EP2637868A4 - Systems and methods for thermal management of electronic components - Google Patents

Systems and methods for thermal management of electronic components

Info

Publication number
EP2637868A4
EP2637868A4 EP11839038.4A EP11839038A EP2637868A4 EP 2637868 A4 EP2637868 A4 EP 2637868A4 EP 11839038 A EP11839038 A EP 11839038A EP 2637868 A4 EP2637868 A4 EP 2637868A4
Authority
EP
European Patent Office
Prior art keywords
systems
methods
electronic components
thermal management
management
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11839038.4A
Other languages
German (de)
French (fr)
Other versions
EP2637868A1 (en
Inventor
Brian White
Craig Lombard
David S Lashmore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanocomp Technologies Inc
Original Assignee
Nanocomp Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanocomp Technologies Inc filed Critical Nanocomp Technologies Inc
Publication of EP2637868A1 publication Critical patent/EP2637868A1/en
Publication of EP2637868A4 publication Critical patent/EP2637868A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/42—Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction
EP11839038.4A 2010-11-12 2011-11-11 Systems and methods for thermal management of electronic components Withdrawn EP2637868A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41308710P 2010-11-12 2010-11-12
PCT/US2011/060440 WO2012065107A1 (en) 2010-11-12 2011-11-11 Systems and methods for thermal management of electronic components

Publications (2)

Publication Number Publication Date
EP2637868A1 EP2637868A1 (en) 2013-09-18
EP2637868A4 true EP2637868A4 (en) 2015-04-22

Family

ID=46046750

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11839038.4A Withdrawn EP2637868A4 (en) 2010-11-12 2011-11-11 Systems and methods for thermal management of electronic components

Country Status (4)

Country Link
US (1) US20120118552A1 (en)
EP (1) EP2637868A4 (en)
JP (1) JP2014505319A (en)
WO (1) WO2012065107A1 (en)

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EP2570385A3 (en) * 2005-05-03 2013-10-16 Nanocomp Technologies, Inc. Carbon composite materials and methods of manufacturing same
CA2850951A1 (en) 2005-07-28 2007-01-28 Nanocomp Technologies, Inc. Systems and methods for formation and harvesting of nanofibrous materials
US9061913B2 (en) * 2007-06-15 2015-06-23 Nanocomp Technologies, Inc. Injector apparatus and methods for production of nanostructures
WO2009021069A1 (en) * 2007-08-07 2009-02-12 Nanocomp Technologies, Inc. Electrically and thermally non-metallic conductive nanostructure-based adapters
JP2010537410A (en) * 2007-08-14 2010-12-02 ナノコンプ テクノロジーズ インコーポレイテッド Nanostructured material-based thermoelectric generator
JP5864253B2 (en) * 2008-05-07 2016-02-17 ナノコンプ テクノロジーズ インコーポレイテッド Method for forming nanostructured composite sheet
AU2009244152A1 (en) * 2008-05-07 2009-11-12 Nanocomp Technologies, Inc. Nanostructure-based heating devices and method of use
US8354593B2 (en) * 2009-07-10 2013-01-15 Nanocomp Technologies, Inc. Hybrid conductors and method of making same
US8722171B2 (en) 2011-01-04 2014-05-13 Nanocomp Technologies, Inc. Nanotube-based insulators
WO2014204561A1 (en) 2013-06-17 2014-12-24 Nanocomp Technologies, Inc. Exfoliating-dispersing agents for nanotubes, bundles and fibers
EP3253709A4 (en) 2015-02-03 2018-10-31 Nanocomp Technologies, Inc. Carbon nanotube structures and methods for production thereof
JP6455336B2 (en) * 2015-06-23 2019-01-23 日本ゼオン株式会社 Thermal conductive sheet and manufacturing method thereof
US10581082B2 (en) 2016-11-15 2020-03-03 Nanocomp Technologies, Inc. Systems and methods for making structures defined by CNT pulp networks
US11279836B2 (en) 2017-01-09 2022-03-22 Nanocomp Technologies, Inc. Intumescent nanostructured materials and methods of manufacturing same
US10128022B1 (en) * 2017-10-24 2018-11-13 Northrop Grumman Systems Corporation Lightweight carbon nanotube cable comprising a pair of plated twisted wires
KR102260128B1 (en) * 2019-05-29 2021-06-02 숭실대학교산학협력단 Magnetic device using carbon nanotube wire without insulating sheaths
JP2020196145A (en) * 2019-05-31 2020-12-10 日立造船株式会社 Laminated body and manufacturing method of laminated body
CN112086235B (en) * 2020-08-28 2025-03-18 广东澳通特种电缆有限公司 A fireproof and waterproof cable assembly
US12230419B1 (en) 2021-07-09 2025-02-18 Hrl Laboratories, Llc Carbon nanotube ultraconductor
JP2023030574A (en) * 2021-08-23 2023-03-08 ローム株式会社 Semiconductor device and method of manufacturing the same
JP7766426B2 (en) * 2021-08-23 2025-11-10 ローム株式会社 Semiconductor Devices

