EP2638567A2 - Procédé de chargement et de déchargement d'une cassette de processus - Google Patents

Procédé de chargement et de déchargement d'une cassette de processus

Info

Publication number
EP2638567A2
EP2638567A2 EP11833588.4A EP11833588A EP2638567A2 EP 2638567 A2 EP2638567 A2 EP 2638567A2 EP 11833588 A EP11833588 A EP 11833588A EP 2638567 A2 EP2638567 A2 EP 2638567A2
Authority
EP
European Patent Office
Prior art keywords
process cartridge
cassette
workpieces
loading
trays
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11833588.4A
Other languages
German (de)
English (en)
Inventor
Michael Schilp
Adolf Zitzmann
Josef Zimmermann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZS-HANDLING GMBH
Original Assignee
Zimmermann and Schilp Handhabungstechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zimmermann and Schilp Handhabungstechnik GmbH filed Critical Zimmermann and Schilp Handhabungstechnik GmbH
Publication of EP2638567A2 publication Critical patent/EP2638567A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B5/00—Electrostatic spraying apparatus; Spraying apparatus with means for charging the spray electrically; Apparatus for spraying liquids or other fluent materials by other electric means
    • B05B5/08—Plant for applying liquids or other fluent materials to objects
    • B05B5/082—Plant for applying liquids or other fluent materials to objects characterised by means for supporting, holding or conveying the objects
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0476—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49815—Disassembling

Definitions

  • the present invention relates to a loading and unloading process for a process cartridge, the z. B. is used in plasma coating processes.
  • Such a process cartridge has a multiplicity of spaced carrier plates. In the spaces between these carrier plates to be processed flat workpieces such.
  • B. from semiconductor technology multiple grippers known that spaced a stack of these workpieces and at the same time bring in the process cartridge and can remove again. However, these multiple grippers are mainly suitable to store or resume the workpieces in the narrow compartments of the process cartridge.
  • the disadvantage of this technology is that the gripper systems required for this purpose are relatively complicated and thus expensive, or that erroneous loading frequently occurs when using grippers with lower precision and reliability, resulting in a relatively high fraction of wafer fracture.
  • Another disadvantage of the gripper systems is that they are not available for different sizes of process cartridges and therefore must be manufactured as custom-made. This increases the overall costs of such a process.
  • the object of the invention to provide a loading and unloading method for a process cartridge in which the workpieces can be supplied with high reliability quickly and safely and also removed again. Furthermore, the method should require a cost-effective device technology.
  • a loading and unloading process for a process cartridge which comprises the following process steps: a. Provision of a removable and mountable by means of a disassembly and assembly robot process cartridge, a disassembly and assembly robot any kind of fully automatic automatically operating device is to be understood.
  • the process cartridge is provided for a plasma coating process. It should be noted that due to the complicated handling of the very thin workpieces the process is particularly suitable for a plasma coating process.
  • the process cartridge is provided for an electrostatic Belackungs- process.
  • Fig. 1 shows a portion of a process cartridge 1 having a plurality of trays 2. It can be seen that the loading and unloading of workpieces with the conventional technology is difficult.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Automatic Assembly (AREA)
  • Chemical Vapour Deposition (AREA)
  • Manipulator (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)

Abstract

La présente invention concerne un procédé de chargement et de déchargement d'une cassette de processus qui est utilisée par exemple dans les processus de revêtement au plasma, les étapes de procédé étant les suivantes : a. fournir une cassette de processus (1) qui peut être démontée et remontée par un robot de démontage et de remontage ; b. démonter automatiquement la cassette de processus, de manière que les fonds (2) de la cassette de processus soient séparés ; c. amener et placer les fonds (2) vers au moins un appareil automatique de chargement qui charge les fonds (2) par les pièces à traiter ; d. monter les fonds (2) chargés pour former la cassette de processus (1) ; e. amener la cassette de processus (1) sur le lieu de traitement où doit avoir lieu le traitement ; f. exécuter le processus de traitement ; g. amener la cassette de processus (1) au robot de démontage et de remontage ou à un autre robot de démontage et de remontage ; h. démonter la cassette de processus de manière que les fonds (2) de la cassette de processus soient séparés ; et i. retirer automatiquement les pièces traitées.
EP11833588.4A 2010-11-11 2011-11-11 Procédé de chargement et de déchargement d'une cassette de processus Withdrawn EP2638567A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010050918 2010-11-11
PCT/DE2011/001977 WO2012062288A2 (fr) 2010-11-11 2011-11-11 Procédé de chargement et de déchargement d'une cassette de processus

