EP2498574B2 - Plaque de support pour un porte-circuit d'un appareil ménager, agencement doté d'une telle plaque de support ainsi que champ de cuisson doté d'un agencement - Google Patents

Plaque de support pour un porte-circuit d'un appareil ménager, agencement doté d'une telle plaque de support ainsi que champ de cuisson doté d'un agencement Download PDF

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Publication number
EP2498574B2
EP2498574B2 EP12156205.2A EP12156205A EP2498574B2 EP 2498574 B2 EP2498574 B2 EP 2498574B2 EP 12156205 A EP12156205 A EP 12156205A EP 2498574 B2 EP2498574 B2 EP 2498574B2
Authority
EP
European Patent Office
Prior art keywords
carrier plate
flow duct
flow channel
embodied
flow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP12156205.2A
Other languages
German (de)
English (en)
Other versions
EP2498574A3 (fr
EP2498574B1 (fr
EP2498574A2 (fr
Inventor
Daniel Anton Falcon
Alfonso Lorente Perez
David Ortiz Sainz
Carmelo Pina Gadea
Eva Maria Sanchez Garcia
María Valencia Betran
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BSH Hausgeraete GmbH
Original Assignee
BSH Hausgeraete GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by BSH Hausgeraete GmbH filed Critical BSH Hausgeraete GmbH
Publication of EP2498574A2 publication Critical patent/EP2498574A2/fr
Publication of EP2498574A3 publication Critical patent/EP2498574A3/fr
Publication of EP2498574B1 publication Critical patent/EP2498574B1/fr
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12—Cooking devices
    • H05B6/1209—Cooking devices induction cooking plates or the like and devices to be used in combination with them
    • H05B6/1245—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements
    • H05B6/1263—Cooking devices induction cooking plates or the like and devices to be used in combination with them with special coil arrangements using coil cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B6/00—Heating by electric, magnetic or electromagnetic fields
    • H05B6/02—Induction heating
    • H05B6/10—Induction heating apparatus, other than furnaces, for specific applications
    • H05B6/12—Cooking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2206/00—Aspects relating to heating by electric, magnetic, or electromagnetic fields covered by group H05B6/00
    • H05B2206/02—Induction heating
    • H05B2206/022—Special supports for the induction coils

