EP2698449B1 - Composition de bain de placage pour dépôt par immersion de l'or - Google Patents

Composition de bain de placage pour dépôt par immersion de l'or Download PDF

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Publication number
EP2698449B1
EP2698449B1 EP12180227.6A EP12180227A EP2698449B1 EP 2698449 B1 EP2698449 B1 EP 2698449B1 EP 12180227 A EP12180227 A EP 12180227A EP 2698449 B1 EP2698449 B1 EP 2698449B1
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Prior art keywords
gold
plating bath
cyanide
group
ions
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German (de)
English (en)
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EP2698449A1 (fr
Inventor
Sandra Niemann
Britta Dr. Schafsteller
Jenny Schulz
Ellen Habig
Dr. Heiko Brunner
Lars Kohlmann
Sven Rückbrod
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Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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Priority to EP12180227.6A priority Critical patent/EP2698449B1/fr
Priority to CN201380042872.8A priority patent/CN104520471B/zh
Priority to PCT/EP2013/064725 priority patent/WO2014026806A2/fr
Priority to TW102127505A priority patent/TWI551723B/zh
Publication of EP2698449A1 publication Critical patent/EP2698449A1/fr
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Definitions

  • the present invention relates to aqueous plating bath compositions for immersion plating of gold layers onto a substrate.
  • the plating bath is particularly suitable in the manufacture of printed circuit boards, IC substrates, semiconducting devices, interposers made of glass and the like.
  • Immersion-type plating is an established method to deposit a layer of gold onto a metal substrate.
  • Gold ions present in such plating bath compositions are reduced to metallic gold when in contact with a metal present on the substrate surface which is less noble than gold. Thereby, the metal from the substrate surface is oxidised and transferred to the gold plating bath.
  • Such plating bath compositions do not contain a strong reducing agent such as hypophosphite ions or formaldehyde which is common in plating baths for electroless deposition of e.g., nickel alloys and copper.
  • Immersion plated gold layers are frequently used as solderable and/or wire bondable surfaces in the manufacture of printed circuit boards, IC substrates, semiconducting devices and the like.
  • Gold layers are usually deposited by immersion-type plating onto a barrier layer such as a nickel phosphorous alloy or onto an intermediate layer such as a palladium or palladium alloy layer.
  • An important property of the deposited gold layer is a sufficient wettability of a molten solder material which is usually a tin based alloy on the surface of the gold or gold alloy layer. Furthermore, the gold layer should be applicable for wire bonding with e.g. aluminium, copper and gold wires.
  • Another desired property of the gold layer is the optical appearance: a discoloration of the gold layer is not acceptable.
  • a cyanide-free immersion type plating bath comprising a source for gold ions, a sulfite salt, complexing agents, a heavy metal ion stabiliser (antimony or bismuth) and a quaternary ammonium salt type polymer is disclosed in JP 2004-250765 A .
  • EP 1 201 789 A2 discloses an aqueous plating bath for electrodeposition of tin-zinc alloys comprising at least one bath-soluble stannous salt, at least one bath soluble zinc salt, and a quaternary ammonium polymer selected from a ureylene quaternary ammonium polymer, an iminoureylene quaternary ammonium polymer or a thioureylene quaternary ammonium polymer.
  • the plating baths also may contain one or more of the following additives: hydroxy polycarboxylic acids or salts thereof such as citric acid; ammonium salts; conducting salts; aromatic carbonyl-containing compounds; polymers of aliphatic amines such as a poly(alkyleneimine); and hydroxyalkyl substituted diamines as metal complexing agents.
  • hydroxy polycarboxylic acids or salts thereof such as citric acid
  • ammonium salts such as citric acid
  • conducting salts aromatic carbonyl-containing compounds
  • polymers of aliphatic amines such as a poly(alkyleneimine)
  • hydroxyalkyl substituted diamines as metal complexing agents.
  • JP 2000 192248 A discloses a plating bath containing a soluble gold salt, a complexing agent consisting of sulfite and thiosulfite, a concealing complexing agent consisting of oxycarboxylic acid, such as tartaric acid, an amine compound, such as aminoacetic acid or ethylene diamine and an ammonium compound., a pH control agent, an amphoteric surfactant or a mixture composed of the amphoteric surfactant and a nonionic surfactant.
  • the plating bath is characterized in that the sulfite and the thiosulfite are combined as the complexing agent, that the concealing complexing agent is used and that the kind of the surfactant is limited to the mixture of the amphoteric or amphoteric and nonionic system.
  • the stabilization of the gold ions in the plating bath and the suppression of the plating spreading at the time of gold plating may be simultaneously achieved by the synergistic effect based on the constitution.
