EP2324074A4 - Radiateur thermique composé d une combinaison d'un complexe graphite-métal et d'un matériau extrudé à base d'aluminium - Google Patents

Radiateur thermique composé d une combinaison d'un complexe graphite-métal et d'un matériau extrudé à base d'aluminium

Info

Publication number
EP2324074A4
EP2324074A4 EP08876944A EP08876944A EP2324074A4 EP 2324074 A4 EP2324074 A4 EP 2324074A4 EP 08876944 A EP08876944 A EP 08876944A EP 08876944 A EP08876944 A EP 08876944A EP 2324074 A4 EP2324074 A4 EP 2324074A4
Authority
EP
European Patent Office
Prior art keywords
graphite
aluminum
combination
metal complex
material based
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08876944A
Other languages
German (de)
English (en)
Other versions
EP2324074A1 (fr
Inventor
Nobuyuki Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Material Technologies Co Ltd
Applied Nanotech Inc
Original Assignee
Advanced Material Technologies Co Ltd
Applied Nanotech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Material Technologies Co Ltd, Applied Nanotech Inc filed Critical Advanced Material Technologies Co Ltd
Publication of EP2324074A1 publication Critical patent/EP2324074A1/fr
Publication of EP2324074A4 publication Critical patent/EP2324074A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C37/00—Cast-iron alloys
    • C22C37/04—Cast-iron alloys containing spheroidal graphite
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP08876944A 2008-09-11 2008-12-29 Radiateur thermique composé d une combinaison d'un complexe graphite-métal et d'un matériau extrudé à base d'aluminium Withdrawn EP2324074A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008233604A JP5335339B2 (ja) 2008-09-11 2008-09-11 黒鉛一金属複合体とアルミニウム押出材の組合せからなる放熱体。
PCT/US2008/088461 WO2010030307A1 (fr) 2008-09-11 2008-12-29 Radiateur thermique composé d’une combinaison d'un complexe graphite-métal et d'un matériau extrudé à base d'aluminium

Publications (2)

Publication Number Publication Date
EP2324074A1 EP2324074A1 (fr) 2011-05-25
EP2324074A4 true EP2324074A4 (fr) 2012-06-13

Family

ID=42005380

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08876944A Withdrawn EP2324074A4 (fr) 2008-09-11 2008-12-29 Radiateur thermique composé d une combinaison d'un complexe graphite-métal et d'un matériau extrudé à base d'aluminium

Country Status (5)

Country Link
US (1) US20110259570A1 (fr)
EP (1) EP2324074A4 (fr)
JP (1) JP5335339B2 (fr)
KR (1) KR20110085978A (fr)
WO (1) WO2010030307A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110027603A1 (en) * 2008-12-03 2011-02-03 Applied Nanotech, Inc. Enhancing Thermal Properties of Carbon Aluminum Composites
US20110147647A1 (en) * 2009-06-05 2011-06-23 Applied Nanotech, Inc. Carbon-containing matrix with additive that is not a metal
US20100310447A1 (en) * 2009-06-05 2010-12-09 Applied Nanotech, Inc. Carbon-containing matrix with functionalized pores
JP5622465B2 (ja) * 2010-07-22 2014-11-12 ローム株式会社 Ｌｅｄ電球およびｌｅｄ電球の製造方法
CN102114495A (zh) * 2010-11-25 2011-07-06 深圳市天电光电科技有限公司 Led散热器制造方法
KR200483474Y1 (ko) * 2011-01-19 2017-05-18 그라프텍 인터내셔널 홀딩스 인코포레이티드 Led 전구를 위한 열 솔루션
DE102011081687A1 (de) * 2011-08-26 2013-02-28 Robert Bosch Gmbh Halbleiterbauelement mit einem Kühlkörper
JP2014047127A (ja) 2012-09-04 2014-03-17 Toyo Tanso Kk 金属−炭素複合材、金属−炭素複合材の製造方法及び摺動部材
JP6164632B2 (ja) * 2013-01-11 2017-07-19 株式会社アカネ 炭素基金属複合材料の製造方法
US10914539B2 (en) 2013-05-15 2021-02-09 Osram Sylvania Inc. Two piece aluminum heat sink
KR101301624B1 (ko) * 2013-07-05 2013-08-29 (주) 동양에이.케이코리아 카본이 함유된 알루미늄 또는 알루미늄 합금 압출재의 제조방법 및 이를 이용한 카본이 함유된 알루미늄 또는 알루미늄 합금 압출재
CN105916348A (zh) * 2016-03-25 2016-08-31 华为技术有限公司 一种电子设备中框配件及其制造方法
CN106531874B (zh) * 2016-11-30 2018-10-12 南京劲峰洋光电科技有限公司 一种新型散热绝缘复合材料及其制备方法
CN107022690B (zh) * 2017-05-03 2019-03-08 合肥工业大学 一种通过压力浸渗铝合金制备铝/碳基复合材料的方法
CN114761588A (zh) 2019-12-17 2022-07-15 Ｕｂｅ株式会社 石墨-铜复合材料、使用了该石墨-铜复合材料的散热器构件、和石墨-铜复合材料的制造方法
KR102298678B1 (ko) * 2020-04-22 2021-09-07 부경대학교 산학협력단 전기 자동차의 파워트레인용 냉각 파이프의 제조방법 및 이에 의해 제조된 냉각 파이프