Definitions

  • the invention relates to a carrier plate for a circuit board equipped with electronic components of a household appliance, which has receptacles for the circuit board. Furthermore, the invention also relates to an arrangement with a carrier plate and an electronic component carrier, as well as an induction hob with a corresponding arrangement.
  • Household appliances especially induction hobs, have a large number of electronic components that must be cooled during operation. This applies in particular to the power electronics components that are provided to supply energy to the inductors of the induction hob. The corresponding is from the WO 2004/060020 A1 known.
  • cooling is achieved in that a cooling air flow is generated by means of a fan and is directed in the direction of the heat sink in which the electronic components are mounted.
  • a cooling air flow is generated by means of a fan and is directed in the direction of the heat sink in which the electronic components are mounted.
  • the EP 2 292 979 A1 discloses a cooling device for a domestic appliance and a domestic appliance, in particular an induction hob with the cooling device.
  • the WO 2008/103009 A1 discloses an induction heater that protects temperature-sensitive components from overheating.
  • the KR 1020090121787 A an electric cooktop with a housing, a cooling fan, a circuit board and air ducts.
  • the cooling fan creates an air flow that moves within the housing.
  • the circuit board is arranged in a base plate.
  • a heat sink receives the heat from the circuit board.
  • the air ducts direct the air flow to the circuit board and the heat sink.
  • the heat sink is located in the base plate. An underside of the heat sink is cooled by the air flow.
  • a carrier plate according to the invention is designed for carrying or receiving a circuit carrier of a household appliance equipped with electronic components.
  • the carrier plate is designed to receive the circuit carrier and has corresponding objective receptacles for this purpose.
  • An elongated flow channel comprising walls is formed on the carrier plate and is designed to conduct cooling air from electronic components of the circuit carrier.
  • the walls delimiting the flow channel are at least partially formed by the carrier plate itself.
  • the walls are arranged in such a way that the channel shape of the flow channel is formed and thus an elongated and at least partially closed hollow body is formed.
  • Such a configuration allows a specific component, namely the flow channel, to be formed quasi-integrally on the carrier plate, as a result of which the flow of the cooling air can be carried out in a much more targeted and efficient manner and, as a result, the electronic components can be cooled much more efficiently.
  • this integral flow channel also prevents cooling air from being blown out in a virtually uncontrolled manner and thus also blown into undesirable zones.
  • the flow channel is open on one longitudinal side and a receiving shaft is designed for the lateral insertion of an electronic component carrier.
  • This is a design that is particularly noteworthy, since this ensures that the electronic component carrier can at least also extend into the receiving shaft in some areas and that the cooling effect when the cooling air flows past is particularly high.
  • a very space-minimized design is again provided. Last but not least, such an arrangement also enables a very mechanically stable positioning of the electronic component carrier, since the electronic component carrier can be held and positioned at least in part by the part of the flow channel formed by the carrier plate.
  • the receiving shaft viewed in the longitudinal direction of the flow channel, is delimited on an open side wall and / or on an open ceiling wall by a flow channel inlet flange and a flow channel outlet flange.
  • this receiving shaft is thus clearly delimited at the front and rear, and thus the electronic component carrier can also be inserted in a very targeted and quasi-guided manner. This is particularly advantageous if the electronic component carrier has dimensions that enable it to be inserted into the receiving shaft with a precise fit.
  • the receiving shaft in such a way that the flow channel is open both on a side wall and on a ceiling wall, the insertion can be carried out particularly easily and reliably without the electronic component carrier being spread or jammed.
  • an open side wall of the flow channel has a wall web which is reduced in height, in particular carried at most a third of the height of the flow channel, and which is preferably provided functionally for positioning the component carrier.
  • this wall web extends over the entire length of the receiving shaft. It therefore extends in particular from the flow channel inlet flange to the flow channel outlet flange.
  • the electronic component carrier has a compatible recess in which the wall web can then engage.
  • the wall web is non-rectilinear, at least in sections.
  • the adaptation to the electronic component carrier can be done individually.
  • the wall web preferably extends at its two opposite ends, angled with a small or short section, in the direction of the outer wall regions of the flow channel inlet flange and the flow channel outlet flange.
  • the wall web is thus, in particular, a wall region which is offset slightly outward from the outside of the flow channel inlet flange and the flow channel outlet flange. This is particularly advantageous for receiving and inserting the electronic component carrier into the receiving shaft. In addition, this ensures that, especially in the case of a non-rectilinear wall web, which then preferably does not extend into the flow channel with its non-rectilinear sections, no undesirable swirling of the cooling air flow is brought about.
  • the flow channel is delimited from the front by a flow channel inlet flange made of wall areas.
  • This is in particular funnel-shaped. This specific shape enables the cooling air blower to be accommodated in a particularly large manner in a cooling air flow.
  • a flow opening for introducing the cooling air into the flow channel into the bottom of the carrier plate is formed adjacent to the flow channel inlet flange.
  • this flow opening is preferably not arranged to overlap with the surface of the flow channel inlet flange.
  • the flow channel is delimited on the back by a flow channel outlet flange from wall areas, which is designed with its top wall sloping downwards. This is particularly advantageous with regard to the cooling air flow to the outlet. The warmed up cooling air flow to be discharged can thus be derived in a targeted manner.
  • the carrier plate is preferably formed in one piece. This enables a very component-minimized implementation. In particular, a design made of plastic can be realized, which can then be manufactured in particular as a plastic injection molded part.
  • the flow channel is arranged to run horizontally when viewed from above on the carrier plate. Additionally or instead, it can also be provided that the flow channel is arranged in a rear third of the surface dimensions of the carrier plate when the carrier plate is viewed from above. This is particularly advantageous with regard to the arrangement of further components, on the one hand on the carrier plate itself, on the other hand on the circuit carrier and also adjacent to the carrier plate itself. Especially with regard to the positioning of the blower in a household appliance, this arrangement of the flow channel can be particularly advantageous advantageous arrangement in terms of space compactness can be realized.
