EP2748855A4 - Transistors de puissance à effet de champ - Google Patents
Transistors de puissance à effet de champInfo
- Publication number
- EP2748855A4 EP2748855A4 EP20120824976 EP12824976A EP2748855A4 EP 2748855 A4 EP2748855 A4 EP 2748855A4 EP 20120824976 EP20120824976 EP 20120824976 EP 12824976 A EP12824976 A EP 12824976A EP 2748855 A4 EP2748855 A4 EP 2748855A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- field effect
- effect transistors
- transistors
- field
- effect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/473—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT
- H10D30/4732—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having confinement of carriers by multiple heterojunctions, e.g. quantum well HEMT using Group III-V semiconductor material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
- H10D30/4755—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs having wide bandgap charge-carrier supplying layers, e.g. modulation doped HEMTs such as n-AlGaAs/GaAs HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
- H10D62/815—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW]
- H10D62/8161—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/27—Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
- H10D64/311—Gate electrodes for field-effect devices
- H10D64/411—Gate electrodes for field-effect devices for FETs
- H10D64/511—Gate electrodes for field-effect devices for FETs for IGFETs
- H10D64/512—Disposition of the gate electrodes, e.g. buried gates
- H10D64/513—Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/611—Insulated-gate field-effect transistors [IGFET] having multiple independently-addressable gate electrodes influencing the same channel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/81—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
- H10D62/815—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW]
- H10D62/8161—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices
- H10D62/8162—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices having quantum effects only in the vertical direction, i.e. layered structures having quantum effects solely resulting from vertical potential variation
- H10D62/8164—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices having quantum effects only in the vertical direction, i.e. layered structures having quantum effects solely resulting from vertical potential variation comprising only semiconductor materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/118—Electrodes comprising insulating layers having particular dielectric or electrostatic properties, e.g. having static charges
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/20—Electrodes characterised by their shapes, relative sizes or dispositions
- H10D64/23—Electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. sources, drains, anodes or cathodes
- H10D64/251—Source or drain electrodes for field-effect devices
- H10D64/257—Source or drain electrodes for field-effect devices for lateral devices wherein the source or drain electrodes are characterised by top-view geometrical layouts, e.g. interdigitated, semi-circular, annular or L-shaped electrodes
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/215,254 US8816395B2 (en) | 2010-05-02 | 2011-08-23 | Field effect power transistors |
| PCT/IB2012/054274 WO2013027190A1 (fr) | 2011-08-23 | 2012-08-23 | Transistors de puissance à effet de champ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2748855A1 EP2748855A1 (fr) | 2014-07-02 |
| EP2748855A4 true EP2748855A4 (fr) | 2015-05-06 |
| EP2748855B1 EP2748855B1 (fr) | 2021-08-11 |
Family
ID=47747180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP12824976.0A Active EP2748855B1 (fr) | 2011-08-23 | 2012-08-23 | Transistors de puissance à effet de champ |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8816395B2 (fr) |
| EP (1) | EP2748855B1 (fr) |
| JP (1) | JP2014527303A (fr) |
| WO (1) | WO2013027190A1 (fr) |
