EP2556547A1 - Procédé de préparation de couches de semi-conducteurs amorphes - Google Patents

Procédé de préparation de couches de semi-conducteurs amorphes

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Publication number
EP2556547A1
EP2556547A1 EP12713900A EP12713900A EP2556547A1 EP 2556547 A1 EP2556547 A1 EP 2556547A1 EP 12713900 A EP12713900 A EP 12713900A EP 12713900 A EP12713900 A EP 12713900A EP 2556547 A1 EP2556547 A1 EP 2556547A1
Authority
EP
European Patent Office
Prior art keywords
plasma
volume
semiconductor
semiconductor layer
process gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12713900A
Other languages
German (de)
English (en)
Inventor
Stephan Wieber
Matthias Patz
Patrik Stenner
Michael CÖLLE
Janette Klatt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Operations GmbH
Original Assignee
Evonik Degussa GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evonik Degussa GmbH filed Critical Evonik Degussa GmbH
Publication of EP2556547A1 publication Critical patent/EP2556547A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411—Silicon, silicon germanium or germanium
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
    • H10F71/103—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/26—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition
    • H10P14/265—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using liquid deposition using solutions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2922—Materials being non-crystalline insulating materials, e.g. glass or polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3451—Structure
    • H10P14/3452—Microstructure
    • H10P14/3454—Amorphous
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to methods for producing amorphous semiconductor layers on a substrate by applying a semiconductor compound and then
  • Converting is carried out by treating the semiconductor layer with a plasma generated from a hydrogen-containing process gas.
  • the present invention relates to semiconductor layers produced by the method, electronic and optoelectronic products comprising such semiconductor layers.
  • Amorphous semiconductor layers in particular amorphous silicon layers, play a special role in the manufacture of electronic components, either as direct ones
  • amorphous silicon layers Compared to crystalline silicon layers, amorphous silicon layers have a higher absorption coefficient, which is why they are particularly interesting, since a better efficiency in terms of the amount of material is obtained.
  • the document EP 1 085 579 A1 describes processes for the production of solar cells, in which liquid compositions containing silanes are used and are converted by heat, light and / or laser treatment.
  • an intrinsic aSi layer is obtained at 450 ° C in 3% H 2 atmosphere.
  • the disadvantage is that the hydrogen is not atomic and thus not reactive.
  • US 4,927,786 A describes a process for producing a thin silicon-containing semiconductor film, wherein a film-forming silicon-containing gas is deposited, which deposits on a cooled surface of the substrate as a liquid.
  • the liquid is gradually reacted with reactive hydrogen atoms and converted into a silicon-containing solid, which forms a silicon-containing, thin semiconductor.
  • Si n H 2 n + 2 compounds with n> 2 are used.
  • the reactive H atoms are produced by glowing or microwave discharges in H 2 gas, as well as by UV light irradiation of H 2 gas or reaction with metals.
  • the disadvantage of this process is that used material is first brought into the gaseous state and that the substrate must be cooled.
  • EP 1 134 224 A2 describes a process for the production of silicon films on the
  • Silylcyclopentasilane or spiro [4.4] nonasilane are applied to a substrate surface to form a coating film, and then the coating film is formed by heating in a dehydrogenation reaction into a silicon film
  • JP 2004-134440 A1 deals with the irradiation of silane compositions in the context of a silicon layer production.
  • the silanes described can each be chain, ring or cage-shaped.
  • Irradiation time is between about 0.1 and 30 minutes, wherein the temperature in the irradiation between room temperature and 300 ° C may be.
  • a silicon film former is produced, which can be converted into a silicon film by temperatures of 100-1000 ° C., preferably 200-850 ° C., particularly preferably 300-500 ° C.
  • polycrystalline silicon layers result when conversion temperatures in excess of 550 ° C are selected. Below 300 ° C, no complete film formation occurs. The conversion can take place under H 2 gas atmosphere.
  • EP 1 113 502 A describes the production of a thin-film transistor, which has a
  • Silicon layer which is obtained by heat and / or light treatment of a film containing a silicon compound.
  • CVD methods generally prove to be disadvantageous because they are very complex in terms of apparatus and lengthy in terms of time.
  • semiconductor layers may have so-called dangling bonds in the semiconductor structure.
  • the semiconductor characteristics can be degraded.
  • the presence of semiconductor layers with open bonds in the case of solar cells can lead to a reduction of the light-induced charge transport.
  • H passivation is particularly necessary when the silicon layers are made by thermal processes.
