EP2758992A4 - VERTICAL SWITCHING TRAINING FOR PROTECTION AGAINST ELECTROSTATIC DISCHARGE - Google Patents

VERTICAL SWITCHING TRAINING FOR PROTECTION AGAINST ELECTROSTATIC DISCHARGE

Info

Publication number
EP2758992A4
EP2758992A4 EP12834081.7A EP12834081A EP2758992A4 EP 2758992 A4 EP2758992 A4 EP 2758992A4 EP 12834081 A EP12834081 A EP 12834081A EP 2758992 A4 EP2758992 A4 EP 2758992A4
Authority
EP
European Patent Office
Prior art keywords
protection against
electrostatic discharge
against electrostatic
vertical switching
switching training
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12834081.7A
Other languages
German (de)
French (fr)
Other versions
EP2758992A2 (en
Inventor
Robert Fleming
Michael Glickman
Bhret Graydon
Junjun Wu
Daniel Vasquez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Littelfuse Inc
Original Assignee
Littelfuse Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Littelfuse Inc filed Critical Littelfuse Inc
Publication of EP2758992A2 publication Critical patent/EP2758992A2/en
Publication of EP2758992A4 publication Critical patent/EP2758992A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • H10D89/601—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs
    • H10D89/911—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD] for devices having insulated gate electrodes, e.g. for IGFETs or IGBTs using passive elements as protective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points specially adapted for resistors; Arrangements of terminals or tapping points on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/1013—Thin film varistors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/041—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage using a short-circuiting device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
    • H01G7/06—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/044—Physical layout, materials not provided for elsewhere
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/49—Adaptable interconnections, e.g. fuses or antifuses
    • H10W20/491—Antifuses, i.e. interconnections changeable from non-conductive to conductive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
EP12834081.7A 2011-09-21 2012-09-21 VERTICAL SWITCHING TRAINING FOR PROTECTION AGAINST ELECTROSTATIC DISCHARGE Withdrawn EP2758992A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161537490P 2011-09-21 2011-09-21
PCT/US2012/056663 WO2013044096A2 (en) 2011-09-21 2012-09-21 Vertical switching formations for esd protection

Publications (2)

Publication Number Publication Date
EP2758992A2 EP2758992A2 (en) 2014-07-30
EP2758992A4 true EP2758992A4 (en) 2015-08-12

Family

ID=47915104

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12834081.7A Withdrawn EP2758992A4 (en) 2011-09-21 2012-09-21 VERTICAL SWITCHING TRAINING FOR PROTECTION AGAINST ELECTROSTATIC DISCHARGE

Country Status (6)

Country Link
EP (1) EP2758992A4 (en)
JP (3) JP2014535157A (en)
KR (1) KR101923760B1 (en)
CN (1) CN103999217B (en)
TW (1) TWI473542B (en)
WO (1) WO2013044096A2 (en)

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US9214433B2 (en) * 2013-05-21 2015-12-15 Xilinx, Inc. Charge damage protection on an interposer for a stacked die assembly
US9401353B2 (en) 2014-08-08 2016-07-26 Qualcomm Incorporated Interposer integrated with 3D passive devices
US9583481B2 (en) 2014-09-30 2017-02-28 Taiwan Semiconductor Manufacturing Company Limited Semiconductor device comprising plurality of conductive portions disposed within wells and a nanowire coupled to conductive portion
TWI558290B (en) * 2015-08-24 2016-11-11 欣興電子股份有限公司 Manufacturing method of circuit board
KR102452045B1 (en) 2017-12-28 2022-10-07 (주)아모텍 Device for protecting overvoltage and method for manufacturing the same
US11112436B2 (en) 2018-03-26 2021-09-07 Analog Devices International Unlimited Company Spark gap structures for detection and protection against electrical overstress events
KR102576106B1 (en) 2018-06-19 2023-09-08 주식회사 아모텍 Device for protecting overvoltag
KR102704159B1 (en) 2018-09-07 2024-09-06 주식회사 아모텍 Device for reducing noise
KR102586946B1 (en) 2018-10-23 2023-10-10 주식회사 아모텍 Device for protecting overvoltage
KR102712310B1 (en) 2018-12-14 2024-10-04 삼성전자주식회사 Semiconductor package and method of manufacturing semiconductor package
CN110055126A (en) * 2019-05-31 2019-07-26 青岛科技大学 A kind of MOF-Ti/TiOx core-shell type nano composite particles ER fluid and preparation method thereof
DE102019127871A1 (en) * 2019-10-16 2021-04-22 Semikron Elektronik Gmbh & Co. Kg Semiconductor component and method for manufacturing a semiconductor component
CN110794273A (en) * 2019-11-19 2020-02-14 哈尔滨理工大学 Potential time domain spectrum testing system with high-voltage driving protection electrode
IT202000016699A1 (en) * 2020-07-09 2022-01-09 Ingelva Srl EQUIPMENT AND METHOD FOR THE PREVENTION AND DAMPING OF VOLTAGE AND CURRENT PEAKS OF EXTERNAL AND INTERNAL ORIGIN FOR MEDIUM, HIGH AND VERY HIGH VOLTAGE POWER LINES
JP2026506293A (en) * 2022-12-22 2026-02-24 ベレノス・クリーン・パワー・ホールディング・アーゲー Bipolar Solid-State Battery Cell
US20240405519A1 (en) * 2023-05-31 2024-12-05 Analog Devices International Unlimited Company Spark gap structures for electrical overstress detection and protection
TWI892785B (en) * 2024-08-05 2025-08-01 聯華電子股份有限公司 Interconnection structure and method of forming the same