  • a cyanide-free immersion type plating bath comprising gold ions, a pyrosulfurous acid compound, a thiosulfuric acid compound, a sulfurous acid compound and an aminocarboxylic acid is disclosed in US 2006/0269761 A1 .
  • an aqueous immersion type plating bath composition which is free of cyanide ions, the plating bath composition comprising
  • Gold layers having a sufficient wettability to tin based solder materials and the desired lemon-yellow colour are obtained by the aqueous immersion-type plating bath composition according to the present invention. Furthermore, in case the gold layer is deposited onto a nickel or nickel alloy layer, a reduced corrosive attack of the underlying nickel or nickel alloy layer is observed when plating a gold layer from the aqueous plating bath according to the present invention.
  • the aqueous immersion-type plating bath according to the present invention comprises gold ions in either Au + , Au 3+ or both oxidation states.
  • the source of gold ions is a water soluble salt such as trisodium gold disulfite, tripotassium gold disulfite and triammonium gold disulfite, gold thiosulfate, gold thiocyanide, gold sulfate, gold chloride, and gold bromide.
  • the source of gold ions is added to the aqueous plating bath in the form of a gold sulfite solution.
  • the concentration of gold ions in the aqueous plating bath preferably ranges from 0.1 to 10 g/l, more preferably from 0.3 to 6 g/l.
  • the at least one complexing agent present in the aqueous plating bath is selected from the group comprising carboxylic acids, hydroxycarboxylic acids, aminocarboxylic acids or a salt of the aforementioned and serves as a complexing agent for gold ions as well as for metal ions dissolved from the substrate during plating, e.g., nickel ions.
  • a preferred carboxylic acid is for example oxalic acid or a salt thereof.
  • Preferred hydroxycarboxylic acids are for example tartaric acid, citric acid, lactic acid, malic acid, gluconic acid and salts of the aforementioned.
  • Preferred aminocarboxylic acids are for example glycine, cysteine, methionine and salts of the aforementioned. In all cases also the sodium, potassium and ammonium salts of said compounds are also suitable.
  • the concentration of the at least one complexing agent preferably ranges from 0.1 to 25 g/l, more preferably from 0.5 to 10 g/l.
  • the aqueous plating bath comprises two different complexing agents and/or salts thereof, such as a hydroxycarboxylic acid or salt thereof and an aminocarboxylic acid or salt thereof.
  • the aqueous plating bath comprises three different complexing agents such as two different hydroxycarboxylic acids or salts thereof and one aminocarboxylic acid or salt thereof.
  • the aqueous plating bath according to the present invention further comprises sulfite ions which also serve as a complexing agent for gold ions.
  • Sulfite ions are added to the aqueous plating bath in form of a water soluble sulfite salt such as sodium sulfite, potassium sulfite and ammonium sulfite or together with gold ions as trisodium gold sulfite, tripotassium gold sulfite and ammonium gold sulfite.
  • concentration of sulfite ions in the aqueous plating bath preferably ranges from 0.05 to 20 g/l, more preferably from 0.1 to 10 g/l.
  • the aqueous plating bath according to the present invention further comprises thiosulfate ions which also serve as a complexing agent for gold ions.
  • Suitable sources for thiosulfate ions are water soluble salts of thiosulfate such as sodium thiosulfate, potassium thiosulfate and ammonium thiosulfate.
  • the concentration of thiosulfate ions in the plating bath preferably ranges from 0.1 to 20 g/l, more preferably from 0.5 to 10 g/l.
  • the aqueous plating bath according to the present invention further comprises at least one ureylene polymer additive which enhances the wettability of the tin based solder materials on the gold layer.
  • monomer A is selected from compounds according to formula (III).
  • concentration of the at least one ureylene polymer additive according to formulae (I) and (II) in the aqueous plating bath preferably ranges from 0.005 to 10 g/l, more preferably from 0.01 to 5 g/l.
  • polymer has to be understood in a broad sense in connection with the present invention. It comprises any compound which has been formed by reaction of at least two monomer molecules A and one divalent residue L.
  • polymer does comprise, in particular, compounds which are typically designated as oligomers.
  • polymer is, in connection with the present invention also applied to compounds, which are formed by a poly "condensation" reaction.
  • the ureylene polymer additive according to formulae (I) and (II) are obtained by reacting one or more diamino compounds of formulae (III) to (V) with one or more compounds of the following formula (VI) P-L-Q (VI) wherein L has the same meaning as in formulae (I) and (II) and wherein P and Q may each be the same or different and represent halogens such as Cl, Br and I or pseudohalogens such as mesylate, triflate, nonaflate, methanesulfonate, or tosylate.
  • the compounds of the formula (VI) are organic di(pseudo)halogen compounds.