  • the present invention is a process for the production of amorphous semiconductor layers.
  • a semiconductor layer can be understood in particular to be a layer which comprises at least one elemental semiconductor, preferably selected from the group consisting of Si, Ge, ⁇ -Sn, C, B, Se, Te and mixtures thereof, and / or at least one
  • Compound semiconductors in particular selected from the group consisting of IV-IV semiconductors, such as SiGe, SiC, III-V semiconductors, such as GaAs, GaSb, GaP, InAs, InSb, InP, InN, GaN, AlN, AlGaAs, InGaN, oxide semiconductors, such as InSnO, InO, ZnO, II-VI semiconductors, such as ZnS, ZnSe, ZnTe, III-VI semiconductors, such as GaS, GaSe, GaTe, InS, InSe, InTe, II Il-VI semiconductors, such as CulnSe 2 , CulnGaSe 2 , CulnS 2 , CulnGaS 2 , and mixtures thereof, or consists thereof.
  • IV-IV semiconductors such as SiGe, SiC, III-V semiconductors, such as GaAs, GaSb, GaP, InAs, InSb, InP, InN, GaN, Al
  • the semiconductor layer is a layer comprising silicon.
  • a silicon-comprising layer can be understood as meaning both a substantially pure silicon layer and a silicon-containing layer, for example a silicon-based layer, which also contains dopants, or a silicon-containing compound semiconductor layer.
  • a silicon-comprising layer can be understood as meaning both a substantially pure silicon layer and a silicon-containing layer, for example a silicon-based layer, which also contains dopants, or a silicon-containing compound semiconductor layer.
  • an amorphous silicon layer is produced.
  • the production of the amorphous takes place
  • amorphous semiconductor layers can be produced directly by treatment with a plasma generated from a hydrogen-containing process gas from semiconductor compounds applied to a substrate.
  • a plasma generated from a hydrogen-containing process gas from semiconductor compounds applied to a substrate is particularly, by treatment with a, from a hydrogen-containing
  • Silicon layer to be converted said layers have very good electrical properties.
  • H-passivation in a second step is required in order to obtain correspondingly suitable layers for electrical applications.
  • the plasma conversion reduces the process time compared to conventional conversion.
  • the application of the semiconductor compounds is preferably carried out by liquid-phase methods.
  • the semiconductor compounds applied by liquid-phase methods can be converted particularly well by plasma chemistry.
  • the semiconductor compounds mentioned are
  • liquid processable compounds of silicon, germanium and mixed compounds or mixtures thereof as well as liquid processable mixed compounds or mixtures of the elements gallium, arsenic, boron, phosphorus, antimony, zinc, indium, tin, selenium and
  • the semiconductor compounds are silicon-containing or
  • Germanium or silicon and germanium existing layer can be converted.
  • Semiconductor compounds in particular liquid educts (optionally acting as a solvent for other additives and / or dopants) or liquid solutions containing the (even liquid or solid) starting materials (and optionally other additives and / or dopants, the latter in particular in the form of elemental compounds of III and V. main group), which are applied to the substrate to be coated.
  • Corresponding processes for the preparation of higher silanes are known to the person skilled in the art. Exemplary are photochemical, anionic, cationic or catalytic polymerization processes.
  • a higher silane which has a weight-average molecular weight of 330-10,000 g / mol measured via GPC. More preferably, the weight average molecular weight of the higher silane is 330-5,000 g / mol, more preferably 600-4000 g / mol, measured by GPC.
  • the weight average molecular weight of the higher silane is 330-5,000 g / mol, more preferably 600-4000 g / mol, measured by GPC.
  • the at least one higher silane if it is itself liquid, can be applied to the substrate without solvent in a solvent. However, it is preferably applied dissolved in a solvent to the substrate.
  • solvents from the group consisting of linear, branched or cyclic saturated, unsaturated or aromatic hydrocarbons having one to 12 carbon atoms (optionally partially or completely halogenated), alcohols, ethers, carboxylic acids, esters, nitriles, amines, amides, sulfoxides and Water.
  • n-pentane n-hexane, n-heptane, n-octane, n-decane, dodecane, cyclohexane, cyclooctane, cyclodecane, dicyclopentane, benzene, toluene, m-xylene, p-xylene, mesitylene, indane, indene , Tetrahydronaphthalene, decahydronaphthalene, diethyl ether, dipropyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether,
  • Particularly suitable solvents are the hydrocarbons n-pentane, n-hexane, n-hexane, n-octane, n-decane, dodecane, cyclohexane, cyclooctane, cyclodecane, benzene, toluene, m-xylene, p-xylene, mesitylene, indane and inden.
  • Weight percent of it preferably at least 5 wt .-% based on the total mass of this composition. If the at least one higher silane is brought to the substrate in a solvent without further solution, its weight percentage, depending on whether it itself serves as a solvent for further additives and / or dopants, is preferably between 70 and 100% by weight, based on the Total mass of the composition.
