EP2637868A4 - Systèmes et procédés pour la gestion thermique de composants électroniques - Google Patents

Systèmes et procédés pour la gestion thermique de composants électroniques

Info

Publication number
EP2637868A4
EP2637868A4 EP11839038.4A EP11839038A EP2637868A4 EP 2637868 A4 EP2637868 A4 EP 2637868A4 EP 11839038 A EP11839038 A EP 11839038A EP 2637868 A4 EP2637868 A4 EP 2637868A4
Authority
EP
European Patent Office
Prior art keywords
systems
methods
electronic components
thermal management
management
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11839038.4A
Other languages
German (de)
English (en)
Other versions
EP2637868A1 (fr
Inventor
Brian White
Craig Lombard
David S Lashmore
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanocomp Technologies Inc
Original Assignee
Nanocomp Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanocomp Technologies Inc filed Critical Nanocomp Technologies Inc
Publication of EP2637868A1 publication Critical patent/EP2637868A1/fr
Publication of EP2637868A4 publication Critical patent/EP2637868A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/42—Insulated conductors or cables characterised by their form with arrangements for heat dissipation or conduction
EP11839038.4A 2010-11-12 2011-11-11 Systèmes et procédés pour la gestion thermique de composants électroniques Withdrawn EP2637868A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US41308710P 2010-11-12 2010-11-12
PCT/US2011/060440 WO2012065107A1 (fr) 2010-11-12 2011-11-11 Systèmes et procédés pour la gestion thermique de composants électroniques

Publications (2)

Publication Number Publication Date
EP2637868A1 EP2637868A1 (fr) 2013-09-18
EP2637868A4 true EP2637868A4 (fr) 2015-04-22

Family

ID=46046750

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11839038.4A Withdrawn EP2637868A4 (fr) 2010-11-12 2011-11-11 Systèmes et procédés pour la gestion thermique de composants électroniques

Country Status (4)

Country Link
US (1) US20120118552A1 (fr)
EP (1) EP2637868A4 (fr)
JP (1) JP2014505319A (fr)
WO (1) WO2012065107A1 (fr)

Families Citing this family (21)

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EP2570385A3 (fr) * 2005-05-03 2013-10-16 Nanocomp Technologies, Inc. Matériaux en composites de carbone et leurs procédés de fabrication
CA2850951A1 (fr) 2005-07-28 2007-01-28 Nanocomp Technologies, Inc. Systemes et methodes pour la formation et la collecte de materiaux nanofibreux
US9061913B2 (en) * 2007-06-15 2015-06-23 Nanocomp Technologies, Inc. Injector apparatus and methods for production of nanostructures
WO2009021069A1 (fr) * 2007-08-07 2009-02-12 Nanocomp Technologies, Inc. Adaptateurs à base de nanostructures électriquement et thermiquement conductrices non métalliques
JP2010537410A (ja) * 2007-08-14 2010-12-02 ナノコンプ テクノロジーズ インコーポレイテッド ナノ構造材料ベースの熱電発電装置
JP5864253B2 (ja) * 2008-05-07 2016-02-17 ナノコンプ テクノロジーズ インコーポレイテッド ナノ構造複合材シートの形成方法
AU2009244152A1 (en) * 2008-05-07 2009-11-12 Nanocomp Technologies, Inc. Nanostructure-based heating devices and method of use
US8354593B2 (en) * 2009-07-10 2013-01-15 Nanocomp Technologies, Inc. Hybrid conductors and method of making same
US8722171B2 (en) 2011-01-04 2014-05-13 Nanocomp Technologies, Inc. Nanotube-based insulators
WO2014204561A1 (fr) 2013-06-17 2014-12-24 Nanocomp Technologies, Inc. Agents exfoliants-dispersants pour nanotubes, faisceaux et fibres
EP3253709A4 (fr) 2015-02-03 2018-10-31 Nanocomp Technologies, Inc. Structures à nanotubes de carbone et procédés de production de ceux-ci
JP6455336B2 (ja) * 2015-06-23 2019-01-23 日本ゼオン株式会社 熱伝導シートおよびその製造方法
US10581082B2 (en) 2016-11-15 2020-03-03 Nanocomp Technologies, Inc. Systems and methods for making structures defined by CNT pulp networks
US11279836B2 (en) 2017-01-09 2022-03-22 Nanocomp Technologies, Inc. Intumescent nanostructured materials and methods of manufacturing same
US10128022B1 (en) * 2017-10-24 2018-11-13 Northrop Grumman Systems Corporation Lightweight carbon nanotube cable comprising a pair of plated twisted wires
KR102260128B1 (ko) * 2019-05-29 2021-06-02 숭실대학교산학협력단 절연외피가 없는 탄소나노튜브 전선을 권선한 자화소자
JP2020196145A (ja) * 2019-05-31 2020-12-10 日立造船株式会社 積層体および積層体の製造方法
CN112086235B (zh) * 2020-08-28 2025-03-18 广东澳通特种电缆有限公司 一种防火防水电缆组件
US12230419B1 (en) 2021-07-09 2025-02-18 Hrl Laboratories, Llc Carbon nanotube ultraconductor
JP2023030574A (ja) * 2021-08-23 2023-03-08 ローム株式会社 半導体装置および半導体装置の製造方法
JP7766426B2 (ja) * 2021-08-23 2025-11-10 ローム株式会社 半導体装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080001284A1 (en) * 2006-05-26 2008-01-03 The Hong Kong University Of Science And Technolgoy Heat Dissipation Structure With Aligned Carbon Nanotube Arrays and Methods for Manufacturing And Use
US20090266477A1 (en) * 2008-04-25 2009-10-29 Weisenberger Matthew C Lightweight thermal management material for enhancement of through-thickness thermal conductivity