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| JP5591776B2 (ja) * | 2011-09-21 | 2014-09-17 | 株式会社東芝 | 窒化物半導体装置およびそれを用いた回路 |
| JP5864214B2 (ja) * | 2011-10-31 | 2016-02-17 | 株式会社日立製作所 | 半導体装置 |
| JP6119165B2 (ja) * | 2012-09-28 | 2017-04-26 | 富士通株式会社 | 半導体装置 |
| US9583574B2 (en) | 2012-09-28 | 2017-02-28 | Intel Corporation | Epitaxial buffer layers for group III-N transistors on silicon substrates |
| KR101946009B1 (ko) * | 2012-10-11 | 2019-02-08 | 삼성전자주식회사 | 고전자이동도 트랜지스터 및 그 구동방법 |
| US9202811B2 (en) * | 2012-12-18 | 2015-12-01 | Infineon Technologies Americas Corp. | Cascode circuit integration of group III-N and group IV devices |
| EP2946406B1 (fr) * | 2013-01-15 | 2020-01-08 | Visic Technologies Ltd. | Transistor multicanal |
| US20140252371A1 (en) * | 2013-03-08 | 2014-09-11 | Seoul Semiconductor Co., Ltd. | Heterojunction transistor and method of fabricating the same |
| US9202906B2 (en) | 2013-03-14 | 2015-12-01 | Northrop Grumman Systems Corporation | Superlattice crenelated gate field effect transistor |
| US8907378B2 (en) * | 2013-03-15 | 2014-12-09 | Mitsubishi Electric Research Laboratories, Inc. | High electron mobility transistor with multiple channels |
| KR102065113B1 (ko) | 2013-05-01 | 2020-01-10 | 삼성전자주식회사 | 고전자이동도 트랜지스터 및 그 제조 방법 |
| US9111750B2 (en) * | 2013-06-28 | 2015-08-18 | General Electric Company | Over-voltage protection of gallium nitride semiconductor devices |
| US9455341B2 (en) * | 2013-07-17 | 2016-09-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transistor having a back-barrier layer and method of making the same |
| US20150021665A1 (en) * | 2013-07-17 | 2015-01-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Transistor having back-barrier layer and method of making the same |
| US9997507B2 (en) | 2013-07-25 | 2018-06-12 | General Electric Company | Semiconductor assembly and method of manufacture |
| JP6133191B2 (ja) * | 2013-10-18 | 2017-05-24 | 古河電気工業株式会社 | 窒化物半導体装置、ダイオード、および電界効果トランジスタ |
| WO2015077647A2 (fr) * | 2013-11-22 | 2015-05-28 | Cambridge Electronics, Inc. | Gestion de champ électrique pour un semi-conducteur au nitrure du groupe iii |
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| WO2016147541A1 (fr) * | 2015-03-17 | 2016-09-22 | パナソニック株式会社 | Dispositif à semi-conducteur au nitrure |
| US11448824B2 (en) * | 2015-03-20 | 2022-09-20 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Devices with semiconductor hyperbolic metamaterials |
| US20160293596A1 (en) * | 2015-03-30 | 2016-10-06 | Texas Instruments Incorporated | Normally off iii-nitride transistor |
| US9773897B2 (en) * | 2015-04-01 | 2017-09-26 | Northrop Grumman Systems Corporation | Multichannel devices with gate structures to increase breakdown voltage |
| US9580304B2 (en) | 2015-05-07 | 2017-02-28 | Texas Instruments Incorporated | Low-stress low-hydrogen LPCVD silicon nitride |
| JP6575304B2 (ja) * | 2015-10-30 | 2019-09-18 | 富士通株式会社 | 半導体装置、電源装置、増幅器及び半導体装置の製造方法 |
| ITUB20155536A1 (it) * | 2015-11-12 | 2017-05-12 | St Microelectronics Srl | Transistore hemt di tipo normalmente spento includente una trincea contenente una regione di gate e formante almeno un gradino, e relativo procedimento di fabbricazione |
| US10861942B2 (en) * | 2015-12-09 | 2020-12-08 | Intel Corporation | Tunable capacitors including III-N multi-2DEG and 3DEG structures for tunable RF filters |
| KR102455088B1 (ko) * | 2016-01-11 | 2022-10-14 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 박막 트랜지스터 기판, 이를 포함하는 표시패널 및 표시장치 |
| WO2017171741A1 (fr) * | 2016-03-30 | 2017-10-05 | Intel Corporation | Formation de source/drain de transistor microélectronique par gravure oblique |
| CN105870164B (zh) * | 2016-03-30 | 2019-07-23 | 宁波大学 | 一种氮化镓基高电子迁移率晶体管 |
| US9899537B2 (en) | 2016-05-31 | 2018-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device with transition metal dichalocogenide hetero-structure |
| KR102712333B1 (ko) * | 2016-12-15 | 2024-10-02 | 현대자동차주식회사 | 파워모듈의 정션온도 측정 방법 |
