EP2607620A1 - Wärmepufferung von Bohrlochausrüstung mit Speicherstoff - Google Patents

Wärmepufferung von Bohrlochausrüstung mit Speicherstoff Download PDF

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Publication number
EP2607620A1
EP2607620A1 EP11290600.3A EP11290600A EP2607620A1 EP 2607620 A1 EP2607620 A1 EP 2607620A1 EP 11290600 A EP11290600 A EP 11290600A EP 2607620 A1 EP2607620 A1 EP 2607620A1
Authority
EP
European Patent Office
Prior art keywords
phase change
change material
temperature
electronic component
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11290600.3A
Other languages
English (en)
French (fr)
Inventor
Sandrine Lelong-Feneyrou
Frederic Pauchet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Services Petroliers Schlumberger SA
Schlumberger Technology BV
Schlumberger Holdings Ltd
Prad Research and Development Ltd
Original Assignee
Services Petroliers Schlumberger SA
Schlumberger Technology BV
Schlumberger Holdings Ltd
Prad Research and Development Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Services Petroliers Schlumberger SA, Schlumberger Technology BV, Schlumberger Holdings Ltd, Prad Research and Development Ltd filed Critical Services Petroliers Schlumberger SA
Priority to EP11290600.3A priority Critical patent/EP2607620A1/de
Priority to US14/366,678 priority patent/US20150000913A1/en
Priority to MX2014007773A priority patent/MX2014007773A/es
Priority to PCT/US2012/070806 priority patent/WO2013096550A1/en
Publication of EP2607620A1 publication Critical patent/EP2607620A1/de
Withdrawn legal-status Critical Current

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B36/00—Heating, cooling or insulating arrangements for boreholes or wells, e.g. for use in permafrost zones
    • E21B36/001—Cooling arrangements
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments
    • E21B47/0175—Cooling arrangements