Publications (1)

Publication Number Publication Date
EP2638567A2 true EP2638567A2 (fr) 2013-09-18

Family

ID=45974179

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11833588.4A Withdrawn EP2638567A2 (fr) 2010-11-11 2011-11-11 Procédé de chargement et de déchargement d'une cassette de processus

Country Status (7)

Country Link
US (1) US20140041186A1 (fr)
EP (1) EP2638567A2 (fr)
JP (1) JP2014503989A (fr)
KR (1) KR20130117809A (fr)
CN (1) CN103283012A (fr)
DE (1) DE102011118276A1 (fr)
WO (1) WO2012062288A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2638567A2 (fr) * 2010-11-11 2013-09-18 Zimmermann & Schilp Handhabungstechnik GmbH Procédé de chargement et de déchargement d'une cassette de processus
EP3025145B1 (fr) 2013-07-22 2017-06-28 ZS-Handling GmbH Dispositif servant à inspecter des surfaces de pièces à usiner et des matériaux en bande
KR101888280B1 (ko) 2013-07-22 2018-08-13 제트에스-핸들링 게엠베하 표면 처리 또는 표면 가공 장치
US10861692B2 (en) * 2017-10-26 2020-12-08 Taiwan Semiconductor Manufacturing Co., Ltd. Substrate carrier deterioration detection and repair

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020014390A1 (en) * 2000-07-28 2002-02-07 Sumitomo Eaton Nova Corporation Wafer carrying system and carrying method thereof
US20060245871A1 (en) * 2005-03-10 2006-11-02 Wen-Ming Lo Wafer transfer system, wafer transfer method, cassette exchange system and cassette exchange method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6127878U (ja) * 1984-07-23 1986-02-19 ロ−ム株式会社 ウエハ−の収納キヤリア
JPS624132U (fr) * 1985-06-24 1987-01-12
JP2564303B2 (ja) * 1987-05-08 1996-12-18 株式会社日立製作所 ウエハキャリア治具
US5469963A (en) * 1992-04-08 1995-11-28 Asyst Technologies, Inc. Sealable transportable container having improved liner
US5884392A (en) * 1994-12-23 1999-03-23 International Business Machines Corporation Automatic assembler/disassembler apparatus adapted to pressurized sealable transportable containers
JP3796782B2 (ja) * 1995-11-13 2006-07-12 アシスト シンコー株式会社 機械的インターフェイス装置
US5674039A (en) * 1996-07-12 1997-10-07 Fusion Systems Corporation System for transferring articles between controlled environments
US6427096B1 (en) * 1999-02-12 2002-07-30 Honeywell International Inc. Processing tool interface apparatus for use in manufacturing environment
US7000418B2 (en) * 2004-05-14 2006-02-21 Intevac, Inc. Capacitance sensing for substrate cooling
JP4726623B2 (ja) * 2005-12-27 2011-07-20 ミライアル株式会社 板材保持容器からの板材出し入れ方法
JP5025962B2 (ja) * 2006-02-15 2012-09-12 ミライアル株式会社 薄板収納容器
JP4168452B2 (ja) * 2006-03-07 2008-10-22 株式会社Ｉｈｉ 水蒸気アニール用治具、水蒸気アニール方法及び基板移載装置
JP4367440B2 (ja) * 2006-06-14 2009-11-18 村田機械株式会社 搬送システム
GB0804499D0 (en) * 2008-03-11 2008-04-16 Metryx Ltd Measurement apparatus and method
KR101416852B1 (ko) * 2008-12-29 2014-07-09 삼성테크윈 주식회사 웨이퍼 자동 공급장치
EP2638567A2 (fr) * 2010-11-11 2013-09-18 Zimmermann & Schilp Handhabungstechnik GmbH Procédé de chargement et de déchargement d'une cassette de processus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020014390A1 (en) * 2000-07-28 2002-02-07 Sumitomo Eaton Nova Corporation Wafer carrying system and carrying method thereof
US20060245871A1 (en) * 2005-03-10 2006-11-02 Wen-Ming Lo Wafer transfer system, wafer transfer method, cassette exchange system and cassette exchange method

Also Published As

Publication number Publication date
KR20130117809A (ko) 2013-10-28
WO2012062288A2 (fr) 2012-05-18
CN103283012A (zh) 2013-09-04
DE102011118276A1 (de) 2012-08-23
WO2012062288A3 (fr) 2012-08-23
JP2014503989A (ja) 2014-02-13
US20140041186A1 (en) 2014-02-13

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Owner name: ZS-HANDLING GMBH