Citations (2)

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Publication number Priority date Publication date Assignee Title
US20080001284A1 (en) * 2006-05-26 2008-01-03 The Hong Kong University Of Science And Technolgoy Heat Dissipation Structure With Aligned Carbon Nanotube Arrays and Methods for Manufacturing And Use
US20090266477A1 (en) * 2008-04-25 2009-10-29 Weisenberger Matthew C Lightweight thermal management material for enhancement of through-thickness thermal conductivity

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JP2005116839A (en) * 2003-10-08 2005-04-28 Sony Corp HEAT CONDUCTOR, COOLING DEVICE, ELECTRONIC DEVICE, AND METHOD FOR PRODUCING HEAT CONDUCTOR
TWI463615B (en) * 2004-11-04 2014-12-01 台灣積體電路製造股份有限公司 Directional conductive adhesion based on nanotubes
US7651963B2 (en) * 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
KR100674404B1 (en) * 2005-07-05 2007-01-29 재단법인서울대학교산학협력재단 Carbon nanotube coated heat sink and its manufacturing method
US20080166563A1 (en) * 2007-01-04 2008-07-10 Goodrich Corporation Electrothermal heater made from thermally conducting electrically insulating polymer material
CN101286383B (en) * 2007-04-11 2010-05-26 清华大学 Electromagnetic shielding cable
JP2009057249A (en) * 2007-08-31 2009-03-19 Sumitomo Electric Ind Ltd Carbon structure, composite member and manufacturing method thereof
CN101556839B (en) * 2008-04-09 2011-08-24 清华大学 cable
JP5864253B2 (en) * 2008-05-07 2016-02-17 ナノコンプ テクノロジーズ インコーポレイテッド Method for forming nanostructured composite sheet
US20100021682A1 (en) * 2008-07-25 2010-01-28 Florida State University Research Foundation Composite material and method for increasing z-axis thermal conductivity of composite sheet material
US8445788B1 (en) * 2009-01-05 2013-05-21 The Boeing Company Carbon nanotube-enhanced, metallic wire
CN101931841A (en) * 2009-06-26 2010-12-29 清华大学 Voice coil framework and loudspeaker
CN102918754B (en) * 2010-05-27 2015-03-11 矢崎总业株式会社 Rotor of induction motor, and induction motor using same
CN102372253B (en) * 2010-08-23 2014-01-15 清华大学 Carbon nano tube compound linear structure and preparation method thereof
CN102372252B (en) * 2010-08-23 2016-06-15 清华大学 Carbon nano tube compound line and preparation method thereof
US8853540B2 (en) * 2011-04-19 2014-10-07 Commscope, Inc. Of North Carolina Carbon nanotube enhanced conductors for communications cables and related communications cables and methods

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080001284A1 (en) * 2006-05-26 2008-01-03 The Hong Kong University Of Science And Technolgoy Heat Dissipation Structure With Aligned Carbon Nanotube Arrays and Methods for Manufacturing And Use
US20090266477A1 (en) * 2008-04-25 2009-10-29 Weisenberger Matthew C Lightweight thermal management material for enhancement of through-thickness thermal conductivity

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2012065107A1 *

Also Published As

Publication number Publication date
EP2637868A1 (en) 2013-09-18
JP2014505319A (en) 2014-02-27
US20120118552A1 (en) 2012-05-17
WO2012065107A1 (en) 2012-05-18

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Legal Events

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DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20150325

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Effective date: 20151024