EP2543475A3 - Verfahren zum Schleifen eines dünnen blattartigen Werkstücks und doppelendiger Oberflächenschleifer - Google Patents

Verfahren zum Schleifen eines dünnen blattartigen Werkstücks und doppelendiger Oberflächenschleifer Download PDF

Info

Publication number
EP2543475A3
EP2543475A3 EP12175279.4A EP12175279A EP2543475A3 EP 2543475 A3 EP2543475 A3 EP 2543475A3 EP 12175279 A EP12175279 A EP 12175279A EP 2543475 A3 EP2543475 A3 EP 2543475A3
Authority
EP
European Patent Office
Prior art keywords
carrier
workpiece
static pressure
double
end surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP12175279.4A
Other languages
English (en)
French (fr)
Other versions
EP2543475B1 (de
EP2543475A2 (de
Inventor
Atsushi Shibanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JTEKT Machine Systems Corp
Original Assignee
Koyo Machine Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koyo Machine Industries Co Ltd filed Critical Koyo Machine Industries Co Ltd
Publication of EP2543475A2 publication Critical patent/EP2543475A2/de
Publication of EP2543475A3 publication Critical patent/EP2543475A3/de
Application granted granted Critical
Publication of EP2543475B1 publication Critical patent/EP2543475B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP12175279.4A 2011-07-08 2012-07-06 Verfahren zum Schleifen eines dünnen blattartigen Werkstücks und doppelendiger Oberflächenschleifer Active EP2543475B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011152022A JP5627114B2 (ja) 2011-07-08 2011-07-08 薄板状ワークの研削方法及び両頭平面研削盤

Publications (3)

Publication Number Publication Date
EP2543475A2 EP2543475A2 (de) 2013-01-09
EP2543475A3 true EP2543475A3 (de) 2017-01-04
EP2543475B1 EP2543475B1 (de) 2019-03-27

Family

ID=46507898

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12175279.4A Active EP2543475B1 (de) 2011-07-08 2012-07-06 Verfahren zum Schleifen eines dünnen blattartigen Werkstücks und doppelendiger Oberflächenschleifer

Country Status (5)

Country Link
EP (1) EP2543475B1 (de)
JP (1) JP5627114B2 (de)
KR (1) KR101911553B1 (de)
SG (1) SG187316A1 (de)
TW (1) TWI604918B (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5724958B2 (ja) * 2012-07-03 2015-05-27 信越半導体株式会社 両頭研削装置及びワークの両頭研削方法
CN104259984A (zh) * 2014-09-18 2015-01-07 洛阳巨优机床有限公司 一种往复式双端面磨床往复送料板一浮一定式装置
CN104369058A (zh) * 2014-11-27 2015-02-25 石家庄轴设机电设备有限公司 滚子双端面磨床支撑及其使用方法
CN115741453B (zh) * 2022-11-30 2024-02-27 大连理工大学 一种多传感器融合的智能双面研磨机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002036078A (ja) * 2001-06-25 2002-02-05 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置
US20110039476A1 (en) * 2008-05-22 2011-02-17 Shin-Etsu Handotai Co., Ltd. Double-disc grinding apparatus and method for producing wafer

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3431681A (en) * 1965-07-23 1969-03-11 Landis Tool Co Work support shoe assembly
JP3673904B2 (ja) 1996-12-03 2005-07-20 光洋機械工業株式会社 薄板円板状ワークの両面研削装置
JP3702379B2 (ja) 1996-12-13 2005-10-05 光洋機械工業株式会社 薄板円板状ワークの両面研削装置
JP3993856B2 (ja) * 2004-01-22 2007-10-17 光洋機械工業株式会社 両頭平面研削装置
JP4143563B2 (ja) * 2004-03-16 2008-09-03 住友重機械工業株式会社 ワーク保持装置及び両面加工装置
JP2010042488A (ja) * 2008-08-15 2010-02-25 Mori Seiki Co Ltd ワーク受け及びこれを備えた研削盤

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002036078A (ja) * 2001-06-25 2002-02-05 Koyo Mach Ind Co Ltd 薄板円板状ワークの両面研削装置
US20110039476A1 (en) * 2008-05-22 2011-02-17 Shin-Etsu Handotai Co., Ltd. Double-disc grinding apparatus and method for producing wafer

Also Published As

Publication number Publication date
JP2013018065A (ja) 2013-01-31
SG187316A1 (en) 2013-02-28
TW201313386A (zh) 2013-04-01
KR101911553B1 (ko) 2018-10-24
JP5627114B2 (ja) 2014-11-19
TWI604918B (zh) 2017-11-11
KR20130006303A (ko) 2013-01-16
EP2543475B1 (de) 2019-03-27
EP2543475A2 (de) 2013-01-09

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