EP2394093A2 - Module lumineux - Google Patents

Module lumineux

Info

Publication number
EP2394093A2
EP2394093A2 EP10704340A EP10704340A EP2394093A2 EP 2394093 A2 EP2394093 A2 EP 2394093A2 EP 10704340 A EP10704340 A EP 10704340A EP 10704340 A EP10704340 A EP 10704340A EP 2394093 A2 EP2394093 A2 EP 2394093A2
Authority
EP
European Patent Office
Prior art keywords
light
protective layer
module
led
strip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10704340A
Other languages
German (de)
English (en)
Inventor
Steffen Strauss
Giovanni Scilla
Christine Maier
Robert Kraus
Thomas Donauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osram GmbH
Original Assignee
Osram GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram GmbH filed Critical Osram GmbH
Publication of EP2394093A2 publication Critical patent/EP2394093A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/22—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape
    • F21S4/24—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports flexible or deformable, e.g. into a curved shape of ribbon or tape form, e.g. LED tapes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a lighting module and to a method for producing a lighting module.
  • LED Flex strips are equipped with light emitting diodes equipped flexible bands (LED Flex strips), which are divisible and equipped with a self-adhesive back.
  • LED Flex strips the LINEARlight Flex range from OSRAM GmbH is known, in which an LED strip wound on a roll is available (eg LMlX series), with the total module comprising 120 to 600 LEDs depending on the design.
  • the basic dimension of the total module (L x W x H) is 8400 mm x 10 mm x 3 mm.
  • the basic dimension of the smallest unit with 10 LEDs (L x W) is 140 mm x 10 mm.
  • the total module can be divided into units of 10 LEDs or their multiples without loss of function of the sections by careful cutting.
  • the minimum bending radius of the LED strip is 2 cm.
  • the LED tape has a self-adhesive back. When mounted on a metallic pad, to avoid short circuits, provide insulation between the pad and the LED strip at the location of solder contacts of the substrate of the
  • LED tapes of the LED Flex series completely with a protective lacquer, for example by means of an APL lacquer from Electrolube.
  • the luminosity of the LED strip may be adversely affected due to aging of the protective layer on the semiconductor light source.
  • protective sheaths for LED tapes of the LED Flex series silicone hoses (Neo Neon) or a casting (Vossloh Schwabe) are known. There are restrictions with regard to a possible total length of these protective sheathings (which are particularly important in the case of a casting solution). is limited) and the modular divisibility and the associated required sealing at the interface.
  • the lighting module has a light strip, in particular LED strip, with a strip-shaped flexible substrate, wherein at least on one side, in particular a front side, of the substrate at least one semiconductor light source, in particular LED, is applied.
  • the light strip may also have electrical and / or electronic components for lighting operation of the semicon terlichtán (s), for. B. resistors and driver blocks.
  • the substrate may also be considered as a flexible tape-shaped board.
  • the light-emitting module is coated on its front side with a protective layer in such a way that at least one radiation emission surface of the at least one semiconductor light source is free of protective layer. This ensures that the radiation of the semiconductor light source is negatively affected neither in the short nor long term by an aging protective layer.
  • the light-emitting module is therefore selectively covered locally with the protective layer.
  • the light-emitting module can be coated with a protective layer in the form of a lacquer.
  • a paint for example, the paints "DSL 1600 E-FLZ / 75" and "UG 10.173" Peters company in question.
  • the paint can be applied for example by means of a so-called. Film-coating or spray painting.
  • the protective layer furthermore makes it possible to cover the conductor tracks running on the substrate and to provide electronic components there covering them so that they can be laminated.