  • the molar ratio (n A n B ) of the total amount of substance used of the compound(s) of formulae (III) to (V) (n A ) to the total amount of substance of the compound(s) of formula (VI) (n B ) is 1 : 1.
  • the molar ratio (n A : n B ) of the total amount of substance used of the compound(s) of formulae (III) to (V) (n A ) to the total amount of substance of the compound(s) of formula (VI) (n B ) is preferably at least 1.1 : 1, more preferably at least 1.3 : 1, and most preferably at least 1.5 : 1.
  • the di(pseudo)halogen compound of the formula (VI) is used in a substoichiometric amount with respect to component(s) of the formulae (III) to (V).
  • the chain of the ureylene polymer additive according to formula (II) has units A having amino groups at both ends. These terminal amino groups are at first tertiary (as in the compounds of formulae (III) to (V)), but may be quaternized. In acidic solution, the amino groups exist in completely or partially protonated form.
  • terminal tertiary amino groups may be quaternized in accordance with the desired properties by using an organic monohalide, such as benzyl chloride, allyl chloride, alkyl chloride, such as 1-chloro-hexane or their corresponding bromides, or by using an appropriate mineral acid, such as hydrochloric acid, hydrobromic acid, hydroiodic acid or sulfuric acid.
  • organic monohalide such as benzyl chloride, allyl chloride, alkyl chloride, such as 1-chloro-hexane or their corresponding bromides
  • mineral acid such as hydrochloric acid, hydrobromic acid, hydroiodic acid or sulfuric acid.
  • the ureylene polymer additives according to formulae (I) and (II) preferably have a weight average molecular mass M W of 1000 to 25000 Da, more preferably of 2000 to 20000 Da.
  • reaction of diamino compounds of the formulae (III) to (V) with the compounds of the formula (VI) may preferably be carried out in aqueous or aqueous-alcoholic solutions or solvent-free substances at temperatures of preferably 20 to 100°C.
  • the ureylene polymer additives according to formula (II) do not contain any organically bound (pseudo-)halogen, such as a covalent C-Cl moiety.
  • halide ions serving as the counter ions of the positively charged ureylene polymer additives according to formulae (I) and (II) are replaced after preparation of the polymer by anions such as hydroxide, sulfate, hydrogensulfate, carbonate, hydrogencarbonate, alkylsulfonate such as methane sulfonate, alkarylsulfonate, arylsulfonate, alkyl-carboxylate, alkarylcarboxylate, arylcarboxylate, phosphate, hydrogenphosphate, dihydrogenphosphate, and phosphonate.
  • the halide ions can be for example replaced by ion exchange over a suitable ion exchange resin.
  • the most suitable ion exchange resins are basic ion exchange resins such as Amberlyst® A21.
  • Halide ions can then be replaced by adding an inorganic acid and/or an organic acid containing the desired anions to the ion exchange resin.
  • the aqueous plating bath according to the present invention may further comprise sulfate ions.
  • Suitable sources for optional sulfate ions are water soluble salts of sulfate ions such as sodium sulfate, potassium sulfate, and ammonium sulfate.
  • the concentration of the optional sulfate ions preferably ranges from 0.05 to 20 g/l, more preferably from 0.1 to 10 g/l.
  • the aqueous plating bath according to the present invention is prepared by adding the ingredients to water.
  • concentrates of the aqueous plating bath are prepared and further diluted with water prior to use of the plating bath.
  • the cyanide-free aqueous immersion-type bath according to the present invention is free of antimony or bismuth ions.
  • a kit comprising two different aqueous solutions.
  • the first solution contains at least one complexing agent selected from the group consisting of carboxylic acids, hydroxycarboxylic acids, aminocarboxylic acids and salts of the aforementioned, thiosulfate ions and the at least one ureylene polymer additive according to formulae (I) and/or (II).
  • the second solution contains gold ions and sulfite ions.
  • the first solution and the second solution of the kit are mixed to obtain the immersion-type plating bath according to the present invention.
  • the pH of the aqueous plating bath according to the present invention preferably ranges from 5 to 8, more preferably from 5.5 to 7.5.
  • the target pH value can be adjusted using for example sulfuric acid or sodium hydroxide.
  • the substrate to be plated with gold or a gold alloy has a surface area consisting of a metal or metal alloy less noble than gold and is contacted with the aqueous plating bath according to the present invention by either dipping the substrate into the plating bath or by spraying the plating bath onto the substrate.
  • Gold or a gold alloy is then deposited onto the surface area consisting of a metal or metal alloy less noble than gold, selected from the group comprising nickel, nickel alloys such as nickel phosphorous alloys, nickel boron alloys, cobalt, cobalt alloys such as cobalt phosphorous alloys, cobalt molybdenum phosphorous alloys, cobalt molybdenum boron alloys, cobalt molybdenum boron phosphorous alloys, cobalt tungsten phosphorous alloys, cobalt tungsten boron alloys, cobalt tungsten boron phosphorous alloys, palladium, palladium alloys such as palladium phosphorous alloys, palladium boron alloys, copper and copper alloys.
