EP2295879A1 - Climatiseur d'air basé sur une puce de refroidissement thermoélectrique - Google Patents
Climatiseur d'air basé sur une puce de refroidissement thermoélectrique Download PDFInfo
- Publication number
- EP2295879A1 EP2295879A1 EP09172997A EP09172997A EP2295879A1 EP 2295879 A1 EP2295879 A1 EP 2295879A1 EP 09172997 A EP09172997 A EP 09172997A EP 09172997 A EP09172997 A EP 09172997A EP 2295879 A1 EP2295879 A1 EP 2295879A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- heat dissipation
- cooling
- air conditioner
- fin
- thermoelectric cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 72
- 230000017525 heat dissipation Effects 0.000 claims abstract description 61
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000000498 cooling water Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims description 16
- 230000000694 effects Effects 0.000 abstract description 8
- 239000000470 constituent Substances 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 230000005676 thermoelectric effect Effects 0.000 abstract description 4
- 239000002826 coolant Substances 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 229920001342 Bakelite® Polymers 0.000 description 1
- 241000282414 Homo sapiens Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/02—Self-contained room units for air-conditioning, i.e. with all apparatus for treatment installed in a common casing
- F24F1/032—Self-contained room units for air-conditioning, i.e. with all apparatus for treatment installed in a common casing characterised by heat exchangers
- F24F1/0323—Self-contained room units for air-conditioning, i.e. with all apparatus for treatment installed in a common casing characterised by heat exchangers by the mounting or arrangement of the heat exchangers
Definitions
- the present invention generally relates to an air conditioner, and more particularly to an air conditioner that uses semiconductor thermoelectric cooling chips combined with other cooling components.
- a traditional air conditioner is composed of coolant and a compressor. It is well known that the use of coolant may cause damage to the ozonosphere of the Earth and leads to greenhouse effect that changes the climate of the Earth and also hurts the natural environment, eventually affecting the living of human beings. Further, the compressors that are currently used in the traditional air conditioners make the air conditioners bulky, leading to inconvenience of transportation and installation of the air conditioner. Further, the compressor consumes a great amount of electrical power and makes substantial noise. These are the drawbacks of the traditional air conditioners that can be further improved.
- thermoelectric cooling chip based air conditioner which uses a semiconductor thermoelectric cooling chip as the primary constituent component.
- the thermoelectric cooling chip may induce cold and heat respectively on two surfaces thereof through thermoelectric effect.
- the surface that generates cold uses a cooling fin and a cooling water circulation piping to store the cold in the cooling fin.
- a control interface of a host device is provided and comprises a temperature setting switch that controls a desired temperature, whereby cold air is brown out by a cold air fan to effect cooling of an indoor space.
- the surface that generates heat uses a heat dissipation fin and a heat dissipation water circulation piping to effect removal of heat therefrom and a heat dissipation fan is then used to discharge air.
- the air conditioner when put into operation, may efficiently lower the room temperature of the indoor space to effect air cooling and it uses no compressor and coolant, so that the overall structure of the air conditioner is simplified, making the air conditioners compact and light for easy transportation and installation.
- the operation of the air conditioner is power saving and generates less noise, so that it offers a great help to conservation of environments.
- the present invention is novel and has never been proposed before, showing the advantages of novelty and improvements and offering excellent industrial values.
- the present invention provides an air conditioner that is operated essentially with semiconductor thermoelectric cooling chips 1 as primary constituent components thereof.
- Each of the thermoelectric cooling chips 1 has a first surface serving as a cooling surface to which a cooling panel 11 is coupled and a second, opposite surface serving as a heating surface to which a heat dissipation panel 12 is coupled.
- the assembly of the thermoelectric cooling chips 1 and the cooling panel 11 and the heat dissipation panel 12 coupled thereto is set inside an enclosure 2 to divide an interior space of the enclosure 2 into a cooling chamber 21 and a heating chamber 22.
- the cooling chamber 21 has a cold air outlet opening 23.
- the heating chamber 22 has an air intake opening 24 and a hot air discharge opening 25.
- the enclosure 2 has a back that forms an air conduit 26.
- the cooling chamber 21 receives therein a cooling fin 3 that is coupled to the cooling panel 11 and is provided with a cooling water circulation piping 31.
- the cooling chamber 21 comprises a cold air fan 32 at a location corresponding to the cold air outlet opening 23.