  • the lacquer can be white in particular (for example for luminaire and backlight applications) or black (for example for display applications).
  • the varnish can be transparent, in particular for luminaire and backlight applications.
  • the lacquer may have a thermal expansion coefficient of the order of magnitude of a coefficient of thermal expansion of a base material of the substrate, advantageously in a range of approximately 10 ppm / ° C. This avoids stress due to differential thermal expansion which could lead to cracking.
  • the light module may have a base for attachment to a rear side of the light strip, in particular a flexible base.
  • the light module can be protected in its attachment to its back or bottom, and attachment to rougher or dirty or damp substrates is easily possible. This can be difficult to achieve by coating, especially painting, in practice.
  • the pad can also ensure safe protection of the outer edges of the substrate, which is also difficult or impossible to realize by coating, in particular painting, Alone.
  • the substrate lies flat on the surface.
  • the document may in particular be adhesive tape on the flexible substrate, z. As a flexible circuit board to be glued. In particular, if the pad protrudes at least about 0.5 mm to 2 mm on each side, this can be co-lacquered.
  • a good heat conducting ( ⁇ ⁇ 15 W / (m-K)) material z.
  • a metal or a good heat-conducting plastic particularly preferably aluminum or an aluminum / plastic composite material.
  • a metal-plastic composite film ensures electrical insulation, while a metal layer or film provides a very good bond, which can be designed for better stability and higher tear resistance than an aluminum-plastic composite film.
  • other good conductive metals or metal mixtures can be used, for.
  • z. B. can use a glassed plastic film.
  • the backing is not thicker than 150 ⁇ m. Due to its thinness, the film is very flexible and contributes little to the rigidity of the protective covering. Also, a good thermal connection of the semiconductor light sources to a substrate for mounting the light module can be ensured.
  • the pad may protrude laterally over the luminous band, at least in sections-preferably continuously-(ie be wider than the luminous band, wherein the pad is covered with the protective layer at least at a transition region to the luminous band.
  • the pad around the light strip around is crimped, so that surrounds from behind around the edges of the light strip around to the front.
  • the protective layer on the front side can at least partially be covered by the protective layer over the coated substrate, which enables a mechanically particularly stable and tight covering.
  • the beaded base need not be at least partially covered by the protective layer; then the protective layer may be applied to the surface of the front side not covered by the bead. As a result, a thermal insulation can be avoided by the protective layer.
  • the beaded base can at least partially cover the protective layer on the front side, which enables a mechanically stable and tight covering.
  • priming or activation of the surfaces to be covered may be provided below the pad.
  • an adhesive tape for fixing the light module z. B. a double-sided tape.
  • a punched and deep-drawn cover foil can be glued as a protective layer on the flexible light strip (and optionally on the backside foil).
  • the method is for manufacturing a light module and includes at least the following steps: (a) applying a plurality of LED ribbons to a common base; (b) coating the tapes and (c) separating the tapes with their respective supports.
  • the LED strips can be glued, soldered, vulcanized, for example at a defined distance (preferably 1 mm to 4 mm) parallel to the common base. be siert, laminated, etc.
  • the cover can be connected to the pad generally by any known suitable connection methods, e.g. B. by means of rolling, clamping, perforating, in particular micro perforating, Fa cens, fusion bonding (welding), in particular by ultrasonic welding, stapling, etc.