  • nickel alloys such as nickel phosphorous alloys, nickel boron alloys, cobalt, cobalt alloys such as cobalt phosphorous alloys, cobalt molybdenum boron alloys, cobalt moly
  • the temperature of the aqueous plating bath is preferably in the range of 30 to 70 °C, more preferably from 40 to 60 °C during plating.
  • the plating time is preferably in the range of 40 to 60 min, more preferably in the range of 5 to 30 min.
  • the immersion-type plating bath according to the present invention may be used with horizontal, vertical and spray plating equipment.
  • the solvent used was Millipore water with 0.5 % acetic acid and 0.1 M Na 2 SO 4 .
  • Substrates (length: 27.5 mm, width: 12.5 mm) containing 40 plated through-holes (0.8 mm diameter, 1.5 mm land size, and a surface consisting of a plated nickel phosphorous alloy) were used throughout all examples. Gold was deposited onto the plated through-holes.
  • Test C1 a solder float test with lead-free solder according to IPC J-STD-003B (March 2007 ) was applied to all gold plated samples in order to asses the solder wettability of the gold layers.
  • a SnAg3.0Cu0.5 solder bath was used.
  • three reflow cycles in air atmosphere were applied to each sample prior to inspection.
  • the samples are evaluated after the test with an optical microscope (magnification: 10 x). A sufficient wetting of the gold layer with solder material is achieved when at least 95 % of the gold surfaces being tested exhibit good wetting.
  • An aqueous immersion type gold plating bath stock solution comprising 1.5 g/l trisodium gold sulfite 3.72 g/l Na 2 S 2 O 3 ⁇ 5H 2 O 1 g/l oxalic acid 3.1 g/l trisodium citrate dihydrate 5 g/l methionine was used throughout all examples. Further additives added to the stock solution are indicated in the respective example.
  • the plating bath pH was 6.
  • the plating bath temperature during plating was 50 °C and the plating time was 15 min.
  • the thickness of the deposited gold layers ranged between 60 and 80 nm.
  • the gold layer obtained has a green colour which is not desired.
  • test C1 was only achieved for 5 % of the gold plated area. Accordingly, the gold layer failed the solder float test.
  • the polymer additive according to formula (II) was obtained according to preparation example 12 in WO 2011/029781 A1 and comprises chloride ions as counter ions.
  • the weight average molecular mass M W of the ureylene polymer additive obtained was 5380 Da.
  • the gold layer obtained has the desired lemon-yellow colour.
  • test C1 was achieved for 98 % of the gold plated area.
  • the ureylene polymer additive was prepared by reacting 20 g 1,3-bis-(3-dimethylamino)-propyl-urea (monomer A) with 22.77 g oxybis-(ethane-2,1-diyl)-methanesulfonate (monomer L) in a molar ratio of 4 : 3 for 12 h at a temperature of 80 °C.
  • the ureylene polymer additive according to formula (II) comprises methanesulfonate as counter ions and has a weight average molecular mass M W of 5677 Da.
  • the gold layer obtained has the desired lemon-yellow colour.
  • the polymer additive according to formula (I) was prepared by reacting 20 g 1,3-bis-(3-dimethylamino)-propyl-urea (monomer A) with 22.7 g oxybis-(ethane-2,1-diyl)-methanesulfonate (monomer L) in a molar ratio of 1 : 1 for 20 h at a temperature of 80 °C.
  • the ureylene polymer additive according to formula (I) comprises methanesulfonate as counter ions and has a weight average molecular mass M W of 17260 Da.
  • the gold layer obtained has the desired lemon-yellow colour.
  • the polymer additive according to formula (II) was prepared by reacting 25 g 1,3-bis-(3-dimethylamino)-propyl-urea (monomer A) with 24.94 g ethane-1,2-diyl-bis(oxy)-bis(ethane-3,1-diyl)-dimethanesulfonate (monomer L) in a molar ratio of 3 : 2 for 24 h at a temperature of 80 °C.
  • the ureylene polymer additive according to formula (II) comprises methanesulfonate as counter ions and has a weight average molecular mass M W of 7299 Da.
  • the gold layer obtained has the desired lemon-yellow colour.
  • the polymer additive according to formula (II) was prepared by reacting 15 g 1,3-bis-(3-dimethylamino)-propyl-urea (monomer A) with 6.43 g 1,3-dichloropropane-2-ol (monomer L) in a molar ratio of 4 : 3 for 12 h at a temperature of 80 °C.
  • the ureylene polymer additive according to formula (II) comprises chloride as counter ions and has a weight average molecular mass M W of 5202 Da.
  • the gold layer obtained has the desired lemon-yellow colour.
  • the polymer additive according to formula (II) was prepared by reacting the 45 g 1,3-bis-(3-dimethylamino)-propyl-urea (monomer A) with 18.6 g 1-bromo-3-chloro-propane in a molar ratio of 3 : 2 for 12 h at a temperature of 80 °C.
  • the ureylene polymer additive according to formula (II) comprises bromide and chloride as counter ions and has a weight average molecular mass M W of 5016 Da.
  • the gold layer obtained has the desired lemon-yellow colour.