Definitions

  • the disclosure pertains generally to thermal buffering of electronic components and more particularly to thermal buffering of downhole electronic components using phase change materials.
  • Components of petroleum well downhole assemblies can be subjected to pressures, temperatures, and fluid compositions that are hostile to temperature-sensitive components.
  • Temperature-sensitive components such as various electronic components in downhole assembly tools can initially be protected from well temperatures by a housing, but the temperature within the housing eventually rises above a desired operating temperature as heat-producing components operate in an enclosed environment.
  • This document provides methods, systems, and techniques relating to thermal buffering of heat-sensitive components.
  • a downhole assembly of a wellsite system includes a housing containing an electronic component that can generate heat and a first phase change material.
  • the first phase change material is packaged in a first container comprising a first microporous material and placed in thermal communication with the electronic component such that the heat generated by the electronic component can transfer to the first phase change material.
  • the first phase change material has a phase change at a temperature at or below a first temperature.
  • the first temperature is a predetermined maximum operating temperature of the electronic component.
  • the second phase change material changes from solid to liquid, liquid to gas, or solid to gas at a temperature at or below the second temperature.
  • the first phase change material is included at a mass sufficient to increase operating time of the electronic component at or below the first temperature by at least about 10%.
  • the downhole assembly includes two phase change materials at a combined mass sufficient to increase operating time of the electronic component at or below a predetermined maximum operating temperature by at least about 10%.
  • a method includes the steps of: a) providing downhole assembly comprising a housing, an electronic component disposed inside the housing, and a first phase change material disposed inside the housing; b) placing the first phase change material in thermal communication with the electronic component; and c) absorbing heat generated by the electronic component by a phase change of the first phase change material at or below a first temperature.
  • the method provides a downhole assembly further comprising a second phase change material disposed inside the housing.
  • the method further includes the steps of a) placing the second phase change material in thermal communication with the electronic component such that heat generated by the electronic component can transfer to the second phase change material; and b) absorbing the heat generated by the electronic component by a phase change of the second phase change material at or below a second temperature.
  • the method further includes automatically stopping operation of the electronic component when a temperature inside the housing reaches the first or second temperature.
  • the method further includes stopping operation of the electronic component at a time point calculated to be at or before a temperature in the housing reaches the first or second temperature.
  • the first phase change material is provided at a mass sufficient to increase operating time of the electronic component at or below the first temperature by at least about 10%.
  • the first phase change material and the second phase change material are provided at a combined mass sufficient to increase operating time of the electronic component at or below a predetermined maximum operating temperature of the electronic component by at least about 10%.
  • the first and second temperatures are at or below a predetermined maximum operating temperature of the electronic component.
  • Figure 1 is a schematic diagram of a wellsite system in accordance with an embodiment of the disclosure.
  • Figure 2 is a schematic cross-sectional diagram of an assembly in accordance with an embodiment of the disclosure.
  • Figure 3 is an example of a phase change material in a flexible container in accordance with an embodiment of the disclosure.
  • Figure 5 is a flow chart illustrating a method in accordance with an embodiment of the disclosure.
  • the bottom hole assembly 100 of the wellsite system of Figure 1 can, as one example, include one or more of a logging-while-drilling (LWD) module 120, a measuring-while-drilling (MWD) module 130, a roto-steerable system and motor 150, and the drill bit 105.
  • bottom hole assembly equipment can include heat-producing components (e.g., electronic components) as well as heat-sensitive components (e.g., electronic components), where thermal buffering may be beneficial.
  • the wellsite system is used for a logging-while-drilling (LWD) or measurement-while-drilling (MWD) operation performed on a land based rig, but could be any type of oil/gas operations (e.g., wireline, coiled tubing, testing, completions, production, etc.) performed on a land based rig or offshore platform.
  • LWD logging-while-drilling
  • MWD measurement-while-drilling
  • FIG. 2 is a schematic cross-sectional illustration of a downhole assembly 200 that can, for example, be included in an MWD module, an LWD module, or other downhole equipment such as well formation pressure testing equipment.
  • the assembly 200 includes a housing 210 containing a heat-producing component 220 in thermal communication with a thermal buffering (e.g. phase change material) component 230.
  • a first component e.g., a heat-producing component
  • a second component e.g., a phase change material component
  • the heat-producing component 220 and the phase change material component 230 can be in thermal communication by direct physical contact.
  • the heat-producing component 220 and the phase change material component 230 can be in thermal communication indirectly such as, for example, through contact with another component or part of the housing or open space in the container 210.
  • a heat-producing component 220 can be an electronic component such as a multichip module.
  • a heat-producing component 220 can include individual electronic parts such as integrated circuit (IC) chips that are soldered or otherwise secured to a substrate such as a silicone-on-insulator (SOI) or printed circuit board.
  • IC integrated circuit
  • SOI silicone-on-insulator
  • copper wiring traces within the printed circuit board may assist in carrying thermal energy away from IC chips and other elements within the heat-producing component 220.
  • a phase change material component 230 includes a phase change material packaged in a container 232 ( Figure 3 ) having any suitable shape.
  • a phase change material is packaged in a flexible container.