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JP2005116839A (ja) * 2003-10-08 2005-04-28 Sony Corp 熱伝導体、冷却装置、電子機器及び熱伝導体の製造方法
TWI463615B (zh) * 2004-11-04 2014-12-01 台灣積體電路製造股份有限公司 以奈米管為基礎之具方向性導電黏著
US7651963B2 (en) * 2005-04-15 2010-01-26 Siemens Energy, Inc. Patterning on surface with high thermal conductivity materials
KR100674404B1 (ko) * 2005-07-05 2007-01-29 재단법인서울대학교산학협력재단 탄소나노튜브가 코팅된 방열판 및 그 제조방법
US20080166563A1 (en) * 2007-01-04 2008-07-10 Goodrich Corporation Electrothermal heater made from thermally conducting electrically insulating polymer material
CN101286383B (zh) * 2007-04-11 2010-05-26 清华大学 电磁屏蔽线缆
JP2009057249A (ja) * 2007-08-31 2009-03-19 Sumitomo Electric Ind Ltd 炭素構造体、複合部材およびその製造方法
CN101556839B (zh) * 2008-04-09 2011-08-24 清华大学 线缆
JP5864253B2 (ja) * 2008-05-07 2016-02-17 ナノコンプ テクノロジーズ インコーポレイテッド ナノ構造複合材シートの形成方法
US20100021682A1 (en) * 2008-07-25 2010-01-28 Florida State University Research Foundation Composite material and method for increasing z-axis thermal conductivity of composite sheet material
US8445788B1 (en) * 2009-01-05 2013-05-21 The Boeing Company Carbon nanotube-enhanced, metallic wire
CN101931841A (zh) * 2009-06-26 2010-12-29 清华大学 音圈骨架及扬声器
CN102918754B (zh) * 2010-05-27 2015-03-11 矢崎总业株式会社 感应电动机的转子、以及使用该转子的感应电动机
CN102372253B (zh) * 2010-08-23 2014-01-15 清华大学 碳纳米管复合线状结构及其制备方法
CN102372252B (zh) * 2010-08-23 2016-06-15 清华大学 碳纳米管复合线及其制备方法
US8853540B2 (en) * 2011-04-19 2014-10-07 Commscope, Inc. Of North Carolina Carbon nanotube enhanced conductors for communications cables and related communications cables and methods

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080001284A1 (en) * 2006-05-26 2008-01-03 The Hong Kong University Of Science And Technolgoy Heat Dissipation Structure With Aligned Carbon Nanotube Arrays and Methods for Manufacturing And Use
US20090266477A1 (en) * 2008-04-25 2009-10-29 Weisenberger Matthew C Lightweight thermal management material for enhancement of through-thickness thermal conductivity

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2012065107A1 *

Also Published As

Publication number Publication date
EP2637868A1 (fr) 2013-09-18
JP2014505319A (ja) 2014-02-27
US20120118552A1 (en) 2012-05-17
WO2012065107A1 (fr) 2012-05-18

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