| US10192959B2 (en) * | 2017-01-23 | 2019-01-29 | Imec Vzw | III-N based substrate for power electronic devices and method for manufacturing same |
| TWI608608B (zh) * | 2017-02-20 | 2017-12-11 | 新唐科技股份有限公司 | 電晶體 |
| JP6917160B2 (ja) * | 2017-02-26 | 2021-08-11 | 住友化学株式会社 | 半導体基板、電子デバイス、半導体基板の検査方法および電子デバイスの製造方法 |
| US11094814B2 (en) | 2017-09-29 | 2021-08-17 | Epistar Corporation | Semiconductor power device |
| US10134596B1 (en) * | 2017-11-21 | 2018-11-20 | Texas Instruments Incorporated | Recessed solid state apparatuses |
| JP6861849B2 (ja) * | 2017-12-28 | 2021-04-21 | 三菱電機株式会社 | 窒化物半導体装置およびその製造方法 |
| CN108400159B (zh) * | 2018-01-25 | 2020-08-25 | 厦门市三安集成电路有限公司 | 具有多量子阱高阻缓冲层的hemt外延结构及制备方法 |
| US10658501B2 (en) * | 2018-02-21 | 2020-05-19 | Mitsubishi Electric Research Laboratories, Inc. | Vertically stacked multichannel pyramid transistor |
| US20190305122A1 (en) * | 2018-03-28 | 2019-10-03 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure |
| US11855198B2 (en) * | 2020-04-09 | 2023-12-26 | Qualcomm Incorporated | Multi-gate high electron mobility transistors (HEMTs) employing tuned recess depth gates for improved device linearity |
| WO2022217413A1 (fr) | 2021-04-12 | 2022-10-20 | Innoscience (Suzhou) Technology Co., Ltd. | Dispositif à semi-conducteur et son procédé de fabrication |
| US12279444B2 (en) | 2021-04-12 | 2025-04-15 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US12125902B2 (en) * | 2021-04-12 | 2024-10-22 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US12274082B2 (en) | 2021-04-12 | 2025-04-08 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US12317532B2 (en) | 2021-04-12 | 2025-05-27 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US12125801B2 (en) | 2021-04-12 | 2024-10-22 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor device and method for manufacturing the same |
| US12289901B2 (en) | 2021-04-12 | 2025-04-29 | Innoscience (Suzhou) Technology Co., Ltd. | Semiconductor device and method for manufacturing the same |
| CN114388615B (zh) * | 2022-01-17 | 2023-05-09 | 东莞源礼灯饰有限公司 | 一种立体复数堆叠外延结构芯片 |
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| US20250080111A1 (en) * | 2023-08-29 | 2025-03-06 | Visic Technologies Ltd. | Low on-resistance high power switch |
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2011
- 2011-08-23 US US13/215,254 patent/US8816395B2/en active Active
-
2012
- 2012-08-23 JP JP2014526592A patent/JP2014527303A/ja active Pending
- 2012-08-23 WO PCT/IB2012/054274 patent/WO2013027190A1/fr not_active Ceased
- 2012-08-23 EP EP12824976.0A patent/EP2748855B1/fr active Active
- 2012-08-23 US US14/240,599 patent/US9130028B2/en active Active
Patent Citations (3)
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| JP2009049288A (ja) * | 2007-08-22 | 2009-03-05 | Nec Corp | 半導体装置 |
| US20090267078A1 (en) * | 2008-04-23 | 2009-10-29 | Transphorm Inc. | Enhancement Mode III-N HEMTs |
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| RONGHUA WANG ET AL: "Gate-Recessed Enhancement-Mode InAlN/AlN/GaN HEMTs With 1.9-A/mm Drain Current Density and 800-mS/mm Transconductance", IEEE ELECTRON DEVICE LETTERS, IEEE SERVICE CENTER, NEW YORK, NY, US, vol. 31, no. 12, December 2010 (2010-12-01), pages 1383 - 1385, XP011319444, ISSN: 0741-3106 * |
| SAKAI M ET AL: "Effect of various interlayers on epiwafer bowing in AlGaN/GaN high-electron-mobility transistor structures", JAPANESE JOURNAL OF APPLIED PHYSICS, JAPAN SOCIETY OF APPLIED PHYSICS, JP, vol. 43, no. 12, December 2004 (2004-12-01), pages 8019 - 8023, XP001517768, ISSN: 0021-4922, DOI: 10.1143/JJAP.43.8019 * |
| See also references of WO2013027190A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014527303A (ja) | 2014-10-09 |
| EP2748855B1 (fr) | 2021-08-11 |
| EP2748855A1 (fr) | 2014-07-02 |
| US20140326951A1 (en) | 2014-11-06 |
| US8816395B2 (en) | 2014-08-26 |
| US9130028B2 (en) | 2015-09-08 |
| WO2013027190A1 (fr) | 2013-02-28 |
| US20110297961A1 (en) | 2011-12-08 |
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