合方法
JP5950994B2 (ja) * 2014-12-26 2016-07-13 株式会社新川 実装装置
US9755105B2 (en) * 2015-01-30 2017-09-05 Nichia Corporation Method for producing light emitting device
US9929121B2 (en) 2015-08-31 2018-03-27 Kulicke And Soffa Industries, Inc. Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
US10381321B2 (en) 2017-02-18 2019-08-13 Kulicke And Soffa Industries, Inc Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
DE102017107617A1 (de) * 2017-04-10 2018-10-11 Herrmann Ultraschalltechnik Gmbh & Co. Kg Verfahren zum intermittierenden Ultraschallbearbeiten einer Materialbahn
EP4403292A3 (de) * 2018-11-28 2024-11-06 Kulicke and Soffa Industries, Inc. Ultraschallschweisssysteme und verfahren zur verwendung davon
DE102018132837A1 (de) 2018-12-19 2020-06-25 Herrmann Ultraschalltechnik Gmbh & Co. Kg Ultraschallschweißanlage
DE102018132839A1 (de) * 2018-12-19 2020-06-25 Herrmann Ultraschalltechnik Gmbh & Co. Kg Ultraschallschweißanlage mit Abstützelement
DE102018132838A1 (de) * 2018-12-19 2020-06-25 Herrmann Ultraschalltechnik Gmbh & Co. Kg Ultraschallschweißanlage mit Halterung
JP7370190B2 (ja) * 2019-08-14 2023-10-27 太陽誘電株式会社 パネル及び電子機器
CN110508920B (zh) * 2019-09-19 2024-04-26 东莞市新玛博创超声波科技有限公司 一种脉冲电流发热的超声焊接装置
KR20210101357A (ko) * 2020-02-07 2021-08-19 삼성전자주식회사 볼 배치 시스템 및 기판 상에 볼을 배치하는 방법
JP7383166B2 (ja) * 2020-09-11 2023-11-17 アルプスアルパイン株式会社 接続構造
EP4443618A4 (de) * 2022-07-13 2025-12-31 Lg Energy Solution Ltd Adsorptionsapparat
US12317421B2 (en) * 2022-09-27 2025-05-27 Canon Kabushiki Kaisha Apparatus including a plurality of heads and a method of using the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696259A (en) * 1967-12-25 1972-10-03 Eiji Mori Device for distributing vibratory energy
US3845332A (en) * 1971-02-05 1974-10-29 Ontario Research Foundation Ultrasonic motor
JP2002067162A (ja) * 2000-08-29 2002-03-05 Kaijo Corp ボンディングヘッド及びこれを備えたボンディング装置
JP2002118152A (ja) * 2000-10-06 2002-04-19 Kaijo Corp ボンディングヘッド及びこれを備えたボンディング装置
US20070144680A1 (en) * 2005-12-28 2007-06-28 Tdk Corporation Horn, horn unit, and bonding apparatus using same
US20070199972A1 (en) * 2006-02-28 2007-08-30 Asm Assembly Automation Ltd. Transducer assembly for a bonding apparatus

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6318800A (ja) * 1986-07-09 1988-01-26 Nec Corp 水中超音波トランスジユ−サ
JP2583398B2 (ja) 1994-07-06 1997-02-19 日立化成商事株式会社 超音波接合装置
JP3410628B2 (ja) * 1997-04-21 2003-05-26 日本碍子株式会社 除塵装置のフィルタエレメントの保持構造
JP3487162B2 (ja) 1998-03-17 2004-01-13 松下電器産業株式会社 ボンディングツールおよびボンディング装置
JP3215084B2 (ja) 1998-04-28 2001-10-02 株式会社アルテクス 超音波振動接合用共振器
JP2002222834A (ja) 2001-01-26 2002-08-09 Arutekusu:Kk 超音波振動接合装置
JP2002343831A (ja) * 2001-05-16 2002-11-29 Kaijo Corp ボンディングヘッド及びこれを備えたボンディング装置
US7926180B2 (en) * 2001-06-29 2011-04-19 Mccrink Edward J Method for manufacturing gas and liquid storage tanks
US6970327B2 (en) * 2002-10-03 2005-11-29 Seagate Technology Llc Data storage device with damped load arm formed from Mn-Cu alloy composition
JP2005138181A (ja) * 2003-10-14 2005-06-02 Bondotekku:Kk 超音波振動制御方法及び装置
JP4645229B2 (ja) 2005-02-28 2011-03-09 コニカミノルタオプト株式会社 駆動装置
JP4213711B2 (ja) * 2005-12-28 2009-01-21 Ｔｄｋ株式会社 ホーン、ホーンユニット及びそれを用いたボンディング装置
JP4762934B2 (ja) * 2007-02-28 2011-08-31 株式会社新川 ホーン取付用アーム
JP2010188489A (ja) * 2009-02-20 2010-09-02 Covalent Materials Corp 接合ウェーハの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3696259A (en) * 1967-12-25 1972-10-03 Eiji Mori Device for distributing vibratory energy
US3845332A (en) * 1971-02-05 1974-10-29 Ontario Research Foundation Ultrasonic motor
JP2002067162A (ja) * 2000-08-29 2002-03-05 Kaijo Corp ボンディングヘッド及びこれを備えたボンディング装置
JP2002118152A (ja) * 2000-10-06 2002-04-19 Kaijo Corp ボンディングヘッド及びこれを備えたボンディング装置
US20070144680A1 (en) * 2005-12-28 2007-06-28 Tdk Corporation Horn, horn unit, and bonding apparatus using same
US20070199972A1 (en) * 2006-02-28 2007-08-30 Asm Assembly Automation Ltd. Transducer assembly for a bonding apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009125748A1 *

