EP2508633A4 - Kupferlegierungsfolie und herstellungsverfahren dafür - Google Patents

Kupferlegierungsfolie und herstellungsverfahren dafür

Info

Publication number
EP2508633A4
EP2508633A4 EP20100834576 EP10834576A EP2508633A4 EP 2508633 A4 EP2508633 A4 EP 2508633A4 EP 20100834576 EP20100834576 EP 20100834576 EP 10834576 A EP10834576 A EP 10834576A EP 2508633 A4 EP2508633 A4 EP 2508633A4
Authority
EP
European Patent Office
Prior art keywords
copper alloy
alloy sheet
producing same
producing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20100834576
Other languages
English (en)
French (fr)
Other versions
EP2508633A1 (de
Inventor
Hiroshi Kaneko
Koji Sato
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2508633A1 publication Critical patent/EP2508633A1/de
Publication of EP2508633A4 publication Critical patent/EP2508633A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
EP20100834576 2009-12-02 2010-12-01 Kupferlegierungsfolie und herstellungsverfahren dafür Withdrawn EP2508633A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009274995 2009-12-02
PCT/JP2010/071499 WO2011068126A1 (ja) 2009-12-02 2010-12-01 銅合金板材およびその製造方法

Publications (2)

Publication Number Publication Date
EP2508633A1 EP2508633A1 (de) 2012-10-10
EP2508633A4 true EP2508633A4 (de) 2014-07-23

Family

ID=44114972

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20100834576 Withdrawn EP2508633A4 (de) 2009-12-02 2010-12-01 Kupferlegierungsfolie und herstellungsverfahren dafür

Country Status (5)

Country Link
EP (1) EP2508633A4 (de)
JP (2) JP5400877B2 (de)
KR (1) KR101747475B1 (de)
CN (1) CN102666889A (de)
WO (1) WO2011068126A1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2610358A4 (de) * 2010-08-27 2017-05-03 Furukawa Electric Co., Ltd. Kupferlegierungsblech und herstellungsverfahren dafür
JP5039863B1 (ja) * 2011-10-21 2012-10-03 Ｊｘ日鉱日石金属株式会社 コルソン合金及びその製造方法
JP6639908B2 (ja) * 2013-09-06 2020-02-05 古河電気工業株式会社 銅合金線材及びその製造方法
JP6317967B2 (ja) * 2014-03-25 2018-04-25 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造方法並びに通電部品
JP6504868B2 (ja) * 2015-03-19 2019-04-24 Ｊｘ金属株式会社 圧延銅箔及びその製造方法、銅張積層板、並びにフレキシブルプリント基板及び電子機器
JP6310538B1 (ja) * 2016-12-14 2018-04-11 古河電気工業株式会社 銅合金線棒材およびその製造方法
JP6600121B2 (ja) * 2017-08-09 2019-10-30 日鉄ケミカル＆マテリアル株式会社 半導体装置用Ｃｕ合金ボンディングワイヤ
CN108315579B (zh) * 2018-03-06 2019-12-06 北京科技大学 织构稀土CuNiSiCr合金材料及制备工艺和应用
JP6713074B1 (ja) * 2019-04-16 2020-06-24 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
CN112030030B (zh) * 2020-08-06 2021-09-10 国网江西省电力有限公司电力科学研究院 一种高强高导铜合金线材及其制备方法
CN115094258B (zh) * 2022-07-13 2023-02-17 浙江惟精新材料股份有限公司 一种高强高塑高折弯Cu-Ni-Si-Co合金及其制备方法和应用
JP7668843B2 (ja) * 2023-05-16 2025-04-25 山陽特殊製鋼株式会社 高硬度、高導電率を有する積層造形用Ｃｕ合金粉末及びこれを用いた積層造形体

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006283059A (ja) * 2005-03-31 2006-10-19 Kobe Steel Ltd 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP2007092135A (ja) * 2005-09-29 2007-04-12 Nikko Kinzoku Kk 強度と曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金
WO2008099892A1 (ja) * 2007-02-16 2008-08-21 Kabushiki Kaisha Kobe Seiko Sho 強度と成形性に優れる電気電子部品用銅合金板
EP1967596A1 (de) * 2007-02-13 2008-09-10 Dowa Metaltech Co., Ltd. Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür
EP1997920A2 (de) * 2007-05-31 2008-12-03 The Furukawa Electric Co., Ltd. Kupferlegierung für elektrische und elektronische Geräte
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
EP2248922A1 (de) * 2009-04-27 2010-11-10 Dowa Metaltech Co., Ltd. Kupferlegierungsblech und Herstellungsverfahren dafür
EP2298945A1 (de) * 2008-06-03 2011-03-23 The Furukawa Electric Co., Ltd. Folienmaterial aus kupferlegierung und herstellungsverfahren dafür