- the heating chamber 22 receives therein a heat dissipation fin 4 that is coupled to the heat dissipation panel 12 and is provided with a heat dissipation water circulation piping 41 and is further coupled to an enhanced heat dissipation fin 42 and an enhanced heat dissipation water circulation piping 43 mounted to the enhanced heat dissipation fin 42, and also contains an air intake fan 44 that is coupled to the enhanced heat dissipation fin 42 for drawing in air through the air conduit 26 to facilitate heat dissipation effected in the heat dissipation fin 4 and the enhanced heat dissipation fin 42.
- the heat dissipation fin 4 is provided with a heat dissipation fan 45 at a location corresponding to the hot air discharge opening 25.
- a water inlet 33 and a water outlet 48 of the cooling water circulation piping 31 provided on the cooling fin 3, a water inlet 46 and a water outlet 49 of the heat dissipation water circulation piping 41 provided on the heat dissipation fin 4, and a water inlet 47 and a water outlet 50 of the enhanced heat dissipation water circulation piping 43 provided on the enhanced heat dissipation fin 42 are respectively connected to pumps 5, whereby cooling water or medium and heat dissipation water or medium that are respectively filled in the cooling water circulation piping 31, the heat dissipation water circulation piping 41, and the enhanced heat dissipation water circulation piping 43 can be circulated as being driven by the pumps 5 to realize efficient cooling and efficient heat dissipation respectively.
- thermoelectric cooling chip based air conditioner of the present invention can be installed at any suitable location in an indoor space, not limited to a window of the indoor space as that applied to the conventional air conditioners.
- the heat dissipation panel 12 comprises a bakelite pad 6 to reduce and control the temperature of the heat dissipation panel 12 that radiates heat.
- the present invention is actuated and controlled by a power switch 10 and a temperature setting switch 20 that can be controlled through a host device (not shown) in order to induce cold and heat on the two surfaces of the thermoelectric cooling chip 1 through thermoelectric effect.
- the surface that generates cold uses the cooling fin 3 and the cooling water circulation piping 31 to store the cold in the cooling fin, whereby when the room temperature reaches the temperature set by the temperature setting switch 20, the cold air fan 32 blows the cold out of the cold air outlet opening 23 to fill into the indoor space.
- the surface that generates heat uses the heat dissipation fin 4 and the heat dissipation water circulation piping 41 and the enhanced heat dissipation fin 42 and the enhanced heat dissipation water circulation piping 43, and the fresh air that is drawn from the air conduit by the air intake fan 44 to effect removal of heat and the air is then discharged through the hot air discharge opening 25 by being driven by the heat dissipation fan 45, where the temperature of the discharged air may be close to or even lower than the room temperature of the indoor space, whereby there will be no need to discharge the air outdoors.
- thermoelectric cooling chip based air conditioner uses semiconductor thermoelectric cooling chips as primary constituent components.
- Each thermoelectric cooling chip may induce cold and heat respectively on two surfaces thereof through thermoelectric effect.
- the cold and the heat are set in two spaced chambers formed inside an enclosure and respectively carry out absorption of heat through a cooling fin and a cooling water circulation piping coupled to the cooling fin and heat dissipation fins and heat dissipation water circulation pipes coupled to the heat dissipation fins to effect cooling.
- a cold air fan and a heat dissipation fan are then used to blow out the cold and to discharge the heat to realize air conditioning.
- the structure of the air conditioner of the present invention uses no compressor and coolant, so that the weight of the air conditioner is lessened and is easy to transport and install and the operation of the air conditioner is power saving and noise reduced, whereby environmental protection can be realized.
- the constituent components of the present invention can be used to construct a heater or a combined device of air conditioner and heater, a refrigerator, and other heating/cooling devices.