Citations (4)

* Cited by examiner, † Cited by third party
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US20060061925A1 (en) * 2004-09-17 2006-03-23 Shrier Karen P Devices and systems for electrostatic discharge suppression
US20060152334A1 (en) * 2005-01-10 2006-07-13 Nathaniel Maercklein Electrostatic discharge protection for embedded components
EP1990834A2 (en) * 2007-05-10 2008-11-12 Texas Instruments France Local Integration of Non-Linear Sheet in Integrated Circuit Packages for ESD/EOS Protection
US20110211289A1 (en) * 2010-02-26 2011-09-01 Lex Kosowsky Embedded protection against spurious electrical events

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US2953309A (en) 1958-05-29 1960-09-20 Harry W Moore Apparatus for and method of winding stator coils
US7825491B2 (en) * 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
WO2001017320A1 (en) * 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US20120195018A1 (en) * 2005-11-22 2012-08-02 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
US7695644B2 (en) * 1999-08-27 2010-04-13 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
JP2001237586A (en) * 2000-02-25 2001-08-31 Matsushita Electric Ind Co Ltd Circuit board, module with built-in circuit components, and method of manufacturing them
AU2003224894A1 (en) * 2002-04-08 2003-10-27 Littelfuse, Inc. Voltage variable material for direct application and devices employing same
US6981319B2 (en) * 2003-02-13 2006-01-03 Shrier Karen P Method of manufacturing devices to protect election components
KR100576872B1 (en) * 2004-09-17 2006-05-10 삼성전기주식회사 Nitride semiconductor light emitting device having anti-static discharge function
TWI397356B (en) * 2005-02-16 2013-05-21 聖米納公司 Substantially continuous layer of embedded transient protection for printed circuit boards
CN101578710B (en) * 2005-11-22 2013-05-22 肖克科技有限公司 Light emitting devices using voltage variable dielectric materials
US7981325B2 (en) 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
JP2010521058A (en) 2006-09-24 2010-06-17 ショッキング テクノロジーズ，インコーポレイテッド Composition of voltage-switchable dielectric material having step voltage response and method of manufacturing the dielectric material
JP2010504437A (en) * 2006-09-24 2010-02-12 ショッキング テクノロジーズ インコーポレイテッド Techniques for plating substrate devices using voltage-switchable dielectric materials and light assistance
US20120119168A9 (en) * 2006-11-21 2012-05-17 Robert Fleming Voltage switchable dielectric materials with low band gap polymer binder or composite
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
WO2010033635A1 (en) * 2008-09-17 2010-03-25 Shocking Technologies, Inc. Voltage switchable dielectric material containing boron compound
US9226391B2 (en) * 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) * 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8968606B2 (en) * 2009-03-26 2015-03-03 Littelfuse, Inc. Components having voltage switchable dielectric materials
US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components

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Publication number Priority date Publication date Assignee Title
US20060061925A1 (en) * 2004-09-17 2006-03-23 Shrier Karen P Devices and systems for electrostatic discharge suppression
US20060152334A1 (en) * 2005-01-10 2006-07-13 Nathaniel Maercklein Electrostatic discharge protection for embedded components
EP1990834A2 (en) * 2007-05-10 2008-11-12 Texas Instruments France Local Integration of Non-Linear Sheet in Integrated Circuit Packages for ESD/EOS Protection
US20110211289A1 (en) * 2010-02-26 2011-09-01 Lex Kosowsky Embedded protection against spurious electrical events

Non-Patent Citations (1)

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Title
See also references of WO2013044096A2 *

Also Published As

Publication number Publication date
JP6860718B2 (en) 2021-04-21
CN103999217A (en) 2014-08-20
JP2017152711A (en) 2017-08-31
CN103999217B (en) 2017-06-06
TW201330710A (en) 2013-07-16
KR101923760B1 (en) 2018-11-29
WO2013044096A3 (en) 2013-07-04
KR20140110838A (en) 2014-09-17
TWI473542B (en) 2015-02-11
JP2020080419A (en) 2020-05-28
EP2758992A2 (en) 2014-07-30
JP2014535157A (en) 2014-12-25
WO2013044096A2 (en) 2013-03-28

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Owner name: LITTELFUSE, INC.

RIN1 Information on inventor provided before grant (corrected)

Inventor name: GLICKMAN, MICHAEL

Inventor name: VASQUEZ, DANIEL

Inventor name: GRAYDON, BHRET

Inventor name: FLEMING, ROBERT

Inventor name: WU, JUNJUN

DAX Request for extension of the european patent (deleted)
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Effective date: 20150714

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