  • a phase change material can be packaged in a container comprising a material that prevents the phase change material from flowing out of the container 232 when the phase change material is in a fluid or semi-fluid phase.
  • Materials suitable for use in a phase change material container include, without limitation, microporous films or membranes (e.g ., open pore and/or filled pore microporous polytetrafluoroethylene (PTFE), polypropylene, polyethylene, polyester, nylon, etc.), woven or nonwoven fabrics ( e.g., polyester, polypropylene, and polyethylene spunbonded, spunlaced, meltblown microfiber fabrics, etc.), laminates, coated fabrics, and the like.
  • PTFE polytetrafluoroethylene
  • PTFE polytetrafluoroethylene
  • PTFE polytetrafluoroethylene
  • polypropylene polyethylene
  • polyester polyester
  • nylon nylon
  • woven or nonwoven fabrics e.g., polyester, polypropylene, and polyethylene spunbonded, spunlaced, meltblown microfiber fabrics, etc.
  • laminates, coated fabrics, and the like e.g., laminates, coated fabrics, and the like.
  • Various microporous films are available from
  • a material used to package a phase change material can be chosen based on the ability to maintain integrity at high temperature and/or the ability to conduct thermal energy to the packaged phase change material. In some embodiments, a material used to package a phase change material can be chosen based on a property (e.g ., hydrophobicity, hydrophilicity, fluidity of one or more phases, etc.) of the chosen phase change material. In some embodiments, different materials can be used to package different phase change materials.
  • container 232 is flexible, allowing the phase change material component 230 to be inserted various spaces within the housing 210.
  • the phase change material contained within container 232 may be in a form that can be deformed, such as a pliable solid, a fluid, a powder, a slurry, or a plurality of encapsulated or unencapsulated portions.
  • the phase change material can be preformed to fit within a particular space within container 232.
  • a phase change material can be any suitable material that absorbs thermal energy during a phase change (e.g ., solid to solid, solid to liquid, liquid to gas, or solid to gas) that occurs as temperature increases.
  • suitable phase change materials include, without limitation, paraffins, fatty acids, salt hydrates, and eutectic materials.
  • Various phase change materials are available from a number of sources including PCM Products Ltd., PCM Thermal Solutions, Microtek Laboratories, Inc., and Amec Thermasol.
  • a phase change material may be chosen for the ability to absorb thermal energy during a phase change at or below a selected temperature.
  • a selected temperature can be at or below a predetermined maximum operating temperature, at or below which a heat-sensitive component typically does not fail due to thermal stress.
  • a selected temperature can be at or below a temperature at which a heat-sensitive component begins to fail due to thermal stress.
  • assembly 200 includes a plurality of phase change material components 230 separately comprising different phase change materials each with different temperatures at which a phase change occurs.
  • different phase change materials may be chosen in order to increase total thermal energy absorption potential over the use of a single phase change material within the volume available in housing 210.
  • additional phase change materials may be chosen for a phase change that is at or below that of another phase change material. As such, a temperature can be selected that is at or below a temperature at which a phase change material changes phases.
  • a phase change material can be included in assembly 200 at a mass sufficient to increase the time at which a heat-producing component 220 can operate at or below a selected temperature.
  • a plurality of different phase change materials can be included in assembly 200 at a combined mass sufficient to increase the time at which a heat-producing component 220 can operate at or below a predetermined maximum operating temperature of a heat-sensitive component.
  • a phase change material can be included in assembly 200 at a mass sufficient to increase the time for which a heat-producing component 220 can operate at or below a selected temperature by at least about 5%.
  • the time for which a heat-producing component 220 can operate at or below a selected temperature can be increased by at least about 7%, 10%, 12%, 15%, 18%, 20%, 25%, 30%, 50%, or more.
  • assembly 200 can further include additional components, such as a temperature sensor to gauge the temperature within housing 210.
  • a thermal switch can be included in assembly 200 that automatically shuts down the operation of a heat-producing component 220 when the temperature in container 210 reaches a selected temperature.
  • temperature within housing 210 can be monitored and the operation of a heat-producing component 220 can be switched off when the temperature in container 210 is observed to reach a selected temperature.
  • the amount of time a heat-producing component 220 can operate at or below a selected temperature can be calculated based on a latent heat storage potential and mass of a selected phase change material included in assembly 200. In some embodiments, operation of a heat-producing component 220 can be stopped at a time point that is calculated to be at or before reaching a selected temperature.
  • one embodiment of method 1000 includes the steps of providing a downhole assembly comprising a housing, an electronic component disposed inside the housing, and a first phase change material also disposed inside the housing 1050; placing the first phase change material in thermal communication with the electronic component 1052; and absorbing heat generated by electronic component by a phase change of the first phase change material at or below a first temperature 1054.
  • a method 1200 can include the steps of providing a downhole assembly comprising a housing, an electronic component disposed inside the housing, and a first phase change material and a second phase change material also disposed inside the housing 1250; placing the first phase change material in thermal communication with the electronic component 1252; placing the second phase change material in thermal communication with the electronic component or the first phase change material 1254; and absorbing heat generated by electronic component by a phase change of the second phase change material at or below a second temperature 1256.
  • a method 1000 or 1200 can include automatically stopping operation of the electronic component when a temperature inside the housing reaches the first or second temperature, or stopping operation of the electronic component at a time point calculated to be at or before a temperature in the housing reaches the first or second temperature.