  • the at least one higher silane is thus preferably used in a proportion of 5-100% by weight, based on the total mass of the composition containing it. Particularly thin layers can be achieved if compositions with a proportion of the at least one higher silane of 10-50% by weight are used. To achieve positive layer properties, together with the at least one
  • a multiplicity of substrates can be used. Preference is given to substrates consisting of glass, quartz glass, graphite, metal, silicon or consisting of a silicon, indium tin oxide, ZnO: F or SnO 2 : F layer on a heat-compatible support.
  • Preferred metals are aluminum, stainless steel, Cr steel, titanium, chromium or molybdenum. Furthermore, plastic films z. B. from PEN, PET or polyimides.
  • the application of the semiconductor compound, in particular of the higher silane, preferably takes place via a process selected from printing or coating processes (in particular
  • Spray method spin-coating method, dip-coating method and method selected from Meniscus Coating, Slit Coating, Slot Die Coating, and Curtain Coating.
  • the semiconductor layer can advantageously be converted simultaneously and the open bonds possibly created during the conversion
  • the present inventive method combines the conversion of the deposited semiconductor compound into an amorphous semiconductor layer with the
  • Hydrogen passivation By simultaneously converting and hydrogen passivation can Advantageously, the number of process steps is reduced and different process steps are avoided and thus the overall production costs of semiconductor layers are reduced. Hydrogen passivation, for example, for solar cells by increasing light-induced charge transport relative to the time before
  • the hydrogen passivation can be checked by IR spectroscopy by changing the bands of the respective semiconductor (for silicon layers: by changing the characteristic band at 2000 cm -1. )
  • a small amount of hydrogen is sufficient for passivation, which is advantageous for the
  • the process gas comprises> 0 vol.% To ⁇ 100 vol.%, In particular> 0.5 vol.% To ⁇ 20 vol.%, Hydrogen,> 0 vol.% To ⁇ 100 Vol .-%, in particular> 20 Vol .-% to ⁇ 99.5 Vol .-%, nitrogen, and / or> 0 Vol .-% to ⁇ 100 Vol .-%, in particular> 20 Vol .-% to ⁇ 99.5 vol .-%, noble gas / e, in particular argon.
  • the process gas thus additionally comprises a noble gas, in particular argon, or a noble gas mixture and / or nitrogen.
  • the plasma temperature of a plasma generated from a hydrogen-containing process gas can also be lowered by increasing the process gas pressure or the process gas velocity and vice versa by reducing the process gas pressure or the process gas velocity can be increased.
  • the process gas pressure can be varied, for example, within a range of> 0.5 bar to ⁇ 8 bar, for example> 1 bar to ⁇ 5 bar.
  • the temperature with which the semiconductor compound film is treated can also be adjusted by further process parameters.
  • the treatment temperature can be adjusted by adjusting the distance between the plasma generation location and the semiconductor compound film to be treated, for example, between a plasma nozzle and the compound semiconductor film.
  • the treatment temperature decreases with an increase in the distance and increases at a
  • the distance between a plasma nozzle and the semiconductor compound film to be treated in a range of 50 ⁇ to 50 mm, preferably 1 mm to 30 mm, particularly preferably 3 mm to 10 mm.
  • the treatment temperature can be adjusted by adjusting the treatment time
  • Semiconductor compound film is moved to be set. It sinks
  • Semiconductor compound film is moved and increases in an extension of the treatment time or a reduction in the treatment speed at which the plasma is moved over the compound semiconductor film. This can be done for example by an X / Y driving device. A particularly good conversion is, especially for the o. G. Distances of the nozzle from the semiconductor compound film to be treated are obtained when the treatment speed, determined as a treated distance of the compound semiconductor film per unit time, is 0.1 to 500 mm / s with a treatment width of 1 to 15 mm. Depending on the semiconductor compound film surface to be treated, temperature control further accelerates the conversion. To increase the treatment speed several plasma nozzles can be connected in series. Furthermore, the plasma nozzle can also be performed several times over the film to be treated.
  • the emerging from the nozzle plasma jet is to achieve a particularly good
  • Conversion preferably in a Wnkel of 5 to 90 °, preferably 80 to 90 °, particularly preferably 85 to 90 ° (in the latter case: substantially perpendicular to the substrate surface for planar substrates) directed onto the semiconductor compound film located on the substrate.
  • nozzles for the arc plasma source are pointed nozzles, fan nozzles or rotating nozzles, preferably pointed nozzles are used, which have the advantage that a higher point energy density is achieved.
  • the treatment width of the plasma nozzle to achieve a good conversion is preferably 0.25 to 20 mm, preferably 1 to 5 mm.
  • the conversion is carried out at atmospheric pressure.
  • the conversion is carried out at atmospheric pressure.