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Claims (16)

  1. Bain aqueux de placage de type immersion sans cyanure pour le dépôt d'or, comprenant :
    (i) une source d'ions or,
    (ii) au moins un agent complexant choisi dans le groupe constitué par les acides carboxyliques, les acides hydroxycarboxyliques, les acides aminocarboxyliques et les sels des composés susmentionnés,
    (iii) des ions sulfite,
    (iv) des ions thiosulfate, et
    (v) au moins un additif polymère d'uréylène choisi parmi les polymères répondant aux formules (I) et (II) :
    Figure imgb0016
    Figure imgb0017
    dans lesquelles n est un entier et va de 1 à 40,
    dans lesquelles le monomère A est choisi parmi les composés répondant aux formules (III) à (V)
    Figure imgb0018
    Figure imgb0019
    Figure imgb0020
    dans lesquelles R1, R2, R5 et R6 sont indépendamment choisis dans le groupe constitué par un résidu hydrocarboné substitué ou non substitué avec 1 à 10 atomes de carbone,
    R3, R4 et R7 sont indépendamment choisis dans le groupe constitué par les groupes (CH2)p, où p représente un entier de 2 à 12, et -[CH2CH2O]m-CH2CH2-, où m vaut entre 1 et 40,
    et dans lesquelles
    L représente un résidu divalent, qui est choisi dans le groupe constitué par les groupes -(CH2)p-, où p est un entier entre 1 à 12, -CH2-CH(OH)-CH2-, -[CH2O]q-CH2CH2- et -[CH2CH2O]q-CH2CH2-, où q est un entier entre 1 et 40
    et dans lequel l'additif polymère d'uréylène répondant aux formules (I) et (II) sont obtenus par réaction d'un ou plusieurs composés diaminés des formules (III) à (V) avec un ou plusieurs composés de la formule (VI)

