EP2609683A4 - Module à hyperfréquences - Google Patents

Module à hyperfréquences

Info

Publication number: EP2609683A4
Authority: EP; European Patent Office
Prior art keywords: microwave module; microwave; module
Prior art date: 2011-05-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP11865615.6A

Other languages

German (de)

English (en)

Other versions

EP2609683A1 (fr

EP2609683B1 (fr

Inventor

Goran Wennberg

Peter Hammar

Bengt Madeberg

Leif Bergstedt

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Huawei Technologies Co Ltd

Original Assignee

Huawei Technologies Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2011-05-17

Filing date

2011-05-17

Publication date

2015-09-30

2011-05-17 Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd

2013-07-03 Publication of EP2609683A1 publication Critical patent/EP2609683A1/fr

2015-09-30 Publication of EP2609683A4 publication Critical patent/EP2609683A4/fr

2018-03-21 Application granted granted Critical

2018-03-21 Publication of EP2609683B1 publication Critical patent/EP2609683B1/fr

Status Active legal-status Critical Current

2031-05-17 Anticipated expiration legal-status Critical

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0056—Casings specially adapted for microwave applications

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Control Of Motors That Do Not Use Commutators (AREA)
Details Of Aerials (AREA)

EP11865615.6A 2011-05-17 2011-05-17 Module à hyperfréquences Active EP2609683B1 (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/CN2011/074171 WO2012155340A1 (fr)	2011-05-17	2011-05-17	Module à hyperfréquences

Publications (3)

Publication Number	Publication Date
EP2609683A1 EP2609683A1 (fr)	2013-07-03
EP2609683A4 true EP2609683A4 (fr)	2015-09-30
EP2609683B1 EP2609683B1 (fr)	2018-03-21

Family

ID=47176143

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP11865615.6A Active EP2609683B1 (fr)	2011-05-17	2011-05-17	Module à hyperfréquences

Country Status (4)

Country	Link
US (1)	US9301426B2 (fr)
EP (1)	EP2609683B1 (fr)
CN (1)	CN102859787B (fr)
WO (1)	WO2012155340A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN104646957B (zh) *	2014-12-26	2017-04-19	北京遥测技术研究所	基于激光气密焊接工艺的高频微波产品封装方法
US10091902B2 (en) *	2015-11-23	2018-10-02	Te Connectivity Corporation	Electrical module for battery distribution assembly
TWI614940B (zh) *	2016-05-10	2018-02-11	國防大學	多輸入多輸出天線系統
US10159157B2 (en) *	2016-08-08	2018-12-18	Continental Automotive Systems, Inc.	Compliant PCB-to-housing fastener

Citations (4)

* Cited by examiner, † Cited by third party
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CN1838476A (zh) *	2005-03-24	2006-09-27	华为技术有限公司	悬置微带线滤波器及双工器以及滤波器的设计及调试方法
US20070296518A1 (en) *	2006-06-27	2007-12-27	Andrew Corporation	Cross-Polar and Co-Polar Transceiver
EP2221910A1 (fr) *	2009-02-13	2010-08-25	Huawei Technologies Co., Ltd.	Duplexeur RF de station de base, module RF et champ de système RF
EP2390953A1 (fr) *	2010-05-25	2011-11-30	Kildal Antenn Consulting AB	Conditionnement de circuits actifs et passifs de micro-ondes utilisant un couvercle ou un lit de poteaux recourbés

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US4792939A (en) *	1986-01-24	1988-12-20	Hitachi Denshi Kabushiki Kaisha	Duplex radio communication transceiver
US5206796A (en) *	1991-03-11	1993-04-27	John Fluke Mfg. Co. Inc.	Electronic instrument with emi/esd shielding system
US5690614A (en) *	1995-09-06	1997-11-25	Microwave Medical Systems, Inc.	Microwave apparatus for warming low flow rate infusates
US5740013A (en) *	1996-07-03	1998-04-14	Hewlett-Packard Company	Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
JP3344388B2 (ja) *	1999-11-01	2002-11-11	日本電気株式会社	マイクロ波導波管装置
JP2002246813A (ja) *	2001-02-19	2002-08-30	Alps Electric Co Ltd	マイクロ波機器の導波管構造
JP2004253966A (ja) *	2003-02-19	2004-09-09	Yokowo Co Ltd	同軸導波管変換器およびその製法ならびに送受信機
KR100546832B1 (ko)	2003-08-21	2006-01-26	삼성전자주식회사	임베디드 ｐｃｂ 기판을 사용한 듀플렉서 및 그 제조 방법
GB0501170D0 (en) *	2005-01-20	2005-03-02	Antenova Ltd	A two-module integrated antenna and radio
CN100539298C (zh) *	2006-05-11	2009-09-09	严盛喜	微波介质模块
US8711040B2 (en) *	2007-06-04	2014-04-29	Daniele Barbieri	Wireless network device including a polarization and spatial diversity antenna system
CN201063632Y (zh) *	2007-06-18	2008-05-21	北京天瑞星际技术有限公司	13GHz SDH收发信机壳体
CN201146505Y (zh) *	2008-01-28	2008-11-05	北京天瑞星际技术有限公司	13GHz PDH微波收发信机及其室外单元
CN101355189A (zh) *	2008-07-24	2009-01-28	上海杰盛无线通讯设备有限公司	波导耦合微带/带状线滤波器
CN201345403Y (zh) *	2009-01-15	2009-11-11	庄昆杰	一体化结构的高选择性微波双向转发器

2011
- 2011-05-17 WO PCT/CN2011/074171 patent/WO2012155340A1/fr not_active Ceased
- 2011-05-17 CN CN201180003962.7A patent/CN102859787B/zh active Active
- 2011-05-17 EP EP11865615.6A patent/EP2609683B1/fr active Active
2013
- 2013-04-11 US US13/860,764 patent/US9301426B2/en active Active

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN1838476A (zh) *	2005-03-24	2006-09-27	华为技术有限公司	悬置微带线滤波器及双工器以及滤波器的设计及调试方法
US20070296518A1 (en) *	2006-06-27	2007-12-27	Andrew Corporation	Cross-Polar and Co-Polar Transceiver
EP2221910A1 (fr) *	2009-02-13	2010-08-25	Huawei Technologies Co., Ltd.	Duplexeur RF de station de base, module RF et champ de système RF
EP2390953A1 (fr) *	2010-05-25	2011-11-30	Kildal Antenn Consulting AB	Conditionnement de circuits actifs et passifs de micro-ondes utilisant un couvercle ou un lit de poteaux recourbés

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2012155340A1 *

Also Published As

Publication number	Publication date
CN102859787A (zh)	2013-01-02
CN102859787B (zh)	2015-03-11
EP2609683A1 (fr)	2013-07-03
EP2609683B1 (fr)	2018-03-21
WO2012155340A1 (fr)	2012-11-22
US20130215576A1 (en)	2013-08-22
US9301426B2 (en)	2016-03-29

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2015-09-23	RIC1	Information provided on ipc code assigned before grant	Ipc: H01P 1/205 20060101ALI20150814BHEP Ipc: H01P 1/213 20060101ALI20150814BHEP Ipc: H05K 9/00 20060101ALI20150814BHEP Ipc: H04B 1/03 20060101AFI20150814BHEP
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