  • Plasma source be an atmospheric pressure plasma source. So can advantageously on a costly low pressure or high pressure process can be dispensed with. In addition, compared to low-pressure process or vacuum process, the residence time can be reduced since a higher energy density can be achieved at atmospheric pressure due to the higher molecular density.
  • the plasma source may be a high-voltage gas discharge plasma source or an arc plasma source.
  • the conversion to an amorphous semiconductor layer is performed by treating the compound semiconductor film with a plasma generated from an indirect plasma source.
  • an indirect plasma source can be understood as meaning a plasma source in which the plasma is generated outside the reaction zone with the semiconductor compound film.
  • the plasma is therefore outside the
  • Plasmas have the advantage that they are potential-free and therefore none
  • the conversion is performed by treating the compound semiconductor film with a plasma generated by a plasma source equipped with a plasma nozzle.
  • a plasma source equipped with a plasma nozzle.
  • Such plasma sources are indirect
  • the plasma source may in particular have an inner electrode arranged in the cavity of the plasma nozzle and electrically insulated from the plasma nozzle.
  • Inner electrode and the plasma nozzle can in such a plasma source between the Inner electrode and the plasma nozzle plasma are generated by a self-sustaining gas discharge.
  • the process gas can be mixed before feeding from different gases, for example hydrogen and optionally noble gas / s, in particular argon, and / or nitrogen.
  • the different gases can be mixed in particular in an adjustable ratio to each other.
  • the treatment width of the plasma nozzle can be, for example, from> 0.25 mm to ⁇ 20 mm, for example from> 1 mm to ⁇ 5 mm.
  • the plasma can in particular by means of an arc or by means of a high-voltage gas discharge, for example, a built-up voltage of> 8 kV to
  • the plasma can by a
  • High voltage gas discharge plasma source or an arc plasma source can be generated.
  • the plasma may be affected by a pulsed voltage
  • a square wave voltage, or an AC voltage can be generated.
  • the plasma may be controlled by a square wave voltage of> 15 kHz to ⁇ 25 kHz and / or
  • the plasma can by a high-pressure gas discharge at currents of ⁇ 45 A, for example> 0, 1 A to ⁇ 44 A, for example, from> 1, 5 A to
  • ⁇ 3 A DC can be generated.
  • a high-pressure gas discharge in particular a gas discharge at pressures of> 0.5 bar to ⁇ 8 bar, for example of
  • Corresponding plasmas can be obtained, for example, under the commercial product name Plasmajet from the company Plasmatreat GmbH, Germany or under the commercial product name Plasmabeam from the company Diener GmbH,
  • the plasma is generated in the context of the present invention by a voltage with a frequency of ⁇ 30 kHz, for example from> 15 kHz to ⁇ 25 kHz, for example from ⁇ 20 kHz. Due to the low frequencies of the energy input is advantageously particularly low. The low energy input in turn has the advantage that damage to the surface of the compound semiconductor film can be avoided.
  • the substrate coated with the semiconductor compound may be subjected to an additional temperature control before and / or during the conversion into an amorphous semiconductor layer are, wherein the temperature is selected so that no conversion into an amorphous semiconductor layer is carried out by the temperature alone.
  • the actual conversion is to be carried out in the context of the present invention by the treatment of the semiconductor compound film with a plasma generated from a hydrogen-containing process gas. Rather, the above-mentioned temperature treatment of a drying of the applied to the substrate
  • the temperature control before and / or during the conversion into an amorphous semiconductor layer takes place at a temperature between 50.degree. C. and 350.degree. C., in particular between 100.degree. C. and 300.degree.
  • the temperature before conversion can have a different temperature than that during the conversion.
  • the temperature during the plasma treatment can improve the quality of the layer to be produced, which alone does not lead to the conversion.
  • the temperature can be controlled by the use of ovens, heated rollers, hot plates, infrared or microwave radiation or the like.
  • the tempering is particularly preferably carried out because of the resulting low cost with a hot plate or with heated rollers in the roll-to-roll process.
  • Another object of the present invention is a semiconductor layer, which is produced by a method according to the invention.
  • Photofactor is the quotient of the conductivity under illumination (usually AM 1, 5) and the dark conductivity (conductivity under exclusion of light). For a good photovoltaically active semiconductor layer, a high quotient can be achieved.
  • Another object of the present invention is an electronic or
  • optoelectronic product for example photovoltaic device, transistor,
  • Liquid crystal display in particular solar cell, which is an inventive
  • Semiconductor layer comprises.
  • Atmospheric pressure plasma is at 1, 8 bar, 8 mm / sec line speed, 4 mm
  • the plasma is generated with a power of 800 W at a frequency of 20 kHz.