Also Published As

Publication number Publication date
JP2009272599A (ja) 2009-11-19
US8353442B2 (en) 2013-01-15
KR101161724B1 (ko) 2012-07-04
WO2009125748A1 (ja) 2009-10-15
US20110036897A1 (en) 2011-02-17
PL2267765T3 (pl) 2019-07-31
HUE042957T2 (hu) 2019-07-29
KR20100135869A (ko) 2010-12-27
JP4311582B1 (ja) 2009-08-12
CN101978484B (zh) 2012-07-25
EP2267765B1 (de) 2019-01-16
CN101978484A (zh) 2011-02-16
EP2267765A1 (de) 2010-12-29

Similar Documents

Publication Publication Date Title
EP2267765A4 (de) Stützvorrichtung für einen resonator
EP2440087A4 (de) Siebvorrichtung für einen behälter
EP2338758A4 (de) Reisehilfsinstrument
EP2303153A4 (de) Biopsievorrichtung
EP2128545A4 (de) Kühlvorrichtung für kühlfahrzeug
EP2017112A4 (de) Hochdrückvorrichtung
FR2939099B1 (fr) Dispositif electromecanique multifonctions pour atterrisseur
FR2928492B1 (fr) Materiau pour un dispositif electrochimique.
FR2947239B1 (fr) Dispositif de transmission pour bicyclette
EP2246193A4 (de) Element zur wiederherstellung einer abfallflüssigkeit
EP2147400A4 (de) Anti-abfrage-system für eine tragbare vorrichtung
EP2055655A4 (de) Fahrrahmenvorrichtung für eine fördereinrichtung
EP2189079A4 (de) Halter für ein tragbares gerät
EP2467217A4 (de) Einsatz für eine mikrobielle reinigungsvorrichtung
FR2921141B1 (fr) Dispositif perfectionne de jonction pour bandes transportables
EP2357722A4 (de) Synchronmaschinen-starteinrichtung
EP2303424A4 (de) Fallleitung für eine gas-flüssigkeits-kontaktvorrichtung
FR2924596B1 (fr) Dispositif de fixation pour ligamentoplastie.
FR2934005B1 (fr) Dispositif de guidage pour occulteur a rideau
FR2915902B1 (fr) Dispositif de desinsectisation.
FR2934300B1 (fr) Dispositif entrebailleur pour ouvrant
FR2964911B1 (fr) Dispositif de basculement d'un pare-brise
FR2958956B1 (fr) Dispositif de support pour maconnerie
FR2930423B1 (fr) Dispositif pour la regeneration osseuse
FR2933723B1 (fr) Dispositif de coffrage

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20100907

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA RS

DAX Request for extension of the european patent (deleted)
REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602009056731

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01L0021600000

Ipc: H01L0021670000

RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20160817

RIC1 Information provided on ipc code assigned before grant

Ipc: B23K 20/10 20060101ALI20160810BHEP

Ipc: B06B 3/00 20060101ALI20160810BHEP

Ipc: H01L 23/00 20060101ALI20160810BHEP

Ipc: H01L 21/67 20060101AFI20160810BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20180315

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20180726

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

Ref country code: CH

Ref legal event code: NV

Representative=s name: NOVAGRAAF INTERNATIONAL SA, CH

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602009056731

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1090348

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190215

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1090348

Country of ref document: AT

Kind code of ref document: T

Effective date: 20190116

REG Reference to a national code

Ref country code: HU

Ref legal event code: AG4A

Ref document number: E042957

Country of ref document: HU

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190516

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190416

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190417

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190416

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190516

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602009056731

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20190430

26N No opposition filed

Effective date: 20191017

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190406

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190430

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20190406

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PL

Payment date: 20210330

Year of fee payment: 13

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20210421

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20210422

Year of fee payment: 13

Ref country code: HU

Payment date: 20210428

Year of fee payment: 13

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20210421

Year of fee payment: 13

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20190116

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: CH

Payment date: 20220421

Year of fee payment: 14

REG Reference to a national code

Ref country code: NL

Ref legal event code: MM

Effective date: 20220501

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20220406

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220501

Ref country code: HU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220407

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220406

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220406

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230430

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20230430

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20250428

Year of fee payment: 17

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602009056731

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01L0021670000

Ipc: H10P0072000000