EP2483455A2 - Procédé de revêtement électrochimique d'un substrat par dépôt à la brosse et dispositif de mise en oeuvre - Google Patents

Procédé de revêtement électrochimique d'un substrat par dépôt à la brosse et dispositif de mise en oeuvre

Info

Publication number
EP2483455A2
EP2483455A2 EP10754293A EP10754293A EP2483455A2 EP 2483455 A2 EP2483455 A2 EP 2483455A2 EP 10754293 A EP10754293 A EP 10754293A EP 10754293 A EP10754293 A EP 10754293A EP 2483455 A2 EP2483455 A2 EP 2483455A2
Authority
EP
European Patent Office
Prior art keywords
particles
substrate
layer
transmitter
electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10754293A
Other languages
German (de)
English (en)
Inventor
Axel Arndt
Jens Dahl Jensen
Ursus KRÜGER
Stefan Lechner
Marinko Lekic-Ninic
Uwe Pyritz
Manuela Schneider
Heike Springborn
Peter Wieser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Primetals Technologies Germany GmbH
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP2483455A2 publication Critical patent/EP2483455A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/20—Electroplating using ultrasonic waves
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers

Definitions

  • a roller is coated as the substrate, which is rotated after putting the transmitter un ⁇ ter this.
  • a relative movement between the substrate and the carrier can be achieved by simply rotating the roller, whereby a uniform coating of the roller is made possible.
  • the described preferred orientation of CNT and / or BNNT in the circumferential direction of the roller can take place. This has the advantage, for example, for an increase in strength through the coating, that this takes place in the circumferential direction.
  • a particular embodiment of the invention provides that the layer is produced in several layers electrochemically, wherein in each case before applying a layer by means of brush plating over the second conduit system particles are applied to the surface to be coated.
  • the layer is produced in several layers electrochemically, wherein in each case before applying a layer by means of brush plating over the second conduit system particles are applied to the surface to be coated.
  • the device for brush plating is therefore designed roller-shaped, with a sponge-like roller is used as the transmitter.
  • the conduit system is provided, which has the shape of an elongated cylinder which extends in the center of the transmitter.
  • This tubular conduit system has a plurality of holes which open into the material of the Matterträ ⁇ gers.
  • the mouth of the second conduit system must be arranged in front of the transfer surface.
  • an application of the particles seen in the direction of relative movement between the transmitter with the transfer surface and the substrate to be coated can be done before. That is, the second conduit system is guided with the mouth in front of the transfer surface of the transmitter.
  • this can also be summarized physically in the device to form an assembly.
  • the production of a dispersion consisting of the coating electrolyte and the particles to be incorporated can advantageously be avoided by supplying the particles in the second line system.
  • the use of Netzmit ⁇ stuffs can be avoided as mentioned above, which may adversely affect the coating result.
  • the second line system is in engagement with a generator for ultrasound.
  • the generator is engaged with the second conduit system in that the ultrasound generated by the generator affects at least the second conduit system.
  • the ultrasound advantageously effects that particles which are conveyed in the second line system do not agglomerate.
  • FIG. 1 schematically shows the sequence of an embodiment of the method according to the invention using an exemplary embodiment of the device according to the invention
  • the conduit module 13 comprises a first conduit system 21 for the electrolyte and a second conduit system 22 with a mouth 22a for the particles. These are independent of ⁇ each other, ie, that the first conduit system through the electrolyte reservoir 19 and independently of the second conduit system 22 can be fed from the particle reservoir 20 GE.
  • a dispersant for the particles for example, a volatile liquid, which evaporates quickly after the application of the particles, or a liquid having the composition of the electrolyte are used.
  • the particles may preferably be conveyed as powder.
  • the generators 28 are arranged directly in the third conduit system 31. These can be formed for example by piezo crystals. Furthermore, a Dosie ⁇ tion of the powder contained in the second conduit system 22 can be facilitated by the fact that 26 metering valves 32 are provided at the mouths. These can be designed as piezo valves. By using the piezo technology can be advantageously realize a very compact design of the Lei ⁇ tion module. Therefore, the paths in the second and third conduit systems (22, 31) can be kept short in order to exclude agglomeration of particles up to the surface to be coated.
  • the device 11 is brought from the side to the surface 14 of the work roll, as a carrier 12, a sponge is used.
  • the first line system 21 feeds the transmitter with the coating electrolyte, wherein excess electrolyte is discharged into the collecting container 17.
  • a dispersion the warehoused containing particles through the second conduit system 22 via the nozzle 30 is sprayed onto the Oberflä ⁇ che fourteenth Taking into account the direction of rotation of the work roll, the relative movement between the work roll and the transfer means with the transfer surface 12b makes it clear that the dispersion with the particles is applied to the surface 14 by means of the electrolyte before the coating.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

