EP2763812A4 - Verfahren und vorrichtung zur optimalen lasermarkierung von artikeln - Google Patents

Verfahren und vorrichtung zur optimalen lasermarkierung von artikeln

Info

Publication number: EP2763812A4
Authority: EP; European Patent Office
Prior art keywords: laser marking; marking articles; optimally; optimally laser; articles
Prior art date: 2011-10-03
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP11873589.3A

Other languages

English (en)

French (fr)

Other versions

EP2763812A1 (de

Inventor

Jeffrey Howerton

Robert Reichenbach

Mehmet Alpay

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Electro Scientific Industries Inc

Original Assignee

Electro Scientific Industries Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2011-10-03

Filing date

2011-10-03

Publication date

2016-04-20

2011-10-03 Application filed by Electro Scientific Industries Inc filed Critical Electro Scientific Industries Inc

2014-08-13 Publication of EP2763812A1 publication Critical patent/EP2763812A1/de

2016-04-20 Publication of EP2763812A4 publication Critical patent/EP2763812A4/de

Status Withdrawn legal-status Critical Current

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/034—Observing the temperature of the workpiece
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/24—Ablative recording, e.g. by burning marks; Spark recording
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles ; Surface treated articles
- B23K2101/35—Surface treated articles

Landscapes

Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Mechanical Engineering (AREA)
Plasma & Fusion (AREA)
Laser Beam Processing (AREA)
Thermal Transfer Or Thermal Recording In General (AREA)

EP11873589.3A 2011-10-03 2011-10-03 Verfahren und vorrichtung zur optimalen lasermarkierung von artikeln Withdrawn EP2763812A4 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/US2011/054638 WO2013052034A1 (en)	2011-10-03	2011-10-03	Method and apparatus for optimally laser marking articles

Publications (2)

Publication Number	Publication Date
EP2763812A1 EP2763812A1 (de)	2014-08-13
EP2763812A4 true EP2763812A4 (de)	2016-04-20

Family

ID=48044015

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP11873589.3A Withdrawn EP2763812A4 (de)	2011-10-03	2011-10-03	Verfahren und vorrichtung zur optimalen lasermarkierung von artikeln

Country Status (4)

Country	Link
EP (1)	EP2763812A4 (de)
JP (1)	JP5826387B2 (de)
CN (1)	CN103534057B (de)
WO (1)	WO2013052034A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5957087B2 (ja) *	2011-11-17	2016-07-27	エレクトロサイエンティフィックインダストリーズインコーポレーテッド	対象物に最適にレーザマーキングを施すための方法及び装置
EP2922657B1 (de) *	2012-11-24	2020-03-04	SPI Lasers UK Limited	Verfahren zur lasermarkierung einer metalloberfläche mit einer gewünschten farbe
EP2845661A1 (de) *	2013-09-10	2015-03-11	Bystronic Laser AG	Verfahren zum Biegen eines Werkstückes
JP6024707B2 (ja)	2014-05-22	2016-11-16	トヨタ自動車株式会社	レーザ溶接方法
CN107160881B (zh) *	2017-05-19	2019-01-22	哈焊所华通（常州）焊业股份有限公司	加工试样的钢印标记方法
FR3087367B1 (fr) *	2018-10-22	2020-11-06	Tiama	Procede et installation pour le marquage de recipients chauds en verre
JP7310498B2 (ja) *	2019-09-27	2023-07-19	ブラザー工業株式会社	レーザ加工システム及び制御プログラム
US20220048132A1 (en) *	2020-08-13	2022-02-17	Standex International Corporation	Pattern editor for generating functional textures
CN114985950A (zh) *	2022-06-24	2022-09-02	广东镭泰激光智能装备有限公司	一种金属激光彩色打标系统及打标方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3739862A1 (de) *	1987-11-25	1989-06-08	Bosch Gmbh Robert	Werkstueckbearbeitungsvorrichtung
US20060169677A1 (en) *	2005-02-03	2006-08-03	Laserfacturing Inc.	Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser
US20110193928A1 (en) *	2010-02-11	2011-08-11	Electro Scientific Industries, Inc.	Method and apparatus for reliably laser marking articles

