EP2792812A2 - Gabarit de perçage - Google Patents

Gabarit de perçage Download PDF

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Publication number
EP2792812A2
EP2792812A2 EP20130167817 EP13167817A EP2792812A2 EP 2792812 A2 EP2792812 A2 EP 2792812A2 EP 20130167817 EP20130167817 EP 20130167817 EP 13167817 A EP13167817 A EP 13167817A EP 2792812 A2 EP2792812 A2 EP 2792812A2
Authority
EP
European Patent Office
Prior art keywords
hole
hole template
template
tile adhesive
laid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20130167817
Other languages
German (de)
English (en)
Other versions
EP2792812A3 (fr
Inventor
Alfred Boor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boor Tim
Boor Tina
Original Assignee
Boor Tim
Boor Tina
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boor Tim, Boor Tina filed Critical Boor Tim
Publication of EP2792812A2 publication Critical patent/EP2792812A2/fr
Publication of EP2792812A3 publication Critical patent/EP2792812A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F21/00—Implements for finishing work on buildings
    • E04F21/02—Implements for finishing work on buildings for applying plasticised masses to surfaces, e.g. plastering walls
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C17/00—Hand tools or apparatus using hand held tools, for applying liquids or other fluent materials to, for spreading applied liquids or other fluent materials on, or for partially removing applied liquids or other fluent materials from, surfaces
    • B05C17/06—Stencils
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F21/00—Implements for finishing work on buildings
    • E04F21/02—Implements for finishing work on buildings for applying plasticised masses to surfaces, e.g. plastering walls
    • E04F21/04—Patterns or templates; Jointing rulers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated

Definitions

  • the invention relates to a hole template for coating of substrate with tile adhesive, which holds a distance to the ground via spacers.
  • Punch templates of the type mentioned are, for example, from the British patent application GB 2 174 447 A1 known.
  • This is a tiling aid, which consists of a box provided with passages, in which the plate to be laid is placed and which has a holding device.
  • the exposed connection side of the plate is coated with an adjustable amount of tile adhesive.
  • the tiler is brought over the holding device in the mounting position. To separate the plate from the tiler aid, the user grabs his fingers through the apertures, pushing the plate out.
  • Punch templates of the type mentioned have the advantage that they allow a uniform coating of tile adhesive on the connection side of the plates to be laid. This minimizes voids between the laid panels and the substrate. Such cavities lead, for example, tiles that get them in the region of the cavity cracks.
  • walking creates a hollow sound. For example, if a punctual load acts on the tile in the area of a cavity, the force can not be dissipated directly. Characteristic for ceramics brittle material behavior causes the tile breaks in at this point. Likewise, voids can cause the laid plate peels off due to lack of adhesion from the ground.
  • the above-mentioned hole templates have the disadvantage that they do not allow a simple and clean positioning of the plate to be laid without the tile adhesive dripping down and dirtying the panels laid around.
  • the invention proposes, starting from a hole template of the type mentioned above, that the hole template has a hole pattern with a hole proportion between 10% and 30% of the hole template area.
  • the hole template according to the invention can be used for laying tiles, but also other coverings, such as natural stone slabs and glass.
  • Tile adhesive according to the invention is any adhesive that can be used by laying floor and wall coverings.
  • Such a hole template has the contrary to the prior art principle, not the plate to be laid, but to coat the substrate with tile adhesive.
  • the plate to be laid comes into contact with the adhesive bed only when it is in its mounting position.
  • the substrate is prepared with a 2 to 3 mm thick contact layer.
  • the hole template is positioned on its spacer elements on the underlying surface.
  • tile adhesive is applied through the hole template, which is distributed through the hole pattern on the surface to be covered.
  • After lifting the hole template remains a the hole pattern corresponding formation of tile adhesive truncated cones.
  • the hole proportion between 10% and 30% of the hole template surface causes the tile adhesive when placing and pressing the plate to be laid evenly distributed on the connecting side of the plate to be laid and little cavities arise.
  • the exact location of the hole depends on the one hand on the desired distance between the plate to be laid from the ground, as well as the nature of the tile adhesive. While the usual coverage of the joint surface of the laid panels is 60% to 70%, the hole template according to the teachings of the invention, a coverage of up to 97%. A cavitation can thus be almost completely avoided. This makes a hole template according to the invention particularly suitable for large-format plates.
  • a particularly preferred embodiment of the invention provides that the hole portion of the hole template surface is about 20%. It has been found that this hole fraction offers the best coverage for most marketable tile adhesives.
  • the optimal distance of the hole template from the substrate is about 20 to 25 mm.
  • the breadboard is expediently a regular breadboard. This prevents a region from receiving too low a tile adhesive amount, which would lead to voids. Ideally, all the passages are the same distance from each other.
  • the hole diameter is between 30 mm and 50 mm, in particular about 40 mm.
  • the hole diameter is closely related to the regular spacing of the apertures of the hole pattern. Overall, these two factors in particular lead to a uniform coverage with tile adhesive between the substrate and the laid plate.
  • the hole template has apertures arranged at the corners and / or along the edges, the area of which is greater than the area of the inner apertures of the hole template.
  • tile adhesive is often poor at corners and along edges Distribution. The enlargement of the holes improves the distribution of the tile adhesive at these critical areas.
  • the hole template has circumferential and orthogonal to the hole template edges.
  • the edges should have a height of about 20 mm, according to the desired adhesive layer ceiling.
  • these also have a very positive effect on the rigidity of the hole template. This leads to a much stiffer and thus more durable hole template. At the same time they cause an accumulation of tile adhesive along the edges.
  • An alternative embodiment of the hole template provides that the distance of the hole template is adjusted to the ground via arranged on the surface spacer elements. This can be achieved in particular by sliding, plug-in or screwing devices and offers a cost-effective way to adapt the hole template to the appropriate requirements for the distance.
  • a preferred variant provides to equip the hole template with a circumferential edge and at least one centrally arranged spacer element.
  • a particularly high-quality embodiment of the hole template is made of metal.
  • plastic allows a particularly favorable embodiment. Both materials are chemically resistant to the tile adhesive.
  • metal has the advantage that it can be reused almost wear-free. Plastic can lead to embrittlement or cracks after a long time.
  • the hole template is equipped with a holding device.
  • This holding device makes it possible to lift the hole template orthogonally to the ground, thus precluding shearing of the hole template and thus disrupting the alignment of the tile adhesive cone. moreover In general, a fixture greatly improves the handling of the hole template.
  • the hole template In order to ensure an ideal distribution of the tile adhesive on the connection side of the plate to be laid, the hole template should have a distance of 10 mm to 30 mm, preferably 20 mm from the ground. Consequently, the resulting tile adhesive cones also have a height preferably of 20 mm. If a plate to be laid is placed perpendicular to the axis of a tile adhesive cone, the tile adhesive is distributed radially and has sufficient mass to ensure a largely complete coverage of the bonding surface. Depending on the hole diameter, the distance between the hole template and the substrate must be set.
  • the hole templates according to the invention have a size which is matched to the respective tile format.
  • sizes of 0.40 x 0.40 m, 0.40 x 0.60 m, 0.50 x 1.00 m or 0.60 x 1.20 m are readily possible.
  • the tiler distinguishes even the best format.
  • FIG. 1 shows a hole template according to the teaching of the invention.
  • orthogonal edges 4 are formed as circumferential spacer elements to the hole template.
  • openings 5 whose area is larger than the surface of the inner holes 6 of the hole template 2.
  • the holding device 7 can be the hole template safely take off.
  • a spacer element 1 which has the same height above the template surface 2 as the edges 4. The distance between the template and the substrate is set to 20 mm.
  • the hole template is placed on the prepared and laid surface.
  • the spacer element 1 and the edges 4 creates a free space which is filled through the passages 6 of the perforated grid 2 and through the perforations 5 at the corners 3 and the edges 4 with tile adhesive.
  • Under the openings 5 and the passages 6 form tile adhesive cone.
  • the hole template is lifted orthogonal to the ground and leaves only the evenly distributed tile adhesive cone on the ground.
  • the prepared plate is now placed on this tile adhesive cone structure and pressed. Between the plate and the substrate remain virtually no voids.
  • the hole template shown has a size of 0.60 x 1.20 m and can be used for both smaller and larger formats.