  • Particularly preferred is sticking the fluorescent tape on the substrate, especially by sticking a, in particular self-adhesive, underside of the Substrate of the light strip on the surface.
  • the process times can be considerably shortened.
  • the entire composite can be cured or sufficiently cured, for. B. by means of a heat treatment.
  • the singulation of the composite can be carried out by any suitable means, e.g. Example by means of cutting, perforating, lasers, or other separation methods.
  • the spaces between the light bands can be painted over the entire area before separating. Alternatively you can
  • the coating can optionally be done after the separation and also after a possible mortar.
  • the LED strips can be filled before or after singulation. If the LED strips already in the panel, ie, after applying the light strips on the substrate, fitted and then separated, they can also be painted before separating. Then the back or at least the flank is not painted, which may be sufficient for some applications.
  • the simple design allows an endless belt production (reel-to-reel production).
  • the lighting module is still separable, in particular cutting separable.
  • FIG 1 shows in cross-section (FIG IA) and in plan view (FIG IB) a light module with a painted light strip according to a first embodiment
  • FIG. 2 shows in FIGS. 2A to 2D, in cross-section, lighting modules according to further embodiments
  • FIGS. 3A and 3B shows in FIGS. 3A and 3B, in cross-section, lighting modules according to still further embodiments
  • FIG. 4 outlines steps in the production sequence of a lighting module, in particular according to a lighting module according to one of FIGS. 1 to 3.
  • FIG. 1A shows a cross-section of a light module in the form of an LED module 1 with a light strip in the form of an LED strip 2.
  • the LED strip 2 has a flexible substrate 3, on the top or front side 4 exemplarily a white conversion LED. 5 is mounted. Not shown, but also mounted on the top 4 are electronic components such as resistors and current drivers.
  • the underside of the substrate 3 has a double-sided adhesive tape 6.
  • the LED strip 2 can be designed, for example, as an LED strip of the LINEARlight Flex series from OSRAM.
  • the flexible LED tape 2 is applied with the adhesive tape 6 on a band-shaped pad 7 in the form of a thin aluminum foil made of pure aluminum or an aluminum composite material and adheres there.
  • the underlay 7 is so thin and so flexible (not very rigid) that it does not significantly affect the flexibility of the LED strip 2. Since the width of the base 7 here is about 2 mm larger than that of the substrate 3, a superficial region 8 results on both sides.
  • the resist layer 9 covers most of the top of the LED module 1, including a majority of a side surface of the LED 5, but not a radiating surface 10 of the LED 5.
  • FIG IB shows the LED module 1 of FIG IA in plan view of the top.
  • the upper surface is almost completely coated with varnish 9, as indicated by the striped area, and covers the substrate 3 and the substrate 7. Only the radiating surfaces 10 of the LEDs 5 extending equidistantly along the LED band 2 are not covered.
  • the coating is opaque white and thus laminated on the substrate (circuit board) 3 printed conductors and electronic components (o. Fig.).
  • the LED strip 2 is reliably protected except for the emitting surfaces 10, while a radiation characteristic does not suffer from the coating 9, in particular when the coating 9 ages.
  • FIG 2A shows in cross section an LED module 11 according to a further embodiment with an LED strip 2 as shown in FIG 1, which now has no pad and the surface 4 is covered with the paint 9.
  • both the sides or edges 12 of the substrate 3 and the underside 13 of the substrate 3 are free of paint, as their painting is very complex.
  • FIG. 2B shows, in cross-section, an LED module 14 according to a further embodiment with an LED strip 2 as in FIG. 1.
  • this surface is applied flatly to a base 7 with an underside.
  • the pad 7 has on both sides of a lateral edges of the substrate 3 to the front embracing flanging 15 on.