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
US20020096313A1 (en) * 2000-08-28 2002-07-25 Alusuisse Technology & Management Ltd. Heat sink and process and molding tool for production of same
US20020195229A1 (en) * 2001-06-25 2002-12-26 Teh-Ming Hsieh Heatsink design for uniform heat dissipation
US20030024611A1 (en) * 2001-05-15 2003-02-06 Cornie James A. Discontinuous carbon fiber reinforced metal matrix composite
WO2003051552A1 (fr) * 2001-12-19 2003-06-26 Showa Denko K.K. Outil d'extrusion, procede pour fabriquer des articles extrudes comportant des ailettes, dissipateur thermique
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US6779593B1 (en) * 2003-04-30 2004-08-24 Hewlett-Packard Development Company, L.P. High performance cooling device with heat spreader
US20040190245A1 (en) * 2003-03-31 2004-09-30 Murli Tirumala Radial heat sink with skived-shaped fin and methods of making same
EP1477467A1 (fr) * 2003-05-16 2004-11-17 Hitachi Metals, Ltd. Matériau composite à haute conductivité thermique et faible coefficient d'expansion thermique, et puits thermique.
US20080073070A1 (en) * 2006-09-26 2008-03-27 Chin-Hu Kuo Highly efficient heat dissipating composite material and a heat dissipating device made of such material
DE102006056988A1 (de) * 2006-10-08 2008-04-10 General Electric Co. Wärmeübertragungs-Kompositmaterial, zugehörige Vorrichtung und Verfahren
US20080128067A1 (en) * 2006-10-08 2008-06-05 Momentive Performance Materials Inc. Heat transfer composite, associated device and method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5520976A (en) * 1993-06-30 1996-05-28 Simmonds Precision Products Inc. Composite enclosure for electronic hardware
US6009938A (en) * 1997-12-11 2000-01-04 Eastman Kodak Company Extruded, tiered high fin density heat sinks and method of manufacture
US6680015B2 (en) * 2000-02-01 2004-01-20 Cool Options, Inc. Method of manufacturing a heat sink assembly with overmolded carbon matrix
JP2002184922A (ja) * 2000-12-12 2002-06-28 Ntt Advanced Technology Corp 複合型放熱部材
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
KR20050084845A (ko) * 2002-10-11 2005-08-29 치엔 민 성 탄소질 열 확산기 및 관련 방법
US20050189647A1 (en) * 2002-10-11 2005-09-01 Chien-Min Sung Carbonaceous composite heat spreader and associated methods
JP4344934B2 (ja) * 2003-05-16 2009-10-14 日立金属株式会社 高熱伝導・低熱膨張複合材及び放熱基板並びにこれらの製造方法
US20050238835A1 (en) * 2004-04-24 2005-10-27 Chien-Min Sung Graphite composite thermal sealants and associated methods
JP4015146B2 (ja) * 2004-10-12 2007-11-28 古河電気工業株式会社 フィンを備えたヒートシンクおよびその製造方法
JP4940883B2 (ja) * 2005-10-31 2012-05-30 豊田合成株式会社 発光装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5146981A (en) * 1991-11-14 1992-09-15 Digital Equipment Corporation Substrate to heatsink interface apparatus and method
US20020096313A1 (en) * 2000-08-28 2002-07-25 Alusuisse Technology & Management Ltd. Heat sink and process and molding tool for production of same
US20030024611A1 (en) * 2001-05-15 2003-02-06 Cornie James A. Discontinuous carbon fiber reinforced metal matrix composite
US20020195229A1 (en) * 2001-06-25 2002-12-26 Teh-Ming Hsieh Heatsink design for uniform heat dissipation
WO2003051552A1 (fr) * 2001-12-19 2003-06-26 Showa Denko K.K. Outil d'extrusion, procede pour fabriquer des articles extrudes comportant des ailettes, dissipateur thermique
US20030131970A1 (en) * 2002-01-17 2003-07-17 Carter Daniel P. Heat sinks and method of formation
US20040190245A1 (en) * 2003-03-31 2004-09-30 Murli Tirumala Radial heat sink with skived-shaped fin and methods of making same
US6779593B1 (en) * 2003-04-30 2004-08-24 Hewlett-Packard Development Company, L.P. High performance cooling device with heat spreader
EP1477467A1 (fr) * 2003-05-16 2004-11-17 Hitachi Metals, Ltd. Matériau composite à haute conductivité thermique et faible coefficient d'expansion thermique, et puits thermique.
US20080073070A1 (en) * 2006-09-26 2008-03-27 Chin-Hu Kuo Highly efficient heat dissipating composite material and a heat dissipating device made of such material
DE102006056988A1 (de) * 2006-10-08 2008-04-10 General Electric Co. Wärmeübertragungs-Kompositmaterial, zugehörige Vorrichtung und Verfahren
US20080128067A1 (en) * 2006-10-08 2008-06-05 Momentive Performance Materials Inc. Heat transfer composite, associated device and method

