EP2525639A3 - Système de refroidissement pour équipement électronique - Google Patents

Système de refroidissement pour équipement électronique Download PDF

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Publication number
EP2525639A3
EP2525639A3 EP12168238.9A EP12168238A EP2525639A3 EP 2525639 A3 EP2525639 A3 EP 2525639A3 EP 12168238 A EP12168238 A EP 12168238A EP 2525639 A3 EP2525639 A3 EP 2525639A3
Authority
EP
European Patent Office
Prior art keywords
evaporator
refrigerant
electronic equipment
condenser
control valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12168238.9A
Other languages
German (de)
English (en)
Other versions
EP2525639A2 (fr
Inventor
Yasuhiro Kashirajima
Junichi Ito
Yasuhiko Inadomi
Tomohiro Yoshida
Teruo Mikami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of EP2525639A2 publication Critical patent/EP2525639A2/fr
Publication of EP2525639A3 publication Critical patent/EP2525639A3/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP12168238.9A 2011-05-18 2012-05-16 Système de refroidissement pour équipement électronique Withdrawn EP2525639A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011111693A JP5750304B2 (ja) 2011-05-18 2011-05-18 電子機器の冷却システム

Publications (2)

Publication Number Publication Date
EP2525639A2 EP2525639A2 (fr) 2012-11-21
EP2525639A3 true EP2525639A3 (fr) 2015-03-18

Family

ID=46147313

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12168238.9A Withdrawn EP2525639A3 (fr) 2011-05-18 2012-05-16 Système de refroidissement pour équipement électronique

Country Status (5)

Country Link
US (1) US20120291465A1 (fr)
EP (1) EP2525639A3 (fr)
JP (1) JP5750304B2 (fr)
CN (1) CN102791110B (fr)
SG (1) SG185896A1 (fr)

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* Cited by examiner, † Cited by third party
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WO2013080356A1 (fr) 2011-12-01 2013-06-06 富士通株式会社 Râtelier pour équipement électronique, et dispositif de traitement d'information
CN105409341B (zh) * 2012-12-18 2018-05-04 施耐德电气It公司 冷却单元和冷却方法
CN103327799B (zh) * 2013-07-17 2016-06-29 曙光信息产业股份有限公司 用于机架式服务器的冷却组件、及机架式服务器机组
EP3081883A4 (fr) * 2013-11-14 2017-09-13 Nec Corporation Structure de tuyauterie, dispositif de refroidissement l'utilisant et procédé de transport de vapeur de réfrigérant
WO2016059799A1 (fr) * 2014-10-17 2016-04-21 Ｎｅｃプラットフォームズ株式会社 Système de refroidissement et dispositif électronique
US10375901B2 (en) 2014-12-09 2019-08-13 Mtd Products Inc Blower/vacuum
US10409345B2 (en) 2015-03-23 2019-09-10 Nec Corporation Phase change cooling device and phase change cooling method
US10448543B2 (en) 2015-05-04 2019-10-15 Google Llc Cooling electronic devices in a data center
JP6649098B2 (ja) * 2016-02-04 2020-02-19 株式会社竹中工務店 冷媒自然循環式の排気冷却装置及び排気冷却方法
CN106604616A (zh) * 2017-01-04 2017-04-26 北京百度网讯科技有限公司 整机柜服务器系统的散热系统及方法
WO2018131555A1 (fr) * 2017-01-16 2018-07-19 日本電気株式会社 Dispositif de commande de soupape, dispositif de refroidissement, procédé de commande de soupape et support de stockage de programme
CN107289681B (zh) * 2017-06-23 2019-11-08 麦克维尔空调制冷(武汉)有限公司 一种冷水机组冷媒流量控制方法
CN107728746B (zh) * 2017-09-22 2019-10-29 郑州云海信息技术有限公司 一种服务器冷却系统
WO2019070498A2 (fr) * 2017-10-05 2019-04-11 Ice Qube, Inc. Système de refroidissement à boucle fermée miniaturisé
JP7403984B2 (ja) * 2019-07-26 2023-12-25 株式会社鷺宮製作所 冷却装置
CN111288726A (zh) * 2020-02-28 2020-06-16 佛山格尼斯磁悬浮技术有限公司 磁悬浮内螺纹铜管加工设备的温度监控系统及方法、装置
CN112212552B (zh) * 2020-09-04 2021-10-15 珠海格力电器股份有限公司 一种冷却方法、设备、计算机可读介质和电子设备
CN112954955B (zh) * 2021-01-25 2024-07-05 华为数字能源技术有限公司 一种冷却系统和数据中心
US11729940B2 (en) * 2021-11-02 2023-08-15 Oracle International Corporation Unified control of cooling in computers
CN114110920A (zh) * 2021-11-08 2022-03-01 珠海格力电器股份有限公司 一种空调器的控制方法及空调器
CN114405046B (zh) * 2022-02-28 2023-08-29 中国科学院长春应用化学研究所 一种基于真空升华提纯设备的降温装置
US11711908B1 (en) * 2022-03-18 2023-07-25 Baidu Usa Llc System and method for servicing and controlling a leak segregation and detection system of an electronics rack
KR102759108B1 (ko) * 2023-12-26 2025-01-24 한국전자기술연구원 리어도어 냉각장치의 축소모형 제작 및 운용방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050083654A1 (en) * 2002-01-29 2005-04-21 Telefonaktiebolaget Lm Ericsson (Publ) Cabinet cooling
EP2091314A2 (fr) * 2008-02-13 2009-08-19 Hitachi Plant Technologies, Ltd. Système de refroidissement pour équipement électronique
US20090219681A1 (en) * 2008-02-25 2009-09-03 International Business Machines Corporation Multiple chip module cooling system and method of operation thereof
JP2009217500A (ja) * 2008-03-10 2009-09-24 Hitachi Plant Technologies Ltd 電子機器の冷却システム及び冷却方法
JP2010190553A (ja) * 2009-02-20 2010-09-02 Hitachi Plant Technologies Ltd 電子機器の冷却システム

