EP2508634A4 - Matériau en feuille d'alliage de cuivre présentant un faible module de young et son procédé de fabrication - Google Patents

Matériau en feuille d'alliage de cuivre présentant un faible module de young et son procédé de fabrication

Info

Publication number
EP2508634A4
EP2508634A4 EP10834584.4A EP10834584A EP2508634A4 EP 2508634 A4 EP2508634 A4 EP 2508634A4 EP 10834584 A EP10834584 A EP 10834584A EP 2508634 A4 EP2508634 A4 EP 2508634A4
Authority
EP
European Patent Office
Prior art keywords
modulus
sheet material
copper alloy
alloy sheet
producing same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10834584.4A
Other languages
German (de)
English (en)
Other versions
EP2508634B1 (fr
EP2508634A1 (fr
Inventor
Koji Sato
Hiroshi Kaneko
Tatsuhiko Eguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2508634A1 publication Critical patent/EP2508634A1/fr
Publication of EP2508634A4 publication Critical patent/EP2508634A4/fr
Application granted granted Critical
Publication of EP2508634B1 publication Critical patent/EP2508634B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005—Copper or its alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
EP10834584.4A 2009-12-02 2010-12-01 Procédé de fabrication d'un matériau en feuille d'alliage de cuivre présentant un faible module de young Not-in-force EP2508634B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009274996 2009-12-02
PCT/JP2010/071517 WO2011068134A1 (fr) 2009-12-02 2010-12-01 Matériau en feuille d'alliage de cuivre présentant un faible module de young et son procédé de fabrication

Publications (3)

Publication Number Publication Date
EP2508634A1 EP2508634A1 (fr) 2012-10-10
EP2508634A4 true EP2508634A4 (fr) 2016-01-06
EP2508634B1 EP2508634B1 (fr) 2017-08-23

Family

ID=44114980

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10834584.4A Not-in-force EP2508634B1 (fr) 2009-12-02 2010-12-01 Procédé de fabrication d'un matériau en feuille d'alliage de cuivre présentant un faible module de young

Country Status (6)

Country Link
US (1) US20120241056A1 (fr)
EP (1) EP2508634B1 (fr)
JP (1) JP4809935B2 (fr)
KR (1) KR20120104553A (fr)
CN (1) CN102630251B (fr)
WO (1) WO2011068134A1 (fr)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2508633A4 (fr) * 2009-12-02 2014-07-23 Furukawa Electric Co Ltd Feuille d'alliage de cuivre et son procédé de fabrication
JP4885332B2 (ja) * 2009-12-02 2012-02-29 古河電気工業株式会社 銅合金板材およびその製造方法
EP2610358A4 (fr) * 2010-08-27 2017-05-03 Furukawa Electric Co., Ltd. Feuille d'alliage de cuivre et procédé de fabrication de celle-ci
JP5039862B1 (ja) * 2011-07-15 2012-10-03 Ｊｘ日鉱日石金属株式会社 コルソン合金及びその製造方法
JP5539932B2 (ja) * 2011-08-01 2014-07-02 Ｊｘ日鉱日石金属株式会社 曲げ加工性に優れたＣｕ−Ｃｏ−Ｓｉ系合金
JP5567210B2 (ja) * 2011-08-05 2014-08-06 古河電気工業株式会社 二次電池負極集電体用圧延銅箔およびその製造方法
JP5117602B1 (ja) * 2011-08-18 2013-01-16 古河電気工業株式会社 たわみ係数が低く、曲げ加工性に優れる銅合金板材
TWI461549B (zh) * 2012-02-14 2014-11-21 Ｊｘ日鑛日石金屬股份有限公司 Carbene alloy and its manufacturing method
JP6111028B2 (ja) * 2012-03-26 2017-04-05 Ｊｘ金属株式会社 コルソン合金及びその製造方法
JP6126791B2 (ja) 2012-04-24 2017-05-10 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金
JP6196435B2 (ja) * 2012-10-02 2017-09-13 Ｊｘ金属株式会社 チタン銅及びその製造方法
JP6039999B2 (ja) 2012-10-31 2016-12-07 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法
KR101274063B1 (ko) * 2013-01-22 2013-06-12 한국기계연구원 배향된 석출물을 가지는 금속복합재료 및 이의 제조방법
JP5647703B2 (ja) 2013-02-14 2015-01-07 Ｄｏｗａメタルテック株式会社 高強度Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法並びに通電部品
JP6181392B2 (ja) * 2013-03-12 2017-08-16 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金
JP6223057B2 (ja) 2013-08-13 2017-11-01 Ｊｘ金属株式会社 導電性及び曲げたわみ係数に優れる銅合金板
JP6050738B2 (ja) 2013-11-25 2016-12-21 Ｊｘ金属株式会社 導電性、成形加工性および応力緩和特性に優れる銅合金板
CN105829556B (zh) 2013-12-27 2018-02-06 古河电气工业株式会社 铜合金板材、连接器以及铜合金板材的制造方法
CN105829555B (zh) * 2013-12-27 2018-04-20 古河电气工业株式会社 铜合金板材、连接器以及铜合金板材的制造方法
KR20160117210A (ko) 2015-03-30 2016-10-10 제이엑스금속주식회사 Cu-Ni-Si 계 압연 구리 합금 및 그 제조 방법
CN105088010B (zh) * 2015-08-31 2017-08-25 河南科技大学 一种高强高导稀土铜锆合金及其制备方法
JP2016204757A (ja) * 2016-07-20 2016-12-08 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系銅合金
JP2017020115A (ja) * 2016-08-29 2017-01-26 Ｊｘ金属株式会社 チタン銅及びその製造方法
CN108496228B (zh) * 2016-09-20 2020-11-03 古河电气工业株式会社 扁平电缆、扁平电缆的制造方法以及包括扁平电缆的旋转连接器装置
JP6345290B1 (ja) 2017-03-22 2018-06-20 Ｊｘ金属株式会社 プレス加工後の寸法精度を改善した銅合金条
JP6618945B2 (ja) * 2017-03-24 2019-12-11 Ｊｘ金属株式会社 電子材料用銅合金
JP6670277B2 (ja) 2017-09-14 2020-03-18 Ｊｘ金属株式会社 金型摩耗性に優れたＣｕ−Ｎｉ−Ｓｉ系銅合金
CN109055810A (zh) * 2018-07-10 2018-12-21 浙江力博实业股份有限公司 一种电极材料用铜钴铬硅合金的制备方法
JP6866960B2 (ja) * 2018-09-06 2021-04-28 日立金属株式会社 ニッケル被覆銅箔およびその製造方法
KR102499087B1 (ko) 2020-11-30 2023-02-15 한국생산기술연구원 메타휴리스틱스를 이용한 베릴륨 프리 동합금의 제조방법
KR102499059B1 (ko) 2020-11-30 2023-02-15 한국생산기술연구원 베릴륨 프리 동합금의 제조방법
KR20220077196A (ko) 2020-11-30 2022-06-09 한국생산기술연구원 베릴륨 프리 동합금
JPWO2023140314A1 (fr) * 2022-01-20 2023-07-27