  • the invention relates to an arrangement with a carrier plate according to the invention or an advantageous embodiment thereof.
  • the arrangement also includes an electronic component carrier on which at least one electronic component to be cooled is arranged.
  • the electronic component carrier is preferably designed, at least in some areas, as a heat sink, which is arranged in the receiving shaft of the flow channel and is positioned in some areas, in particular with cooling fins extending parallel to the longitudinal direction of the flow channel, extending into the flow channel.
  • the electronic component carrier is arranged in the receiving shaft in such a way that it is arranged to close the flow channel on its open side wall and / or its open top wall. An undesirable cooling air flow can be avoided.
  • this arrangement enables a cooling concept to be emphasized in particular, and moreover the electronic component carrier can be held and positioned in a mechanically stable manner by the flow channel.
  • the electronic component carrier is arranged to engage in the wall web that extends over the entire length of the receiving shaft between the flow channel inlet flange and the flow channel outlet flange. A bracket and fixation are thus also created by this wall web, so that the electronic component carrier is in particular also positioned so that it does not slip.
  • the invention relates to an induction hob with an arrangement according to the invention or an advantageous embodiment thereof.
  • FIG. 1 an induction hob 1 is shown in a schematic plan view in the state opened from above.
  • the induction hob 1 comprises a trough-like receptacle 2, which, at the bottom, represents the final housing of the induction hob 1.
  • a plate-like base group 3, preferably made of metal, is arranged in this receptacle 2.
  • a blower is arranged under the floor assembly 3.
  • the floor assembly 3 has an upper side 4 which faces a cooktop plate, not shown, which can be made of glass ceramic, for example.
  • a carrier plate 5 made in one piece from plastic in the exemplary embodiment. This is provided for receiving an electronic circuit carrier (not shown) and, for this purpose, has receptacles 6 that are only mentioned by way of example in terms of number, position and shape. It should be pointed out that the recordings 6 shown in simplified and schematic form are only examples. This means that not only the elements identified by reference numeral 6 can be provided for receiving the circuit carrier, but also or instead of this other elements of the carrier plate 5 can also be used.
  • the carrier plate 5 comprises a flow channel 7 oriented in the exemplary embodiment in the horizontal direction (x direction) and extending in the y direction in a rear third of the surface of the carrier plate 5. Walls of the flow channel 7 are partially formed by the carrier plate 5 itself and are integral with it the carrier plate 5 is formed.
  • the flow channel 7 is arranged on an upper side 8, which faces the cooktop plate (not shown).
  • the flow channel 7 is shown with a longitudinal axis A.
  • a first side wall 9, which extends perpendicular to the plane of the figure, is formed by the carrier plate 5.
  • the flow channel 7 comprises a flow channel inlet flange 10 as a wall area, which is funnel-shaped, as shown in FIG Fig. 1 is already recognizable.
  • the flow channel 7 comprises a flow channel outlet flange 11 as a wall area.
  • a bottom 12 of the flow channel 7 is also formed in regions by the bottom and thus the top side 8 of the carrier plate 5.
  • the carrier plate 5 can in particular be fastened to the base group 3 by clipping or latching or by plug connections.
  • a first flow opening 13 is formed adjacent to the flow channel inlet flange 10. Cooling air is blown through this by a blower, which is preferably arranged under the base group 3, in the direction of the flow duct 7 and introduced into the flow duct 7 via the flow duct inlet flange 10.
  • the flow opening 13 is according to the top view in FIG Fig. 1 not arranged overlapping with the flow channel inlet flange 10 and thus not partially overlapping with the flow channel inlet flange 10.
  • the flow opening 13 is covered at the top by a channel-like cover (not shown) when viewed from above, which is also arranged such that the cooling air is conducted directly to the flow channel inlet flange 10 via the flow opening 13 and the channel-like cover.
  • Fig. 2 is an enlarged section of the support plate 5 according to Fig. 1 shown, a perspective view is shown here.
  • the funnel-shaped configuration of the flow channel inlet flange 10 is shown. As can be seen, the flow channel 7 is open on the side opposite the side wall 9. It is also open in the area of the ceiling and thus on the side opposite the floor 12. This configuration forms a receiving shaft 14. In this one can Fig. 2 Electronic component carrier (not shown) can be positioned, at least in regions, extending into the flow channel 7.
  • the flow channel outlet flange 11 is designed to slope obliquely towards the rear and thus has a top wall 15 positioned sloping downwards.
  • a further second flow opening 16 is formed in the bottom group 3 below the flow duct outlet flange 11, via which the cooling air circulation is indicated according to the arrow representation, which represents the flow duct course.
  • the flow opening 16 is covered by the flow channel outlet flange 11 like a hood.
  • a wall web 17 is formed which extends with a wall height which is significantly lower than the side wall 9.
  • this wall web 17 is at least partially non-linear and is offset to the outside with respect to the side walls 18 and 19 of the flow channel inlet flange 10 and the flow channel outlet flange 11.
  • this wall web 17 serves to create a certain positioning possibility for the electronic component carrier.
  • the receiving shaft 14 thus extends between the flow channel inlet flange 10 and the flow channel outlet flange 11 and is therefore limited at the front and rear by these two components.
  • Fig. 3 is a representation according to Fig. 2 shown, however, an electronic component carrier 20 is arranged in an end position in the receiving shaft 14.
  • this electronic component carrier 20 is designed as a heat sink, which has a plurality of cooling fins, cooling fins 21 and 22 being shown. These extend in the interior of the flow channel 7, in particular parallel to the longitudinal axis A of the flow channel 7.
  • the dimensions of the electronic component carrier 20 are dimensioned such that it can in particular be inserted precisely into the receiving shaft 14. It therefore preferably closes off laterally in the flow channel 7 and opposite the side wall 9. Due to the design of the receiving shaft 14, the electronic component carrier 20 is also arranged in a relatively fixed position.
  • the electronic component carrier 20 extends laterally outside the flow channel 7, the electronic components 24, 25, 26, 27 and 28 being arranged on this further partial region 23 of the electronic component carrier 20. These electronic components 24 to 28 are only examples in number as well as in position and dimensioning. As can be seen, the electronic component carrier 20 is arranged on a circuit carrier 29 which is positioned and fastened on the carrier plate 5. Further electronic components, not specifically identified, are arranged on this circuit carrier 29.
  • the bottom of the flow channel inlet flange 10 is formed by the top 4 of the bottom group 3.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Induction Heating Cooking Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cookers (AREA)