L'invention concerne un procédé de revêtement électrochimique d'un substrat (15) par dépôt à la brosse. Selon l'invention, les particules sont à appliquer sur la surface à traiter (14) par un système de guidage (22) distinct situé en amont de l'élément de transfert (12) destiné à l'électrolyte. L'électrolyte est cédé à l'élément de transfert par un système de guidage (21), ce qui permet d'éviter avantageusement l'agglomération des particules, puisqu'il s'écoule un très court laps de temps entre la fin d'application des particules et la formation de la couche (16). De même, un dispositif de revêtement électrochimique doté de deux systèmes de guidage (21, 22) et destiné au but cité est mis sous protection. Le procédé selon l'invention permet de revêtir partiellement, par exemple, les parties de surface hautement sollicitées des cylindres de laminage des laminoirs.
EP10754293A 2009-09-30 2010-08-26 Procédé de revêtement électrochimique d'un substrat par dépôt à la brosse et dispositif de mise en oeuvre Withdrawn EP2483455A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009048669A DE102009048669A1 (de) 2009-09-30 2009-09-30 Verfahren zum elektrochemischen Beschichten eines Substrates durch Brush Plating und Vorrichtung zur Durchführung dieses Verfahrens
PCT/EP2010/062501 WO2011039009A2 (fr) 2009-09-30 2010-08-26 Procédé de revêtement électrochimique d'un substrat par dépôt à la brosse et dispositif de mise en oeuvre

Publications (1)

Publication Number Publication Date
EP2483455A2 true EP2483455A2 (fr) 2012-08-08

Family

ID=43662054

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10754293A Withdrawn EP2483455A2 (fr) 2009-09-30 2010-08-26 Procédé de revêtement électrochimique d'un substrat par dépôt à la brosse et dispositif de mise en oeuvre

Country Status (5)

Country Link
US (1) US20120247966A1 (fr)
EP (1) EP2483455A2 (fr)
CN (1) CN102639757B (fr)
DE (1) DE102009048669A1 (fr)
WO (1) WO2011039009A2 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160145755A1 (en) * 2013-07-09 2016-05-26 United Technologies Corporation Lightweight metal parts produced by plating polymers
TWM522954U (zh) * 2015-12-03 2016-06-01 財團法人工業技術研究院 電沉積設備
DE102017201020A1 (de) 2017-01-23 2018-07-26 Siemens Aktiengesellschaft Verfahren zum Beschichten eines Kontaktbauteils und Kontaktbauteil, Vakuumschaltröhre und Schaltanlage
DE102017214334A1 (de) * 2017-08-17 2019-02-21 Technische Universität Dresden Multi-Material-Verbund und Verfahren zu dessen Herstellung
CN108103560A (zh) * 2018-02-05 2018-06-01 深圳市瑞世兴科技有限公司 一种金属电镀细化器
CN109402689B (zh) * 2018-12-25 2020-12-01 广东电网有限责任公司 一种电刷镀笔和电刷镀层的制备方法
CN113913885B (zh) * 2021-11-09 2023-07-11 中冶赛迪技术研究中心有限公司 圆柱面的纳米复合电刷镀工艺

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
SE7701371L (sv) * 1977-02-08 1978-08-09 Loqvist Kaj Ragnar Pletering av hal
US4304654A (en) * 1980-10-24 1981-12-08 Sifco Industries, Inc. Apparatus for electroplating
CN87100440B (zh) * 1987-01-27 1988-05-11 中国人民解放军装甲兵工程学院 在不导电材料上刷镀铜的方法
JPH01301897A (ja) 1988-05-31 1989-12-06 Sumitomo Metal Ind Ltd 複合めっき方法
US5225059A (en) * 1992-08-03 1993-07-06 W. R. Associates Apparatus for single anode brush electroplating
US6328872B1 (en) * 1999-04-03 2001-12-11 Nutool, Inc. Method and apparatus for plating and polishing a semiconductor substrate
JP2000232078A (ja) * 1999-02-10 2000-08-22 Toshiba Corp メッキ方法及びメッキ装置
DE10125289B4 (de) 2001-05-15 2005-04-07 Siemens Ag Verfahren zum Herstellen einer abriebfesten, galvanischen Schicht auf Teilen
DE10125290B4 (de) 2001-05-15 2005-04-14 Siemens Ag Verfahren zum Aufbereiten von Nano-Dispersanten
US20030234181A1 (en) * 2002-06-25 2003-12-25 Gino Palumbo Process for in-situ electroforming a structural layer of metallic material to an outside wall of a metal tube
DE102004030523A1 (de) 2004-06-18 2006-01-12 Siemens Ag Transportsystem für Nanopartikel und Verfahren zu dessen Betrieb
US7651766B2 (en) 2005-05-20 2010-01-26 University Of Central Florida Research Foundation, Inc. Carbon nanotube reinforced metal composites
SE529744C2 (sv) * 2005-12-22 2007-11-13 Abb Technology Ag Anordning och metod för metallisk beläggning samt användning av anordningen
CN101636235B (zh) * 2007-02-20 2011-09-07 西门子公司 轧辊和/或辊子以及轧辊和/或辊子的制备方法
US9005420B2 (en) * 2007-12-20 2015-04-14 Integran Technologies Inc. Variable property electrodepositing of metallic structures
DE102008019864B3 (de) * 2008-04-16 2009-09-24 Siemens Aktiengesellschaft Verfahren zum elektrochemischen Beschichten eines Substrates durch Brush Plating und Vorrichtung zur Durchführung dieses Verfahrens

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2011039009A2 *

Also Published As

Publication number Publication date
WO2011039009A3 (fr) 2011-06-16
CN102639757B (zh) 2014-11-26
CN102639757A (zh) 2012-08-15
US20120247966A1 (en) 2012-10-04
WO2011039009A2 (fr) 2011-04-07
DE102009048669A1 (de) 2011-03-31

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