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  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Geology (AREA)
  • Mining & Mineral Resources (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Fluid Mechanics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Geophysics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP11290600.3A 2011-12-22 2011-12-22 Wärmepufferung von Bohrlochausrüstung mit Speicherstoff Withdrawn EP2607620A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP11290600.3A EP2607620A1 (de) 2011-12-22 2011-12-22 Wärmepufferung von Bohrlochausrüstung mit Speicherstoff
US14/366,678 US20150000913A1 (en) 2011-12-22 2012-12-20 Thermal Buffering of Downhole Equipment with Phase Change Material
MX2014007773A MX2014007773A (es) 2011-12-22 2012-12-20 Amortiguamiento termico de equipo con material de cambio de fase en el fondo del agujero.
PCT/US2012/070806 WO2013096550A1 (en) 2011-12-22 2012-12-20 Thermal buffering of downhole equipment with phase change material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11290600.3A EP2607620A1 (de) 2011-12-22 2011-12-22 Wärmepufferung von Bohrlochausrüstung mit Speicherstoff

Publications (1)

Publication Number Publication Date
EP2607620A1 true EP2607620A1 (de) 2013-06-26

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EP11290600.3A Withdrawn EP2607620A1 (de) 2011-12-22 2011-12-22 Wärmepufferung von Bohrlochausrüstung mit Speicherstoff

Country Status (4)

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US (1) US20150000913A1 (de)
EP (1) EP2607620A1 (de)
MX (1) MX2014007773A (de)
WO (1) WO2013096550A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10787897B2 (en) 2016-12-22 2020-09-29 Baker Hughes Holdings Llc Electronic module housing for downhole use
US11306578B2 (en) 2018-04-16 2022-04-19 Baker Hughes, A Ge Company, Llc Thermal barrier for downhole flasked electronics
CN108952688B (zh) * 2018-08-22 2021-11-23 西安石油大学 一种深水高温高压油气井测试管柱及其测试方法
CN109652028A (zh) * 2018-12-29 2019-04-19 中石化石油工程技术服务有限公司 一种基于相变材料的钻井液温度控制方法
WO2023173030A1 (en) 2022-03-11 2023-09-14 Axis Service, Llc Pressure control assembly

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0129954A1 (de) * 1983-06-22 1985-01-02 Mobil Oil Corporation Passives Temperaturregelsystem
US6341498B1 (en) * 2001-01-08 2002-01-29 Baker Hughes, Inc. Downhole sorption cooling of electronics in wireline logging and monitoring while drilling
US20030085039A1 (en) * 2001-01-08 2003-05-08 Baker Hughes, Inc. Downhole sorption cooling and heating in wireline logging and monitoring while drilling
US20050005624A1 (en) * 2001-01-08 2005-01-13 Baker Hughes, Inc. Downhole sorption cooling and heating in wireline logging and monitoring while drilling
WO2006065559A1 (en) * 2004-12-03 2006-06-22 Halliburton Energy Services, Inc. Heating and cooling electrical components in a downhole operation
US7440283B1 (en) * 2007-07-13 2008-10-21 Baker Hughes Incorporated Thermal isolation devices and methods for heat sensitive downhole components

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5485671A (en) * 1993-09-10 1996-01-23 Aavid Laboratories, Inc. Method of making a two-phase thermal bag component cooler
EP2518265A1 (de) * 2011-04-29 2012-10-31 Welltec A/S Bohrwerkzeug

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0129954A1 (de) * 1983-06-22 1985-01-02 Mobil Oil Corporation Passives Temperaturregelsystem
US6341498B1 (en) * 2001-01-08 2002-01-29 Baker Hughes, Inc. Downhole sorption cooling of electronics in wireline logging and monitoring while drilling
US20030085039A1 (en) * 2001-01-08 2003-05-08 Baker Hughes, Inc. Downhole sorption cooling and heating in wireline logging and monitoring while drilling
US20050005624A1 (en) * 2001-01-08 2005-01-13 Baker Hughes, Inc. Downhole sorption cooling and heating in wireline logging and monitoring while drilling
US20070095096A1 (en) * 2001-01-08 2007-05-03 Baker Hughes Incorporated Downhole sorption cooling and heating in wireline logging and monitoring while drilling
WO2006065559A1 (en) * 2004-12-03 2006-06-22 Halliburton Energy Services, Inc. Heating and cooling electrical components in a downhole operation
US7440283B1 (en) * 2007-07-13 2008-10-21 Baker Hughes Incorporated Thermal isolation devices and methods for heat sensitive downhole components

Also Published As

Publication number Publication date
WO2013096550A1 (en) 2013-06-27
MX2014007773A (es) 2014-09-15
US20150000913A1 (en) 2015-01-01

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