- any cooling/heating device that is made up of primary components of thermoelectric cooling chips and cooling and heat dissipation parts, including air conditioners, heaters, air cooling/heating devices, refrigerators, and other heating/cooling devices is considered within the scope of the present invention.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100702380A CN101995064A (zh) | 2009-08-26 | 2009-08-26 | 致冷晶体冷气机 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2295879A1 true EP2295879A1 (fr) | 2011-03-16 |
Family
ID=43033305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP09172997A Withdrawn EP2295879A1 (fr) | 2009-08-26 | 2009-10-14 | Climatiseur d'air basé sur une puce de refroidissement thermoélectrique |
Country Status (2)
| Country | Link |
|---|---|
| EP (1) | EP2295879A1 (fr) |
| CN (1) | CN101995064A (fr) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107395529A (zh) * | 2017-09-22 | 2017-11-24 | 长沙准光里电子科技有限公司 | 一种新型网络交换机 |
| US20180023823A1 (en) * | 2016-07-19 | 2018-01-25 | Chuan-Sheng Chen | Semiconductor-based air conditioning device |
| CN110454898A (zh) * | 2019-08-27 | 2019-11-15 | 浙江来斯奥电气有限公司 | 一种半导体导风凉霸 |
| CN114909736A (zh) * | 2022-03-25 | 2022-08-16 | 北京小米移动软件有限公司 | 桌面空调 |
| CN115164303A (zh) * | 2022-07-06 | 2022-10-11 | 武汉理工大学 | 一种基于温差电制冷技术降低空调能耗的方法 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111189141A (zh) * | 2018-11-15 | 2020-05-22 | 东富电器股份有限公司 | 智能型冷热风扇 |
| CN113864975B (zh) * | 2021-09-29 | 2022-09-27 | 珠海格力电器股份有限公司 | 变频空调的低温制冷控制方法、装置和空调 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3040538A (en) * | 1960-04-15 | 1962-06-26 | Westinghouse Electric Corp | Thermoelectric air conditioning unit |
| DE1426976A1 (de) * | 1964-01-22 | 1969-10-30 | Nikolaus Laing | Umlaufwaermepumpe |
| US4279292A (en) * | 1978-09-29 | 1981-07-21 | The United States Of America As Represented By The Secretary Of The Navy | Charge coupled device temperature gradient and moisture regulator |
| US20040177621A1 (en) * | 2001-04-18 | 2004-09-16 | Tsung-Chih Chen | Air conditioner temperature exchanger |
| EP1767874A1 (fr) * | 2005-09-23 | 2007-03-28 | Chuan Sheng Chen | Systeme de climatisation pourvue d'elements thermoelctriques |
| EP1923641A2 (fr) * | 2006-11-14 | 2008-05-21 | Orra Corporation | Appareil et procédé de climatisation d'air |
-
2009
- 2009-08-26 CN CN2009100702380A patent/CN101995064A/zh active Pending
- 2009-10-14 EP EP09172997A patent/EP2295879A1/fr not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3040538A (en) * | 1960-04-15 | 1962-06-26 | Westinghouse Electric Corp | Thermoelectric air conditioning unit |
| DE1426976A1 (de) * | 1964-01-22 | 1969-10-30 | Nikolaus Laing | Umlaufwaermepumpe |
| US4279292A (en) * | 1978-09-29 | 1981-07-21 | The United States Of America As Represented By The Secretary Of The Navy | Charge coupled device temperature gradient and moisture regulator |
| US20040177621A1 (en) * | 2001-04-18 | 2004-09-16 | Tsung-Chih Chen | Air conditioner temperature exchanger |
| EP1767874A1 (fr) * | 2005-09-23 | 2007-03-28 | Chuan Sheng Chen | Systeme de climatisation pourvue d'elements thermoelctriques |
| EP1923641A2 (fr) * | 2006-11-14 | 2008-05-21 | Orra Corporation | Appareil et procédé de climatisation d'air |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180023823A1 (en) * | 2016-07-19 | 2018-01-25 | Chuan-Sheng Chen | Semiconductor-based air conditioning device |
| US10386085B2 (en) * | 2016-07-19 | 2019-08-20 | Chuan-Sheng Chen | Semiconductor-based air conditioning device |
| CN107395529A (zh) * | 2017-09-22 | 2017-11-24 | 长沙准光里电子科技有限公司 | 一种新型网络交换机 |
| CN110454898A (zh) * | 2019-08-27 | 2019-11-15 | 浙江来斯奥电气有限公司 | 一种半导体导风凉霸 |
| CN114909736A (zh) * | 2022-03-25 | 2022-08-16 | 北京小米移动软件有限公司 | 桌面空调 |
| CN115164303A (zh) * | 2022-07-06 | 2022-10-11 | 武汉理工大学 | 一种基于温差电制冷技术降低空调能耗的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101995064A (zh) | 2011-03-30 |
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| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR |
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| 17P | Request for examination filed |
Effective date: 20110224 |
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| 17Q | First examination report despatched |
Effective date: 20120615 |
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| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
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| 18D | Application deemed to be withdrawn |
Effective date: 20121026 |