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62185847A (ja) * 1986-02-12 1987-08-14 Furukawa Electric Co Ltd:The 熱・電気高伝導用高力銅合金とその製造法
JP3510469B2 (ja) * 1998-01-30 2004-03-29 古河電気工業株式会社 導電性ばね用銅合金及びその製造方法
JP3739214B2 (ja) 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
JP2000080428A (ja) * 1998-08-31 2000-03-21 Kobe Steel Ltd 曲げ加工性が優れた銅合金板
JP4809602B2 (ja) 2004-05-27 2011-11-09 古河電気工業株式会社 銅合金
JP4166197B2 (ja) 2004-06-30 2008-10-15 日鉱金属株式会社 ＢａｄＷａｙの曲げ加工性が優れたＣｕ−Ｎｉ−Ｓｉ系銅合金条
JP4584692B2 (ja) * 2004-11-30 2010-11-24 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板およびその製造方法
JP4566020B2 (ja) * 2005-02-14 2010-10-20 株式会社神戸製鋼所 異方性の小さい電気電子部品用銅合金板
JP5002768B2 (ja) * 2006-03-30 2012-08-15 Ｄｏｗａメタルテック株式会社 曲げ加工性に優れた高導電性銅基合金およびその製造法
JP5028657B2 (ja) 2006-07-10 2012-09-19 Ｄｏｗａメタルテック株式会社 異方性の少ない高強度銅合金板材およびその製造法
US20080190523A1 (en) 2007-02-13 2008-08-14 Weilin Gao Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP4981748B2 (ja) 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
US8444779B2 (en) * 2007-09-28 2013-05-21 JX Nippon Mining & Metals Co., Ltd. Cu—Ni—Si—Co copper alloy for electronic materials and method for manufacturing same
JP4596490B2 (ja) 2008-03-31 2010-12-08 Ｊｘ日鉱日石金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
WO2011068134A1 (ja) * 2009-12-02 2011-06-09 古河電気工業株式会社 低ヤング率を有する銅合金板材およびその製造法
JP5476149B2 (ja) * 2010-02-10 2014-04-23 株式会社神戸製鋼所 強度異方性が小さく曲げ加工性に優れた銅合金

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006283059A (ja) * 2005-03-31 2006-10-19 Kobe Steel Ltd 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP2007092135A (ja) * 2005-09-29 2007-04-12 Nikko Kinzoku Kk 強度と曲げ加工性に優れたＣｕ−Ｎｉ−Ｓｉ系合金
EP1967596A1 (de) * 2007-02-13 2008-09-10 Dowa Metaltech Co., Ltd. Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür
WO2008099892A1 (ja) * 2007-02-16 2008-08-21 Kabushiki Kaisha Kobe Seiko Sho 強度と成形性に優れる電気電子部品用銅合金板
EP1997920A2 (de) * 2007-05-31 2008-12-03 The Furukawa Electric Co., Ltd. Kupferlegierung für elektrische und elektronische Geräte
US20090183803A1 (en) * 2007-12-21 2009-07-23 Mutschler Ralph A Copper-nickel-silicon alloys
EP2298945A1 (de) * 2008-06-03 2011-03-23 The Furukawa Electric Co., Ltd. Folienmaterial aus kupferlegierung und herstellungsverfahren dafür
EP2248922A1 (de) * 2009-04-27 2010-11-10 Dowa Metaltech Co., Ltd. Kupferlegierungsblech und Herstellungsverfahren dafür

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011068126A1 *

Also Published As

Publication number Publication date
EP2508633A1 (de) 2012-10-10
JP5503791B2 (ja) 2014-05-28
JPWO2011068126A1 (ja) 2013-04-18
JP5400877B2 (ja) 2014-01-29
JP2014029031A (ja) 2014-02-13
KR101747475B1 (ko) 2017-06-14
KR20120087985A (ko) 2012-08-07
CN102666889A (zh) 2012-09-12
WO2011068126A1 (ja) 2011-06-09

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