EP2270242A4 - Kupferlegierungsmaterial für elektrische und elektronische vorrichtungen sowie elektrische und elektronische bauteile - Google Patents

Kupferlegierungsmaterial für elektrische und elektronische vorrichtungen sowie elektrische und elektronische bauteile

Info

Publication number
EP2270242A4
EP2270242A4 EP09728058A EP09728058A EP2270242A4 EP 2270242 A4 EP2270242 A4 EP 2270242A4 EP 09728058 A EP09728058 A EP 09728058A EP 09728058 A EP09728058 A EP 09728058A EP 2270242 A4 EP2270242 A4 EP 2270242A4
Authority
EP
European Patent Office
Prior art keywords
electric
copper alloy
alloy material
electronic
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09728058A
Other languages
English (en)
French (fr)
Other versions
EP2270242A1 (de
EP2270242B1 (de
Inventor
Koji Sato
Kiyoshige Hirose
Hiroshi Kaneko
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2270242A1 publication Critical patent/EP2270242A1/de
Publication of EP2270242A4 publication Critical patent/EP2270242A4/de
Application granted granted Critical
Publication of EP2270242B1 publication Critical patent/EP2270242B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP09728058.0A 2008-03-31 2009-03-30 Kupferlegierungsmaterial für elektrische oder elektronische vorrichtungen, verfahren zu dessen herstellung und bauteil Not-in-force EP2270242B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008092315 2008-03-31
PCT/JP2009/056576 WO2009123159A1 (ja) 2008-03-31 2009-03-30 電気電子機器用銅合金材料および電気電子部品

Publications (3)

Publication Number Publication Date
EP2270242A1 EP2270242A1 (de) 2011-01-05
EP2270242A4 true EP2270242A4 (de) 2012-06-27
EP2270242B1 EP2270242B1 (de) 2014-06-04

Family

ID=41135533

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09728058.0A Not-in-force EP2270242B1 (de) 2008-03-31 2009-03-30 Kupferlegierungsmaterial für elektrische oder elektronische vorrichtungen, verfahren zu dessen herstellung und bauteil

Country Status (6)

Country Link
US (1) US20110017357A1 (de)
EP (1) EP2270242B1 (de)
JP (1) JP4653240B2 (de)
KR (1) KR101114116B1 (de)
CN (1) CN101981213B (de)
WO (1) WO2009123159A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102639732B (zh) * 2009-12-02 2017-08-04 古河电气工业株式会社 铜合金板材
US8821655B1 (en) 2010-12-02 2014-09-02 Fisk Alloy Inc. High strength, high conductivity copper alloys and electrical conductors made therefrom
JP5773929B2 (ja) * 2012-03-28 2015-09-02 株式会社神戸製鋼所 曲げ加工性及び耐応力緩和特性に優れる電気電子部品用銅合金板
CN107664870A (zh) * 2012-08-20 2018-02-06 深圳迈辽技术转移中心有限公司 液晶显示模块
US9560154B2 (en) * 2014-12-11 2017-01-31 Facebook, Inc. Systems and methods for providing information regarding future content
JP6385383B2 (ja) * 2016-03-31 2018-09-05 Ｊｘ金属株式会社 銅合金板材および銅合金板材の製造方法
CN106011522A (zh) * 2016-08-03 2016-10-12 苏州市虎丘区浒墅关弹簧厂 一种弹簧用高弹性铜合金材料
KR102119552B1 (ko) * 2016-12-02 2020-06-05 후루카와 덴키 고교 가부시키가이샤 구리 합금 선재 및 구리 합금 선재의 제조 방법
JP7193941B2 (ja) * 2018-07-26 2022-12-21 Koa株式会社 シャント抵抗器およびそれを用いた電流検出装置
JP7525322B2 (ja) * 2020-07-29 2024-07-30 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ｃｏ－Ｓｉ系銅合金板材、その製造方法および導電ばね部材
JP2023100244A (ja) * 2022-01-05 2023-07-18 Ｄｏｗａメタルテック株式会社 Ｃｕ－［Ｎｉ，Ｃｏ］－Ｓｉ系銅合金板材、その製造方法、通電部品および放熱部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020119071A1 (en) * 2000-12-15 2002-08-29 Takayuki Usami High-mechanical strength copper alloy
US20050263218A1 (en) * 2004-05-27 2005-12-01 The Furukawa Electric Co., Ltd. Copper alloy
EP2143810A1 (de) * 2007-03-26 2010-01-13 The Furukawa Electric Co., Ltd. Kupferlegierung für elektrische/elektronische vorrichtung und herstellungsverfahren dafür

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4154100B2 (ja) 1999-12-17 2008-09-24 日鉱金属株式会社 表面特性の優れた電子材料用銅合金およびその製造方法
JP2004180161A (ja) 2002-11-28 2004-06-24 Nippon Telegraph & Telephone East Corp 通信モード調整装置、通信モード調整方法、通信モード調整プログラム、および通信モード調整プログラムを記録した記録媒体
JP4100629B2 (ja) * 2004-04-16 2008-06-11 日鉱金属株式会社 高強度高導電性銅合金
JP4959141B2 (ja) 2005-02-28 2012-06-20 Ｄｏｗａホールディングス株式会社 高強度銅合金
JP4566048B2 (ja) 2005-03-31 2010-10-20 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP5247021B2 (ja) * 2005-11-28 2013-07-24 Ｊｘ日鉱日石金属株式会社 曲げ部のしわを低減させたＣｕ−Ｎｉ−Ｓｉ系合金板・条及びその製造方法
JP4986499B2 (ja) * 2006-04-26 2012-07-25 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ合金すずめっき条の製造方法
JP2008092315A (ja) 2006-10-03 2008-04-17 Ricoh Co Ltd 画像形成装置の遠隔管理システム
JP4357536B2 (ja) * 2007-02-16 2009-11-04 株式会社神戸製鋼所 強度と成形性に優れる電気電子部品用銅合金板
CN101646792B (zh) * 2007-03-30 2012-02-22 Jx日矿日石金属株式会社 电子材料用Cu-Ni-Si系合金

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020119071A1 (en) * 2000-12-15 2002-08-29 Takayuki Usami High-mechanical strength copper alloy
US20050263218A1 (en) * 2004-05-27 2005-12-01 The Furukawa Electric Co., Ltd. Copper alloy
EP2143810A1 (de) * 2007-03-26 2010-01-13 The Furukawa Electric Co., Ltd. Kupferlegierung für elektrische/elektronische vorrichtung und herstellungsverfahren dafür

Also Published As

Publication number Publication date
CN101981213A (zh) 2011-02-23
KR101114116B1 (ko) 2012-03-13
JPWO2009123159A1 (ja) 2011-07-28
WO2009123159A1 (ja) 2009-10-08
EP2270242A1 (de) 2011-01-05
JP4653240B2 (ja) 2011-03-16
EP2270242B1 (de) 2014-06-04
CN101981213B (zh) 2012-11-14
US20110017357A1 (en) 2011-01-27
KR20100132044A (ko) 2010-12-16

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