Also Published As

Publication number Publication date
WO2010030307A1 (fr) 2010-03-18
KR20110085978A (ko) 2011-07-27
EP2324074A1 (fr) 2011-05-25
JP2010067842A (ja) 2010-03-25
JP5335339B2 (ja) 2013-11-06
US20110259570A1 (en) 2011-10-27

Similar Documents

Publication Publication Date Title
EP2462377A4 (fr) Dispositif d'éclairage à semi-conducteur avec dissipateur thermique perfectionné
EP1977636A4 (fr) Dissipateur de chaleur à microcanal fabriqué à partir de matériaux de graphite
EP2397455A4 (fr) Substrat comprenant un composite d'aluminium/graphite, élément de dissipation de chaleur le comprenant et élément luminescent de del
EP2565920A4 (fr) Dispositif de dissipation de chaleur et dispositif à semiconducteur
EP1913633A4 (fr) Circuit integre emballe avec dissipation thermique amelioree
EP2334216A4 (fr) Pieds à perfusion pouvant être stockés
DE502007003871D1 (de) Stromschiene mit Wärmeableitung
EP2120263A4 (fr) Plaque de base à structure de dissipation de chaleur, module utilisant une plaque de base à structure de dissipation de chaleur, et procédé de fabrication d'une plaque de base à structure de dissipation de chaleur
EP3347951A4 (fr) Équipement montable sur bâti pourvu d'un module de dissipation thermique élevée, et logement d'émetteur-récepteur à refroidissement accru
EP2602291A4 (fr) Composition de peinture à dissipation de chaleur et à haut rendement utilisant un matériau à base de carbone
EP2128286A4 (fr) Matériau d'alliage d'aluminium et feuille de brasage d'alliage d'aluminium
EP2059839A4 (fr) Reduction de la charge thermique sur une tete optique
PL2254940T3 (pl) Radiator z przewodzących materiałów z tworzyw sztucznych
EP2160757A4 (fr) Transistor mosfet à grille métallique à forte permittivité avec capacité parasite réduite
EP2084481A4 (fr) Échangeur de chaleur à plaque
EP2130932A4 (fr) Production de matériaux composés à haute conductivité thermique
BRPI0909860A2 (pt) dispositivo de resfriamento de um gabinete de computador e instalação de informática
EP2179858A4 (fr) Étiquette fragile résistante à la chaleur
EP2718624A4 (fr) Dispositif d'éclairage à puits thermique multicouche
EP2921566A4 (fr) Matériau plaqué d'alliage d'aluminium et échangeur de chaleur pourvu d'un tube qui est moulé à partir d'un matériau plaqué d'alliage d'aluminium
FI20075497A0 (fi) Jäähdytyselementti
GB2453502B (en) Heat exchanger with cooling fins
ITPD20060465A1 (it) Materiali aerogel a base di ossidi metallici e compositi degli stessi
EP2168743A4 (fr) Extrudeuse de fusion-malaxage à désaération
FR2920898B1 (fr) Installation de gestion d'une base de donnees

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20110302

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA MK RS

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ADVANCED MATERIAL TECHNOLOGY CO., LTD.

Owner name: APPLIED NANOTECH, INC.

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: ADVANCED MATERIAL TECHNOLOGIES CO., LTD.

Owner name: APPLIED NANOTECH, INC.

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20120511

RIC1 Information provided on ipc code assigned before grant

Ipc: C08K 3/04 20060101AFI20120508BHEP

Ipc: F28D 21/00 20060101ALI20120508BHEP

Ipc: H01L 21/48 20060101ALI20120508BHEP

Ipc: H01L 23/373 20060101ALI20120508BHEP

Ipc: C08K 3/08 20060101ALI20120508BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20121211