            P-L-Q     (VI)

    dans laquelle L a la même signification que dans les formules (I) et (II) et dans laquelle P et Q sont identiques ou différents et choisis dans le groupe constitué par Cl, Br, I, le mésylate, le triflate, le nonaflate, le méthanesulfonate et le tosylate.
  2. Bain aqueux de placage de type immersion sans cyanure selon la revendication 1 dans lequel la concentration d'ions or va de 0,1 à 10 g/l.
  3. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes dans lequel l'au moins un agent complexant comprend un acide hydroxycarboxylique choisi dans le groupe constitué par l'acide tartrique, l'acide citrique, l'acide lactique, l'acide malique, l'acide gluconique ou un sel des composés susmentionnés.
  4. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes dans lequel l'au moins un agent complexant consiste en un acide aminocarboxylique choisi dans le groupe comprenant la glycine, la cystéine, la méthionine ou un sel des composés susmentionnés.
  5. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes dans lequel la concentration de l'au moins un agent complexant va de 0,1 à 25 g/l.
  6. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes dans lequel la concentration d'ions sulfite va de 0,05 à 10 g/l.
  7. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes dans lequel la concentration d'ions thiosulfate va de 0,1 à 20 g/l.
  8. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes dans lequel le monomère A est choisi parmi les composés répondant à la formule (III).
  9. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes dans lequel R1, R2, R5 et R6 sont indépendamment choisis dans le groupe constitué par les groupes méthyle, éthyle, hydroxyéthyle et -CH2CH2(OCH2CH2)y-OH, où y vaut entre 0 et 4.
  10. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes dans lequel R3, R4 et R7 sont indépendamment choisis dans le groupe constitué par les groupes -(CH2)p-, où p vaut 2, -(CH2)2-O-(CH2)2- et - (CH2)2-O- (CH2)2-O-(CH2)2-.
  11. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes dans lequel le monomère L est choisi dans le groupe constitué par les groupes -(CH2)p-, où p est un entier entre 1 et 6, -(CH2)-O-(CH2)2-, - (CH2)2-O- (CH2)2-, - (CH2)2-O- (CH2)2-O- (CH2)2- et -CH2-CH (OH) -CH2-.
  12. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes dans lequel la concentration de l'au moins un polymère d'uréylène va de 0,005 à 10 g/l.
  13. Bain aqueux de placage de type immersion sans cyanure selon l'une quelconque des revendications précédentes qui est dépourvu d'ions antimoine ou bismuth.
  14. Kit comprenant une première solution qui contient au moins un agent complexant choisi dans le groupe constitué par les acides carboxyliques, les acides hydroxycarboxyliques, les acides aminocarboxyliques et les sels des composés susmentionnés, des ions thiosulfate et au moins un additif polymère d'uréylène répondant aux formules (I) et/ou (II) selon le point v) de la revendication 1 et dans lequel l'additif polymère d'uréylène répondant aux formules (I) et (II) sont obtenus par réaction d'un ou plusieurs composés diaminés des formules (III) à (V) avec un ou plusieurs composés de la formule (VI), et une deuxième solution qui contient une source d'ions or et des ions sulfite.
  15. Procédé de dépôt d'une couche d'or sur un substrat comprenant, dans cet ordre, les étapes suivantes :
    (i) se procurer un substrat ayant une zone de surface consistant en un métal ou un alliage métallique moins noble que l'or,
    (ii) mettre le substrat en contact avec un bain aqueux de placage de type immersion sans cyanure selon les revendications 1 à 13
    et déposer ainsi une couche d'or sur la zone de surface consistant en un métal ou un alliage métallique moins noble que l'or.
  16. Procédé de dépôt d'une couche d'or ou d'alliage d'or sur un substrat selon la revendication 15 dans lequel le métal ou l'alliage métallique moins noble que l'or est choisi dans le groupe constitué par le nickel, les alliages de nickel, le cobalt, les alliages de cobalt, le palladium, les alliages de palladium, le cuivre et les alliages de cuivre.
EP12180227.6A 2012-08-13 2012-08-13 Composition de bain de placage pour dépôt par immersion de l'or Active EP2698449B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP12180227.6A EP2698449B1 (fr) 2012-08-13 2012-08-13 Composition de bain de placage pour dépôt par immersion de l'or
CN201380042872.8A CN104520471B (zh) 2012-08-13 2013-07-11 用于金的浸镀的镀浴组合物
PCT/EP2013/064725 WO2014026806A2 (fr) 2012-08-13 2013-07-11 Composition de bain de placage pour placage par immersion d'or
TW102127505A TWI551723B (zh) 2012-08-13 2013-07-31 用於浸鍍金之鍍浴組合物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12180227.6A EP2698449B1 (fr) 2012-08-13 2012-08-13 Composition de bain de placage pour dépôt par immersion de l'or

