EP2752896A3 - Emballage de dispositif électroluminescent - Google Patents
Emballage de dispositif électroluminescent Download PDFInfo
- Publication number
- EP2752896A3 EP2752896A3 EP14150412.6A EP14150412A EP2752896A3 EP 2752896 A3 EP2752896 A3 EP 2752896A3 EP 14150412 A EP14150412 A EP 14150412A EP 2752896 A3 EP2752896 A3 EP 2752896A3
- Authority
- EP
- European Patent Office
- Prior art keywords
- emitting device
- light emitting
- light
- region
- device package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Devices (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130002145A KR102071424B1 (ko) | 2013-01-08 | 2013-01-08 | 발광소자 패키지 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2752896A2 EP2752896A2 (fr) | 2014-07-09 |
| EP2752896A3 true EP2752896A3 (fr) | 2016-07-20 |
| EP2752896B1 EP2752896B1 (fr) | 2020-10-07 |
Family
ID=49886849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP14150412.6A Active EP2752896B1 (fr) | 2013-01-08 | 2014-01-08 | Emballage de dispositif électroluminescent |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9337403B2 (fr) |
| EP (1) | EP2752896B1 (fr) |
| JP (2) | JP6322416B2 (fr) |
| KR (1) | KR102071424B1 (fr) |
| CN (2) | CN108565328B (fr) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9902644B2 (en) | 2014-06-19 | 2018-02-27 | Corning Incorporated | Aluminosilicate glasses |
| WO2017200341A2 (fr) * | 2016-05-19 | 2017-11-23 | 엘지이노텍 주식회사 | Module flash et terminal le comprenant |
| CN109560461A (zh) * | 2017-09-26 | 2019-04-02 | 青岛海信激光显示股份有限公司 | 一种激光器阵列 |
| CN109491139A (zh) * | 2018-10-31 | 2019-03-19 | 武汉华星光电技术有限公司 | 背光源的制作方法 |
| US20210334505A1 (en) * | 2020-01-09 | 2021-10-28 | AuthenX Inc. | Image capturing system and method for capturing image |
| US11468712B2 (en) * | 2020-01-09 | 2022-10-11 | AuthenX Inc. | Liveness detection apparatus, system and method |
| CN114038973B (zh) * | 2021-08-10 | 2023-06-16 | 重庆康佳光电技术研究院有限公司 | 发光器件及其制作方法和测试方法 |
| FR3143721B1 (fr) * | 2022-12-19 | 2024-12-13 | Valeo Vision | Dispositif lumineux pour véhicule automobile. |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090294887A1 (en) * | 2008-05-29 | 2009-12-03 | Takashi Hirano | Semiconductor device |
| US20100006877A1 (en) * | 2008-07-09 | 2010-01-14 | Himax Display, Inc. | Light-emitting diode package |
| WO2010136920A1 (fr) * | 2009-05-28 | 2010-12-02 | Koninklijke Philips Electronics N.V. | Dispositif d'éclairage avec enveloppe renfermant une source de lumière |
| WO2012120434A1 (fr) * | 2011-03-07 | 2012-09-13 | Koninklijke Philips Electronics N.V. | Module émetteur de lumière, lampe, luminaire et dispositif d'affichage |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4430264B2 (ja) * | 2001-03-19 | 2010-03-10 | 日亜化学工業株式会社 | 表面実装型発光装置 |
| JP2005038956A (ja) * | 2003-07-17 | 2005-02-10 | Matsushita Electric Ind Co Ltd | 光部品とその製造方法 |
| JP4228303B2 (ja) * | 2004-04-12 | 2009-02-25 | 住友電気工業株式会社 | 半導体発光素子搭載部材と、それを用いた半導体発光装置 |
| JP2005347564A (ja) * | 2004-06-03 | 2005-12-15 | Nec Compound Semiconductor Devices Ltd | 気密封止パッケージ |
| KR100709890B1 (ko) * | 2004-09-10 | 2007-04-20 | 서울반도체 주식회사 | 다중 몰딩수지를 갖는 발광다이오드 패키지 |
| JP4661147B2 (ja) * | 2004-09-24 | 2011-03-30 | 日亜化学工業株式会社 | 半導体装置 |
| JP4890775B2 (ja) * | 2005-03-23 | 2012-03-07 | パナソニック株式会社 | 発光モジュール |