Landscapes

  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne des procédés de préparation de couches de semi-conducteurs amorphes sur un substrat par application d'un composé semi-conducteur de la forme EaE'nXm présentant un poids moléculaire moyen pondéré en poids de 330 - 10000 g/mol, sachant que E, E'= Si, Ge ; X = F, Cl, Br, I, -C1-C12-alkyle, -C1-C12-aryle, -C1-C12-aralkyle, H ; m > n+a et a+n = 3, puis par conversion du composé semi-conducteur en une couche de semi-conducteur amorphe, la conversion s'effectuant par traitement de la couche de semi-conducteur par un plasma produit à partir d'un gaz de process contenant de l'hydrogène. En outre, la présente invention concerne les couches de semi-conducteurs préparées selon ledit procédé, et des produits électroniques et optoélectroniques comportant de telles couches de semi-conducteurs.
EP12713900A 2011-03-29 2012-03-15 Procédé de préparation de couches de semi-conducteurs amorphes Withdrawn EP2556547A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011006307A DE102011006307A1 (de) 2011-03-29 2011-03-29 Verfahren zum Herstellen von amorphen Halbleiterschichten
PCT/EP2012/054532 WO2012130620A1 (fr) 2011-03-29 2012-03-15 Procédé de préparation de couches de semi-conducteurs amorphes

Publications (1)

Publication Number Publication Date
EP2556547A1 true EP2556547A1 (fr) 2013-02-13

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Country Link
EP (1) EP2556547A1 (fr)
DE (1) DE102011006307A1 (fr)
TW (1) TW201303974A (fr)
WO (1) WO2012130620A1 (fr)

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DE102010041842A1 (de) 2010-10-01 2012-04-05 Evonik Degussa Gmbh Verfahren zur Herstellung höherer Hydridosilanverbindungen
DE102010062984A1 (de) 2010-12-14 2012-06-14 Evonik Degussa Gmbh Verfahren zur Herstellung höherer Halogen- und Hydridosilane
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EP3932862A1 (fr) 2020-07-01 2022-01-05 Evonik Operations GmbH Graphène fonctionnalisé, procédé de fabrication d'un graphène fonctionnalisé et son utilisation

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