Publications (2)

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EP2698449A1 EP2698449A1 (fr) 2014-02-19
EP2698449B1 true EP2698449B1 (fr) 2019-10-02

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EP (1) EP2698449B1 (fr)
CN (1) CN104520471B (fr)
TW (1) TWI551723B (fr)
WO (1) WO2014026806A2 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2834877T3 (es) * 2018-01-26 2021-06-21 Atotech Deutschland Gmbh Baño de enchapado en oro electrolítico
DE102019202899B3 (de) * 2019-03-04 2019-11-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wässrige Formulierung zum Herstellen einer Schicht aus Gold und Silber
EP3933073B1 (fr) * 2020-06-29 2023-11-29 Atotech Deutschland GmbH & Co. KG Bain d'électrodéposition de cuivre

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Publication number Priority date Publication date Assignee Title
US4618513A (en) * 1984-12-17 1986-10-21 Texo Corporation Tin plating immersion process
JP4147359B2 (ja) * 1998-12-24 2008-09-10 石原薬品株式会社 置換金メッキ浴及び当該浴を用いた金メッキ方法
US6436269B1 (en) * 2000-10-19 2002-08-20 Atotech Deutschland Gmbh Plating bath and method for electroplating tin-zinc alloys
JP4932094B2 (ja) * 2001-07-02 2012-05-16 日本リーロナール有限会社 無電解金めっき液および無電解金めっき方法
JP2004250765A (ja) 2003-02-21 2004-09-09 Murata Mfg Co Ltd 金めっき液、及び電子部品の製造方法
EP1767664B1 (fr) 2004-07-09 2017-05-17 JX Nippon Mining & Metals Corporation Liquide de placage chimique à l'or
JP4759416B2 (ja) * 2006-03-20 2011-08-31 新光電気工業株式会社 非シアン無電解金めっき液及び無電解金めっき方法
TW200848544A (en) * 2007-06-13 2008-12-16 Solution Chemicals Co Ltd Electroless golden plating bath without cyanide
EP2292679B1 (fr) 2009-09-08 2020-03-11 ATOTECH Deutschland GmbH Polymères dotés de groupes terminaux aminés et leur utilisation comme additifs pour bains galvaniques de zinc et d'alliages de zinc

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Also Published As

Publication number Publication date
TW201413051A (zh) 2014-04-01
EP2698449A1 (fr) 2014-02-19
CN104520471B (zh) 2016-08-24
TWI551723B (zh) 2016-10-01
WO2014026806A3 (fr) 2014-08-28
CN104520471A (zh) 2015-04-15
WO2014026806A2 (fr) 2014-02-20

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