EP2577720A4 - Vorrichtung und verfahren zur ablösung einer haftschicht von der oberfläche ultradünner wafer - Google Patents

Vorrichtung und verfahren zur ablösung einer haftschicht von der oberfläche ultradünner wafer Download PDF

Info

Publication number
EP2577720A4
EP2577720A4 EP11787385.1A EP11787385A EP2577720A4 EP 2577720 A4 EP2577720 A4 EP 2577720A4 EP 11787385 A EP11787385 A EP 11787385A EP 2577720 A4 EP2577720 A4 EP 2577720A4
Authority
EP
European Patent Office
Prior art keywords
detaping
adhesive layer
ultra thin
thin wafers
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11787385.1A
Other languages
English (en)
French (fr)
Other versions
EP2577720A2 (de
EP2577720B1 (de
Inventor
Gregory George
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suess Microtec Lithography GmbH
Original Assignee
Suess Microtec Lithography GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suess Microtec Lithography GmbH filed Critical Suess Microtec Lithography GmbH
Publication of EP2577720A2 publication Critical patent/EP2577720A2/de
Publication of EP2577720A4 publication Critical patent/EP2577720A4/de
Application granted granted Critical
Publication of EP2577720B1 publication Critical patent/EP2577720B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H10F77/935—Interconnections for devices having potential barriers for photovoltaic devices or modules
    • H10F77/937—Busbar structures for modules
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7448—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1174—Using roller for delamination [e.g., roller pairs operating at differing speeds or directions, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/195—Delaminating roller means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
EP11787385.1A 2010-05-27 2011-05-26 Vorrichtung und verfahren zur ablösung einer haftschicht von der oberfläche ultradünner wafer Not-in-force EP2577720B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US34879410P 2010-05-27 2010-05-27
US13/115,232 US8574398B2 (en) 2010-05-27 2011-05-25 Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers
PCT/US2011/038045 WO2011150154A2 (en) 2010-05-27 2011-05-26 Apparatus and method for detaping an adhesive layer from the surface of ultra thin wafers

Publications (3)

Publication Number Publication Date
EP2577720A2 EP2577720A2 (de) 2013-04-10
EP2577720A4 true EP2577720A4 (de) 2017-04-12
EP2577720B1 EP2577720B1 (de) 2018-07-04

Family

ID=45021098

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11787385.1A Not-in-force EP2577720B1 (de) 2010-05-27 2011-05-26 Vorrichtung und verfahren zur ablösung einer haftschicht von der oberfläche ultradünner wafer

Country Status (3)

Country Link
US (1) US8574398B2 (de)
EP (1) EP2577720B1 (de)
WO (1) WO2011150154A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8571699B2 (en) * 2010-09-10 2013-10-29 Taiwan Semiconductor Manufacturing Company, Ltd. System and method to reduce pre-back-grinding process defects
US9352542B2 (en) * 2012-02-07 2016-05-31 Tokyo Ohka Kogyo Co., Ltd. Processing method and processing apparatus
JP5591859B2 (ja) * 2012-03-23 2014-09-17 株式会社東芝 基板の分離方法及び分離装置
US8697542B2 (en) * 2012-04-12 2014-04-15 The Research Foundation Of State University Of New York Method for thin die-to-wafer bonding
KR102305505B1 (ko) 2014-09-29 2021-09-24 삼성전자주식회사 웨이퍼 서포팅 시스템 디본딩 이니시에이터 및 웨이퍼 서포팅 시스템 디본딩 방법
KR102021302B1 (ko) * 2015-05-08 2019-09-16 후지필름 가부시키가이샤 디바이스 기판 및 반도체 디바이스의 제조 방법
CN110071054A (zh) * 2018-01-23 2019-07-30 上海新阳半导体材料股份有限公司 一种集成电路封装后处理的去胶方法
EP3633718A1 (de) * 2018-10-01 2020-04-08 Infineon Technologies AG Detektion von klebstoffresteresten auf einem wafer

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1326266A2 (de) * 2001-12-27 2003-07-09 Nitto Denko Corporation Verfahren zum Beschichten und zum Trennen von einem Schutzband
JP2005317882A (ja) * 2004-05-26 2005-11-10 Lintec Corp 貼付テーブル
JP2006073920A (ja) * 2004-09-06 2006-03-16 Lintec Corp テープ貼付装置、マウント装置及びマウント方法
EP1742254A1 (de) * 2004-04-23 2007-01-10 Lintec Corporation Saugvorrichtung

Family Cites Families (17)

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JP3156419B2 (ja) * 1993-02-15 2001-04-16 松下電器産業株式会社 異方性導電フィルム保護用セパレータの剥離方法
JP3619058B2 (ja) * 1998-06-18 2005-02-09 キヤノン株式会社 半導体薄膜の製造方法
JP2000331961A (ja) 1999-05-19 2000-11-30 Okamoto Machine Tool Works Ltd デバイスウエハの剥離方法
JP4266106B2 (ja) 2001-09-27 2009-05-20 株式会社東芝 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法
JP3770820B2 (ja) 2001-10-03 2006-04-26 日東電工株式会社 保護テープの貼付け方法
JP2003209082A (ja) 2002-01-15 2003-07-25 Nitto Denko Corp 保護テープの貼付方法およびその装置並びに保護テープの剥離方法
JP4318471B2 (ja) 2003-03-05 2009-08-26 日東電工株式会社 保護テープの貼付・剥離方法
JP2006316078A (ja) 2003-10-17 2006-11-24 Lintec Corp 接着テープの剥離方法及び剥離装置
JP2005175384A (ja) 2003-12-15 2005-06-30 Nitto Denko Corp 保護テープの貼付方法及び剥離方法
JP4592289B2 (ja) 2004-01-07 2010-12-01 日東電工株式会社 半導体ウエハの不要物除去方法
JP4616160B2 (ja) 2005-12-06 2011-01-19 リンテック株式会社 シート貼付装置およびシート貼付方法
JP4698517B2 (ja) 2006-04-18 2011-06-08 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置
US7846288B2 (en) 2006-05-10 2010-12-07 Micron Technology, Inc. Methods and systems for removing protective films from microfeature workpieces
JP4641984B2 (ja) * 2006-07-31 2011-03-02 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法
JP4711904B2 (ja) 2006-07-31 2011-06-29 日東電工株式会社 半導体ウエハへの粘着テープ貼付け方法および半導体ウエハからの保護テープ剥離方法
SG148884A1 (en) 2007-06-15 2009-01-29 Micron Technology Inc Method and system for removing tape from substrates
US20100059183A1 (en) 2008-09-10 2010-03-11 Hiwin Mikrosystem Corp. Wafer taping and detaping machine

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1326266A2 (de) * 2001-12-27 2003-07-09 Nitto Denko Corporation Verfahren zum Beschichten und zum Trennen von einem Schutzband
EP1742254A1 (de) * 2004-04-23 2007-01-10 Lintec Corporation Saugvorrichtung
JP2005317882A (ja) * 2004-05-26 2005-11-10 Lintec Corp 貼付テーブル
JP2006073920A (ja) * 2004-09-06 2006-03-16 Lintec Corp テープ貼付装置、マウント装置及びマウント方法

Also Published As

Publication number Publication date
EP2577720A2 (de) 2013-04-10
US20110290415A1 (en) 2011-12-01
WO2011150154A3 (en) 2012-03-01
US8574398B2 (en) 2013-11-05
WO2011150154A2 (en) 2011-12-01
EP2577720B1 (de) 2018-07-04

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