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07155970A (ja) *	1993-12-08	1995-06-20	Toshiba Corp	レーザ描画方法
US5539175A (en) *	1994-03-21	1996-07-23	Litel Instruments	Apparatus and process for optically ablated openings having designed profile
US6518540B1 (en) *	1998-06-16	2003-02-11	Data Storage Institute	Method and apparatus for providing ablation-free laser marking on hard disk media
JP4664718B2 (ja) *	2005-03-31	2011-04-06	パナソニック電工Ｓｕｎｘ株式会社	レーザ加工装置及びその出力制御方法
TWI310326B (en) *	2005-10-11	2009-06-01	Gsi Group Corp	Optical metrological scale and laser-based manufacturing method therefor
US7605343B2 (en) *	2006-05-24	2009-10-20	Electro Scientific Industries, Inc.	Micromachining with short-pulsed, solid-state UV laser
DE102008028376A1 (de) *	2008-06-13	2009-12-17	Krones Ag	Vorrichtung und Verfahren zum Kennzeichnen von Kunststoffbehältnissen
DE102008056136A1 (de) *	2008-10-29	2010-05-20	3D-Micromac Ag	Lasermarkierverfahren, Lasermarkiervorrichtung und Optikelement
JP2010111071A (ja) *	2008-11-07	2010-05-20	National Printing Bureau	階調模様作製方法及び階調模様を有する用紙

2011
- 2011-10-03 CN CN201180070070.9A patent/CN103534057B/zh not_active Expired - Fee Related
- 2011-10-03 WO PCT/US2011/054638 patent/WO2013052034A1/en not_active Ceased
- 2011-10-03 JP JP2014521604A patent/JP5826387B2/ja not_active Expired - Fee Related
- 2011-10-03 EP EP11873589.3A patent/EP2763812A4/de not_active Withdrawn

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE3739862A1 (de) *	1987-11-25	1989-06-08	Bosch Gmbh Robert	Werkstueckbearbeitungsvorrichtung
US20060169677A1 (en) *	2005-02-03	2006-08-03	Laserfacturing Inc.	Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser
US20110193928A1 (en) *	2010-02-11	2011-08-11	Electro Scientific Industries, Inc.	Method and apparatus for reliably laser marking articles

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013052034A1 *

Also Published As

Publication number	Publication date
JP2014523813A (ja)	2014-09-18
CN103534057B (zh)	2016-03-30
WO2013052034A1 (en)	2013-04-11
JP5826387B2 (ja)	2015-12-02
CN103534057A (zh)	2014-01-22
EP2763812A1 (de)	2014-08-13

Legal Events

Date	Code	Title	Description
2014-07-11	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2014-08-13	17P	Request for examination filed	Effective date: 20130830
2014-08-13	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2015-01-07	DAX	Request for extension of the european patent (deleted)
2016-04-20	RA4	Supplementary search report drawn up and despatched (corrected)	Effective date: 20160323
2016-04-20	RIC1	Information provided on ipc code assigned before grant	Ipc: B23K 26/36 20140101ALI20160317BHEP Ipc: B23K 26/18 20060101AFI20160317BHEP Ipc: B41M 5/24 20060101ALI20160317BHEP
2017-03-22	17Q	First examination report despatched	Effective date: 20170215
2018-03-07	RIC1	Information provided on ipc code assigned before grant	Ipc: B23K 101/34 20060101ALI20180131BHEP Ipc: B23K 26/40 20140101ALI20180131BHEP Ipc: B41M 5/24 20060101ALI20180131BHEP Ipc: B23K 26/361 20140101ALI20180131BHEP Ipc: B23K 26/03 20060101AFI20180131BHEP
2018-03-12	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2018-04-11	INTG	Intention to grant announced	Effective date: 20180313
2018-12-14	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2019-01-16	18D	Application deemed to be withdrawn	Effective date: 20180724

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