Claims (13)

  1. Plaque de support (5) pour un porte-circuit (29) équipé de composants électroniques (24 à 28) d'un appareil ménager (1), laquelle plaque de support (5) est réalisée pour la disposition sur un côté supérieur (4) d'un groupe de fond (3) en forme de plaque et présente des logements (6) pour le porte-circuit (29), un canal d'écoulement (7) allongé, comprenant des parois (9, 10, 11, 17), délimité en partie par celles-ci, étant réalisé sur la plaque de support (5), lequel canal d'écoulement est réalisé pour conduire de l'air de refroidissement destiné à refroidir des composants électroniques (24 à 28) du porte-circuit (29), des parois (9, 10, 11, 17) du canal d'écoulement (7) étant réalisées elles-mêmes par la plaque de support (5), le canal d'écoulement (7) étant réalisé de manière ouverte sur un grand côté et un puits de logement (14) destiné à l'introduction latérale d'un support (20) de composants électroniques étant réalisé sur ce grand côté, le puits de logement (14), en vue dans le sens longitudinal (A) du canal d'écoulement (7), étant délimité sur une paroi latérale ouverte et/ou sur une paroi de plafond ouverte par une bride d'entrée (10) de canal d'écoulement et par une bride de sortie (11) de canal d'écoulement.
  2. Plaque de support (5) selon la revendication 1, caractérisée en ce qu'une paroi latérale ouverte du canal d'écoulement (7) présente une nervure de paroi (17) réduite en hauteur, notamment s'élevant au maximum à un tiers de la hauteur du canal d'écoulement (7), pour le positionnement du support (20) de composants électroniques.
  3. Plaque de support (5) selon l'une quelconque des revendications précédentes, caractérisée en ce que le canal d'écoulement (7) est délimité côté frontal par une bride d'entrée (10) de canal d'écoulement.
  4. Plaque de support (5) selon la revendication 3, caractérisée en ce que la bride d'entrée (10) de canal d'écoulement est réalisée en forme d'entonnoir.
  5. Plaque de support (5) selon la revendication 3 ou 4, caractérisée en ce que, de manière adjacente à la bride d'entrée (10) de canal d'écoulement, une ouverture d'écoulement (13) destinée à introduire l'air de refroidissement dans le canal d'écoulement (7) est réalisée dans le fond (4) d'un groupe de fond (3) disposé sous la plaque de support (5).
  6. Plaque de support (5) selon l'une quelconque des revendications précédentes, caractérisée en ce que le canal d'écoulement (7) est délimité côté arrière par une bride de sortie (11) de canal d'écoulement, laquelle est réalisée avec sa paroi de plafond (15) en descendant de manière oblique vers le bas.
  7. Plaque de support (5) selon la revendication 6, caractérisée en ce que directement en dessous de la paroi de plafond (15), une ouverture d'écoulement (16) destinée à guider l'air de refroidissement hors du canal d'écoulement (7) est réalisée dans un groupe de fond (3) disposé sous la plaque de support (5), notamment en ce que la bride de sortie (11) de canal d'écoulement recouvre l'ouverture d'écoulement (16) de manière similaire à un capot.
  8. Plaque de support (5) selon l'une quelconque des revendications précédentes, caractérisée en ce qu'elle est réalisée d'une seule pièce, notamment en matière plastique.
  9. Plaque de support (5) selon l'une quelconque des revendications précédentes, caractérisée en ce que le canal d'écoulement (7), en vue de dessus sur la plaque de support (5), est disposé en s'étendant horizontalement et/ou est disposé dans un tiers arrière de la surface de la plaque de support (5).
  10. Agencement comprenant une plaque de support (5) selon l'une quelconque des revendications précédentes et comprenant un support (20) de composants électroniques sur lequel est disposé au moins un composant électronique (24 à 28) à refroidir, la plaque de support (5) étant disposée sur un côté supérieur (4) d'un groupe de fond (3).
  11. Agencement selon la revendication 10, caractérisé en ce que le support (20) de composants électroniques est un corps de refroidissement, lequel est disposé par sections dans le puits de logement (14) et s'étend par sections dans le canal d'écoulement (7), notamment avec des ailettes de refroidissement (21, 22) s'étendant parallèlement au sens longitudinal (A) du canal d'écoulement (7) et est disposé en obturant le canal d'écoulement (7) latéralement et en haut.
  12. Agencement selon la revendication 10 ou 11, caractérisé en ce que le support (20) de composants électroniques est disposé en ayant prise dans la nervure de paroi (17) s'étendant sur toute la longueur du puits de logement (14) entre la bride d'entrée (10) de canal d'écoulement et la bride de sortie (11) de canal d'écoulement.
  13. Table de cuisson par induction (1) comprenant un agencement selon l'une quelconque des revendications 10 à 12.
EP12156205.2A 2011-03-10 2012-02-20 Plaque de support pour un porte-circuit d'un appareil ménager, agencement doté d'une telle plaque de support ainsi que champ de cuisson doté d'un agencement Active EP2498574B2 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES201130327A ES2412104B1 (es) 2011-03-10 2011-03-10 Placa de soporte para un soporte de circuito de un aparato doméstico, disposición con una placa de soporte de tal tipo, y campo de cocción por inducción con una disposición