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Finishing Walls (AREA)
EP20130167817 2013-04-19 2013-05-15 Gabarit de perçage Withdrawn EP2792812A3 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102013006736 2013-04-19

Publications (2)

Publication Number Publication Date
EP2792812A2 true EP2792812A2 (fr) 2014-10-22
EP2792812A3 EP2792812A3 (fr) 2014-11-26

Family

ID=48444162

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20130167817 Withdrawn EP2792812A3 (fr) 2013-04-19 2013-05-15 Gabarit de perçage

Country Status (1)

Country Link
EP (1) EP2792812A3 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116771135A (zh) * 2023-06-19 2023-09-19 中国建筑第二工程局有限公司 一种墙体保温材料的安装设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2174447A (en) 1985-04-04 1986-11-05 Aldo Rabiotti Tiling aid

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841261A (en) * 1973-01-22 1974-10-15 Gen Motors Corp Self-aligning etch-out spray mask
JPS5524838A (en) * 1978-08-05 1980-02-22 Osaka Fuji Kogyo Kk Method of decorating surface of metallic tile
JP2000248719A (ja) * 1999-02-26 2000-09-12 Nordson Kk 連結タイルの製造方法
DE50305723D1 (de) * 2002-03-22 2007-01-04 Walter Gutjahr Verfahren zur Erstellung von drainierten Plattenbelägen mit geringer Aufbauhöhe auf Balkon- oder Terrassenflächen sowie eine solche Plattenbelaganordnung

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2174447A (en) 1985-04-04 1986-11-05 Aldo Rabiotti Tiling aid

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116771135A (zh) * 2023-06-19 2023-09-19 中国建筑第二工程局有限公司 一种墙体保温材料的安装设备

Also Published As

Publication number Publication date
EP2792812A3 (fr) 2014-11-26

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