  • the lacquer layer 9 has been applied on the upper side both to the flanging 15 and to the substrate 3 and thus prevents inter alia the penetration of harmful substances and particles between the base 7 and the substrate 3.
  • FIG. 2C shows an LED module 16 in which, in contrast to the LED module 14 from FIG. 2, the coating 9 is applied on the upper side only to the substrate 3 and the side walls of the LED5, but not to the base 7 or its flanging 15.
  • FIG. 2D shows an LED module 17, in which, in contrast to the LED module 14 from FIG. 2, the flanging 15 covers the protective lacquer 9 applied on the upper side to the substrate 3 and the side walls of the LED 5.
  • This embodiment is particularly advantageous for a process flow since the LED module 17 can be painted in the panel (see also FIG. 4). After singling, the corners of the base 7 are bent to the bead 15 upwards.
  • FIG. 3A shows an LED module 18, in which, in contrast to the LED modules of Figure 2, the LED 5 is covered by a protective cover 19 at least on the upper side transparent.
  • the protective cover 19 lies laterally next to the LED 5 on the substrate 3.
  • the flanging 15 surrounds both the substrate 3 and the part of the protective cover 19 lying thereon. The protective cover 19 is thereby fixed on the LED tape 2 and protects the LED tape.
  • FIG. 3B shows an LED module 20 in which, in contrast to the LED module 18 from FIG. 3A, the flanging 15 and an optionally exposed region 21 of the part of the protective cover 19 resting on the substrate 3 are covered on the upper side with the protective lacquer 9.
  • the translucent protective cover 19 may be at least partially translucent, ie, transparent or translucent, z. B. completely translucent.
  • the light-permeable protective cover 19 is translucent in a near region of a semiconductor light source and otherwise opaque to light. As a result, a higher-quality appearance can be achieved, in which essentially only the semiconductor light sources are visible from the outside and not the printed conductors or further components.
  • a light-permeable protective cover 19 with bulges for a semiconductor light source is preferred in which the bulge is transparent, in particular transparent, and the light-permeable protective cover 19 is otherwise opaque to light.
  • the translucent protective sheath 19 preferably has at least one optical element for guiding the light emitted by the LED band 2 to improve the optical radiation property. This is preferably located above a position provided for the LED or LEDs 5, in particular in the tip of a bulge for an LED 5.
  • FIG. 4 outlines various stations of a production line for the reel-to-reel production of an LED module, the production progressing from left to right.
  • the production line has an endless drum 22 with four LED strips 2 rolled up separately thereon.
  • the LED strips 2 are led to a lamination station 23, where they are applied in parallel to the base 7 by gluing.
  • the composite of LED strips 2 and pad 7 is also called a panel.
  • the base 7 also comes from a - not shown here - endless role.
  • Behind the lamination station 23 follows a painting station 24, in which the panel 2.7 is sprayed over the entire surface with lacquer on the top side.
  • the paint is in one following curing station 25 at least partially cured.
  • the panel 2.7 is cut to separate the LED modules (not shown).
  • the pad can also be relatively stiff, z. B. by a higher thickness.
  • the lighting device may also have LED modules with a plurality of individual LED chips ('LED clusters'), which together may result in a white mixed light, eg. B. in 'cold white' or 'warm white'.
  • the LED cluster preferably comprises light-emitting diodes which shine in the primary colors red (R), green (G) and blue (B).
  • R red
  • G green
  • B blue
  • one or more amber LEDs 'amber' may also be present to produce a warm white hue.
  • these can preferably be controlled such that the LED module radiates selectively in a tunable RGB color range.
  • any other suitable semiconductor emitter may be used, such as a laser diode.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