Publications (4)

Publication Number Publication Date
EP2498574A2 EP2498574A2 (fr) 2012-09-12
EP2498574A3 EP2498574A3 (fr) 2013-02-27
EP2498574B1 EP2498574B1 (fr) 2017-06-21
EP2498574B2 true EP2498574B2 (fr) 2020-03-25

Family

ID=45656203

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12156205.2A Active EP2498574B2 (fr) 2011-03-10 2012-02-20 Plaque de support pour un porte-circuit d'un appareil ménager, agencement doté d'une telle plaque de support ainsi que champ de cuisson doté d'un agencement

Country Status (2)

Country Link
EP (1) EP2498574B2 (fr)
ES (2) ES2412104B1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102865919B1 (ko) 2020-03-12 2025-09-26 엘지전자 주식회사 전기 레인지 및 이에 포함되는 에어 가이드
KR20210115329A (ko) * 2020-03-12 2021-09-27 엘지전자 주식회사 전기 레인지
KR102888218B1 (ko) 2020-03-12 2025-11-18 엘지전자 주식회사 전기 레인지 및 이에 포함되는 에어 가이드
KR20220161028A (ko) * 2021-05-28 2022-12-06 엘지전자 주식회사 전기 레인지
CN218001586U (zh) * 2022-09-02 2022-12-09 佛山市顺德区美的电热电器制造有限公司 电磁加热组件和烹饪设备

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7148452B2 (en) 2001-04-03 2006-12-12 Emerson Electric Co. Heat sink for printed circuit board components
ES2223258B1 (es) * 2002-12-20 2006-04-16 Bsh Electrodomesticos España, S.A. Cocina de induccion.
JP4494379B2 (ja) 2006-09-15 2010-06-30 三菱電機株式会社 誘導加熱調理器
KR101291428B1 (ko) 2006-12-14 2013-07-30 엘지전자 주식회사 조리기기
KR20080078760A (ko) * 2007-02-24 2008-08-28 엘지전자 주식회사 유도 가열기
KR20090121718A (ko) 2008-05-22 2009-11-26 장영미 액자로 변신 가능한 다용도 봉투카드
EP2194328B1 (fr) 2008-12-05 2020-04-01 LG Electronics Inc. Plaque de cuisson encastrée
TWI367719B (en) 2009-03-02 2012-07-01 Delta Electronics Inc Electric device and circling dissipating system using the same
EP2292979B1 (fr) * 2009-09-03 2016-10-12 BSH Hausgeräte GmbH Dispositif de refroidissement pour un champ de cuisson à induction

Also Published As

Publication number Publication date
EP2498574A3 (fr) 2013-02-27
EP2498574B1 (fr) 2017-06-21
ES2635715T3 (es) 2017-10-04
EP2498574A2 (fr) 2012-09-12
ES2412104B1 (es) 2014-05-21
ES2412104A1 (es) 2013-07-10
ES2635715T5 (es) 2020-09-24

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