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JPS5419609B2 (fr) * 1972-03-15 1979-07-17
JP3443433B2 (ja) * 1993-05-06 2003-09-02 東芝キヤリア株式会社 空気調和機
US6938433B2 (en) * 2002-08-02 2005-09-06 Hewlett-Packard Development Company, Lp. Cooling system with evaporators distributed in series
US6775137B2 (en) * 2002-11-25 2004-08-10 International Business Machines Corporation Method and apparatus for combined air and liquid cooling of stacked electronics components
JP2004363308A (ja) * 2003-06-04 2004-12-24 Hitachi Ltd ラックマウントサーバシステム
JP2005210080A (ja) * 2003-12-25 2005-08-04 Tokyo Electron Ltd 温度調節方法及び温度調節装置
JP2006029672A (ja) * 2004-07-15 2006-02-02 Japan Aerospace Exploration Agency 潜熱流体ループを使用する熱輸送装置
US20070227168A1 (en) * 2006-04-04 2007-10-04 Simmons Bryan D Variable capacity air conditioning system
JP5030631B2 (ja) * 2007-03-22 2012-09-19 富士通株式会社 情報機器の冷却システム
US7963118B2 (en) * 2007-09-25 2011-06-21 International Business Machines Corporation Vapor-compression heat exchange system with evaporator coil mounted to outlet door of an electronics rack
US8113009B2 (en) * 2007-10-22 2012-02-14 Sanyo Electric Co., Ltd. Electronic device cooling system and electronic device cooling apparatus
DE102007062143B3 (de) * 2007-11-06 2009-05-14 Fujitsu Siemens Computers Gmbh Verfahren und System zur Nutzung der Abwärme eines Computersystems
US7878007B2 (en) * 2008-02-15 2011-02-01 International Business Machines Corporation Monitoring method and system for determining airflow rate through and heat removal rate of an air-conditioning unit
EP2261578A4 (fr) * 2008-02-28 2013-02-06 Daikin Ind Ltd Dispositif de réfrigération
GB2459543A (en) * 2008-05-03 2009-11-04 John Edward Gough Cooling systems and methods
JP2010041007A (ja) * 2008-08-08 2010-02-18 Hitachi Information & Communication Engineering Ltd 冷却ユニット、電子装置ラック、冷却システム及びその構築方法
JP5182249B2 (ja) * 2009-08-06 2013-04-17 株式会社デンソー 半導体冷却器
JP5929754B2 (ja) * 2010-03-30 2016-06-08 日本電気株式会社 電子機器排気の冷却装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050083654A1 (en) * 2002-01-29 2005-04-21 Telefonaktiebolaget Lm Ericsson (Publ) Cabinet cooling
EP2091314A2 (fr) * 2008-02-13 2009-08-19 Hitachi Plant Technologies, Ltd. Système de refroidissement pour équipement électronique
US20090219681A1 (en) * 2008-02-25 2009-09-03 International Business Machines Corporation Multiple chip module cooling system and method of operation thereof
JP2009217500A (ja) * 2008-03-10 2009-09-24 Hitachi Plant Technologies Ltd 電子機器の冷却システム及び冷却方法
JP2010190553A (ja) * 2009-02-20 2010-09-02 Hitachi Plant Technologies Ltd 電子機器の冷却システム

Also Published As

Publication number Publication date
US20120291465A1 (en) 2012-11-22
CN102791110A (zh) 2012-11-21
JP2012243035A (ja) 2012-12-10
JP5750304B2 (ja) 2015-07-22
EP2525639A2 (fr) 2012-11-21
SG185896A1 (en) 2012-12-28
CN102791110B (zh) 2015-12-02

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