L'invention concerne un module lumineux comportant une bande lumineuse dotée d'un support souple en forme de bande, au moins une source lumineuse semiconductrice, notamment une DEL, étant montée sur une face frontale du support. Le module lumineux est pourvu d'une couche protectrice de façon qu'au moins une surface de rayonnement de la ou des sources lumineuses semiconductrices soit à découvert.
EP10704340A 2009-02-04 2010-01-25 Module lumineux Withdrawn EP2394093A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009007430A DE102009007430A1 (de) 2009-02-04 2009-02-04 Leuchtmodul
PCT/EP2010/050792 WO2010089218A2 (fr) 2009-02-04 2010-01-25 Module lumineux

Publications (1)

Publication Number Publication Date
EP2394093A2 true EP2394093A2 (fr) 2011-12-14

Family

ID=42235357

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10704340A Withdrawn EP2394093A2 (fr) 2009-02-04 2010-01-25 Module lumineux

Country Status (5)

Country Link
US (1) US8994039B2 (fr)
EP (1) EP2394093A2 (fr)
CN (1) CN102308144B (fr)
DE (1) DE102009007430A1 (fr)
WO (1) WO2010089218A2 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010049333B4 (de) 2010-10-22 2012-07-05 Jürgen Hackert Verfahren und Vorrichtung zur Herstellung einer bandförmigen Struktur zur Aufnahme von elektronischen Bauteilen
CN103363363B (zh) * 2012-03-30 2016-03-23 展晶科技(深圳)有限公司 发光二极管灯条
DE102013208400A1 (de) 2012-05-07 2013-11-07 Ifm Electronic Gmbh LED-Band
US20130307013A1 (en) * 2012-05-15 2013-11-21 Avago Technlogies Ecbu Ip (Singapore) Pte. Ltd. Light emitting device with dark layer
WO2014210439A1 (fr) * 2013-06-27 2014-12-31 Dentsply International Inc. Système de photopolymérisation à base de film de led mince
DE102013220764A1 (de) * 2013-10-15 2015-04-16 Ronny Kirschner Beleuchtungseinrichtung mit LED-Band
DE102014106164A1 (de) * 2014-05-02 2015-11-05 Itz Innovations- Und Technologiezentrum Gmbh Wärmeleitende Optik
DE102014222861A1 (de) 2014-11-10 2016-05-12 Ronny Kirschner Beleuchtungseinrichtung mit einem gespannten Spannelement und einem LED-Band
DE202014105375U1 (de) 2014-11-10 2014-11-18 Ronny Kirschner Beleuchtungseinrichtung mit einem gespannten Spannelement und einem LED-Band
US12364074B2 (en) 2015-03-31 2025-07-15 Creeled, Inc. Light emitting diodes and methods
US12294042B2 (en) * 2015-03-31 2025-05-06 Creeled, Inc. Light emitting diodes and methods with encapsulation
CN105204187A (zh) * 2015-09-11 2015-12-30 厦门红信息电子科技有限公司 一种镜片七色变换led变色眼镜
CN105156927B (zh) * 2015-09-28 2022-04-26 欧普照明股份有限公司 一种照明模组及照明灯具
DE202017007378U1 (de) * 2016-10-12 2021-03-26 Gerhard Kager Leuchtdiodenstreifen und Leuchtdiodenband
CN206771065U (zh) * 2017-04-20 2017-12-19 深圳迪亚士照明科技有限公司 单面防护led灯条

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4173035A (en) * 1977-12-01 1979-10-30 Media Masters, Inc. Tape strip for effecting moving light display
US4439818A (en) * 1983-02-25 1984-03-27 Scheib Joseph J Flexible light display with evenly distributed illumination
DE4412772A1 (de) 1994-04-14 1995-10-19 Airsigna Gmbh & Co Kg Beleuchtungseinrichtung insbesondere Notbeleuchtungseinrichtung für das Innere von Wasserfahrzeugen
DE19627856A1 (de) 1996-07-11 1998-01-15 Happich Fahrzeug & Ind Teile Beleuchtungsleiste und Verfahren zur Herstellung
US7026660B2 (en) * 2003-04-25 2006-04-11 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Interconnection for organic devices
DE10350099A1 (de) 2003-10-27 2005-06-09 Kwl-Lighting Gmbh Leuchtvorrichtung und Verfahren zur Herstellung einer Leuchtvorrichtung
US7858994B2 (en) 2006-06-16 2010-12-28 Articulated Technologies, Llc Solid state light sheet and bare die semiconductor circuits with series connected bare die circuit elements
KR100880812B1 (ko) 2004-03-29 2009-01-30 아티큘레이티드 테크놀러지스 엘엘씨 롤-투-롤 제조된 광 시트 및 캡슐화된 반도체 회로디바이스들
US20060062899A1 (en) * 2004-09-17 2006-03-23 Eastman Kodak Company Method of discontinuous stripe coating
US7368307B2 (en) * 2005-06-07 2008-05-06 Eastman Kodak Company Method of manufacturing an OLED device with a curved light emitting surface
US7556405B2 (en) * 2005-07-28 2009-07-07 Velcro Industries B.V. Mounting light emitting diodes
DE202006002728U1 (de) * 2006-02-21 2006-04-13 Wiltec Wildanger Technik Gmbh Leuchtmittel
TWI325644B (en) * 2007-01-03 2010-06-01 Chipmos Technologies Inc Chip package and manufacturing thereof

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2010089218A2 *

Also Published As

Publication number Publication date
CN102308144A (zh) 2012-01-04
DE102009007430A1 (de) 2010-08-12
CN102308144B (zh) 2014-07-23
US20110291125A1 (en) 2011-12-01
US8994039B2 (en) 2015-03-31
WO2010089218A3 (fr) 2011-01-06
WO2010089218A2 (fr) 2010-08-12

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