| JP2007080868A (ja) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | 発光装置 |
| JP2007189031A (ja) * | 2006-01-12 | 2007-07-26 | Allied Material Corp | 半導体素子搭載用部材とそれを用いた半導体装置および発光ダイオード |
| US7528422B2 (en) * | 2006-01-20 | 2009-05-05 | Hymite A/S | Package for a light emitting element with integrated electrostatic discharge protection |
| DE102006015377B4 (de) * | 2006-04-03 | 2018-06-14 | Ivoclar Vivadent Ag | Halbleiter-Strahlungsquelle sowie Lichthärtgerät |
| JP5233172B2 (ja) * | 2007-06-07 | 2013-07-10 | 日亜化学工業株式会社 | 半導体発光装置 |
| KR101266226B1 (ko) * | 2008-07-09 | 2013-05-21 | 우시오덴키 가부시키가이샤 | 발광 장치 및 발광 장치의 제조 방법 |
| JP2010177375A (ja) * | 2009-01-28 | 2010-08-12 | Citizen Electronics Co Ltd | 発光装置及び発光装置の製造方法 |
| JP2010251686A (ja) * | 2009-03-26 | 2010-11-04 | Harison Toshiba Lighting Corp | 発光装置及びその製造方法 |
| JP2011014587A (ja) * | 2009-06-30 | 2011-01-20 | Nichia Corp | 発光装置 |
| JPWO2012053386A1 (ja) * | 2010-10-21 | 2014-02-24 | シーシーエス株式会社 | 発光装置の製造方法及び発光装置 |
| TW201246615A (en) * | 2011-05-11 | 2012-11-16 | Siliconware Precision Industries Co Ltd | Package structure and method of making same |
| JP5968674B2 (ja) * | 2011-05-13 | 2016-08-10 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ及びこれを備える紫外線ランプ |
| US8860059B2 (en) * | 2011-06-20 | 2014-10-14 | Xiamen Sanan Optoelectronics Technology Co., Ltd. | Light emitting devices, systems, and methods of manufacturing |
| JP2013016272A (ja) * | 2011-06-30 | 2013-01-24 | Canon Inc | 表示装置 |
| US9169017B2 (en) * | 2012-02-15 | 2015-10-27 | The Boeing Company | Aircraft interior lighting system using structured micro lens arrays |
-
2013
- 2013-01-08 KR KR1020130002145A patent/KR102071424B1/ko active Active
-
2014
- 2014-01-07 JP JP2014001038A patent/JP6322416B2/ja active Active
- 2014-01-07 US US14/149,547 patent/US9337403B2/en active Active
- 2014-01-08 CN CN201810311516.6A patent/CN108565328B/zh active Active
- 2014-01-08 EP EP14150412.6A patent/EP2752896B1/fr active Active
- 2014-01-08 CN CN201410008737.8A patent/CN103915543B/zh active Active
-
2018
- 2018-04-09 JP JP2018074777A patent/JP6641407B2/ja active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090294887A1 (en) * | 2008-05-29 | 2009-12-03 | Takashi Hirano | Semiconductor device |
| US20100006877A1 (en) * | 2008-07-09 | 2010-01-14 | Himax Display, Inc. | Light-emitting diode package |
| WO2010136920A1 (fr) * | 2009-05-28 | 2010-12-02 | Koninklijke Philips Electronics N.V. | Dispositif d'éclairage avec enveloppe renfermant une source de lumière |
| WO2012120434A1 (fr) * | 2011-03-07 | 2012-09-13 | Koninklijke Philips Electronics N.V. | Module émetteur de lumière, lampe, luminaire et dispositif d'affichage |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102071424B1 (ko) | 2020-01-30 |
| EP2752896A2 (fr) | 2014-07-09 |
| JP2018139298A (ja) | 2018-09-06 |
| US20140191276A1 (en) | 2014-07-10 |
| CN108565328B (zh) | 2021-05-18 |
| JP6322416B2 (ja) | 2018-05-09 |
| CN103915543B (zh) | 2018-05-04 |
| KR20140089984A (ko) | 2014-07-16 |
| EP2752896B1 (fr) | 2020-10-07 |
| CN103915543A (zh) | 2014-07-09 |
| JP6641407B2 (ja) | 2020-02-05 |
| US9337403B2 (en) | 2016-05-10 |
| JP2014135488A (ja) | 2014-07-24 |
| CN108565328A (zh) | 2018-09-21 |
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