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1964937A1 (fr) * 2007-02-13 2008-09-03 Dowa Metaltech Co., Ltd. Matériau de feuille d'alliage de cuivre à base de Cu-Ni-Si et son procédé de fabrication
EP2154257A1 (fr) * 2007-03-30 2010-02-17 Nippon Mining & Metals Co., Ltd. Alliage à base de cu-ni-si pour un matériau électronique
EP2298945A1 (fr) * 2008-06-03 2011-03-23 The Furukawa Electric Co., Ltd. Matériau de tôle d alliage de cuivre et procédé de fabrication de celui-ci

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5554554A (en) 1978-10-11 1980-04-21 Yaskawa Electric Mfg Co Ltd Conductor for flexible cable
JPS6362834A (ja) * 1986-09-04 1988-03-19 Nippon Mining Co Ltd 直流配線材料用銅合金
JPH01150748A (ja) 1987-12-08 1989-06-13 Rinnai Corp 暖房装置などの余熱放逐機構
JP4255330B2 (ja) * 2003-07-31 2009-04-15 日鉱金属株式会社 疲労特性に優れたＣｕ−Ｎｉ−Ｓｉ系合金部材
JP4584692B2 (ja) 2004-11-30 2010-11-24 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板およびその製造方法
JP4566048B2 (ja) 2005-03-31 2010-10-20 株式会社神戸製鋼所 曲げ加工性に優れた高強度銅合金板及びその製造方法
JP4275697B2 (ja) * 2006-11-24 2009-06-10 三菱伸銅株式会社 電子機器用銅合金およびリードフレーム材
JP4981748B2 (ja) 2007-05-31 2012-07-25 古河電気工業株式会社 電気・電子機器用銅合金
JP4885332B2 (ja) * 2009-12-02 2012-02-29 古河電気工業株式会社 銅合金板材およびその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1964937A1 (fr) * 2007-02-13 2008-09-03 Dowa Metaltech Co., Ltd. Matériau de feuille d'alliage de cuivre à base de Cu-Ni-Si et son procédé de fabrication
EP2154257A1 (fr) * 2007-03-30 2010-02-17 Nippon Mining & Metals Co., Ltd. Alliage à base de cu-ni-si pour un matériau électronique
EP2298945A1 (fr) * 2008-06-03 2011-03-23 The Furukawa Electric Co., Ltd. Matériau de tôle d alliage de cuivre et procédé de fabrication de celui-ci

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2011068134A1 *

Also Published As

Publication number Publication date
US20120241056A1 (en) 2012-09-27
CN102630251B (zh) 2017-03-15
KR20120104553A (ko) 2012-09-21
EP2508634B1 (fr) 2017-08-23
CN102630251A (zh) 2012-08-08
JP4809935B2 (ja) 2011-11-09
EP2508634A1 (fr) 2012-10-10
JPWO2011068134A1 (ja) 2013-04-18
WO2011068134A1 (fr) 2011-06-09

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