EP2800201A1 - Hochfrequenzfilter - Google Patents

Hochfrequenzfilter Download PDF

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Publication number
EP2800201A1
EP2800201A1 EP11879066.6A EP11879066A EP2800201A1 EP 2800201 A1 EP2800201 A1 EP 2800201A1 EP 11879066 A EP11879066 A EP 11879066A EP 2800201 A1 EP2800201 A1 EP 2800201A1
Authority
EP
European Patent Office
Prior art keywords
intracavity
conductor layer
load
source
metal conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11879066.6A
Other languages
English (en)
French (fr)
Other versions
EP2800201A4 (de
EP2800201B1 (de
Inventor
Dantao CAI
Peiyong CAO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of EP2800201A1 publication Critical patent/EP2800201A1/de
Publication of EP2800201A4 publication Critical patent/EP2800201A4/de
Application granted granted Critical
Publication of EP2800201B1 publication Critical patent/EP2800201B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2053—Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/04—Coaxial resonators

Definitions

  • Embodiments of the present invention relate to the communication field, and in particular, to a high-frequency filter.
  • a filter is widely used in the modem communication field, and a basic function is: making useful signals pass on a signal link to the greatest extent, and suppressing harmful signals to the greatest extent.
  • existing high-frequency filters include micro-strip filters, strip line filters, and coaxial resonant cavity filters.
  • a basic structural feature of a micro-strip filter is a base made of a dielectric material, where a metal conductor is laid on one surface of the base, and there is a grounded metal conductor layer at an opposite position on the other surface.
  • a basic structural feature of a strip line filter is that a metal conductor is suspended or laid on a support made of a dielectric material, and metal conductors at corresponding positions on the top and bottom of the conductor form an outer conductor.
  • a metal conductor is placed in an enclosed metal cavity of the filter, and both ends of the conductor are coupled with the metal cavity, where coupling strength and/or an electrical length of the metal conductor determines a resonant frequency.
  • the coaxial resonant cavity filter provided in the prior art has a main feature that, the coaxial resonant cavity filter has many tuning structures.
  • each coaxial resonant cavity has a screw for adjusting a frequency, and there is also a screw for adjusting coupling between one coaxial resonant cavity and another coaxial resonant cavity. Since these screws are associated with each other, the coaxial resonant cavity filter provided in the prior art cannot ensure consistency of indexes such as filter standing wave, phase, and group delay.
  • Embodiments of the present invention provide a high-frequency filter, in order to ensure consistency of indexes of the filter.
  • the embodiments of the present invention provide a high-frequency filter.
  • the high-frequency filter includes: at least one coaxial resonant cavity, at least one printed circuit board arranged at the coaxial resonant cavity, and at least one intracavity conductor on a side of the printed circuit board.
  • a metal conductor layer for performing signal connection for a source and a load is laid on a surface of the printed circuit board, and a grounded metal conductor layer is laid on the other surface opposite to the surface laid with the metal conductor layer.
  • One end of the intracavity conductor and the coaxial resonant cavity are both grounded.
  • the intracavity conductor and the metal conductor layer for performing signal connection for the source and the load are coupled.
  • each coaxial resonant cavity of the high-frequency filter is provided with at least one printed circuit board and at least one intracavity conductor on a side of the printed circuit board. Since the printed circuit board has high machining precision, and can ensure batch consistency of indexes such as filter standing wave, phase, and group delay, a volume of the filter can be reduced in comparison to an air strip line because of a relatively high dielectric constant of the printed circuit board.
  • a high-frequency filter provided in the embodiments of the present invention includes at least one coaxial resonant cavity, at least one printed circuit board (Printed Circuit Board, PCB) arranged at the coaxial resonant cavity, and at least one intracavity conductor on a side of the printed circuit board.
  • One end of the intracavity conductor and the coaxial resonant cavity are both grounded.
  • a metal conductor layer for performing signal connection for a source and a load is laid on a surface of the printed circuit board, and a grounded metal conductor layer is laid on the other surface opposite to the surface laid with the metal conductor layer for performing signal connection for the source and the load. Further, the intracavity conductor and the metal conductor layer for performing signal connection for the source and the load are coupled.
  • FIG. 1a is a schematic structural diagram of a high-frequency filter provided in Embodiment 1 of the present invention.
  • the high-frequency filter shown in FIG. 1a includes at least one grounded coaxial resonant cavity 101, at least one U-shaped coupling piece 103, at least one columnar intracavity conductor 104, and at least one printed circuit board 102 covering a cavity opening of the coaxial resonant cavity 101.
  • FIG. 1b shows a schematic diagram of a structure and a relative position of each part of the coaxial resonant cavity of the high-frequency filter shown in FIG. 1a .
  • a metal conductor layer 105 for performing signal connection for a source and a load is laid on a surface of the printed circuit board 102, and a grounded metal conductor layer is laid on the other surface opposite to the surface laid with the metal conductor layer 105 for performing signal connection for the source and the load.
  • the grounded metal conductor layer may be laid on the whole surface, or the grounded metal conductor layer is at least laid on a portion contacting with the coaxial resonant cavity 101.
  • the metal conductor layer 105 for performing signal connection for the source and the load may further has a function of coupling a signal connected by the metal conductor layer 105 to the columnar intracavity conductor 104.
  • a screw 106 arranged on the columnar intracavity conductor 104 is configured to adjust a frequency.
  • the columnar intracavity conductor 104 may be fixed on a cavity wall of the coaxial resonant cavity 101, and one end of the columnar intracavity conductor 104 contacts with a side wall of the coaxial resonant cavity 101 to implement grounding.
  • An axial direction or a center line direction of the columnar intracavity conductor 104 is parallel to the surface of the printed circuit board 102 laid with the metal conductor layer 105 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer.
  • the columnar intracavity conductor 104 is a cylindrical intracavity conductor
  • the axial direction of the columnar intracavity conductor 104 is parallel to the surface of the printed circuit board 102 laid with the metal conductor layer 105 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer
  • the columnar intracavity conductor 104 is a prismatic intracavity conductor
  • the center line direction of the columnar intracavity conductor 104 is parallel to the surface of the printed circuit board 102 laid with the metal conductor layer 105 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer.
  • One end of the U-shaped coupling piece 103 is connected to the metal conductor layer 105, and the other end is connected to the grounded metal conductor layer.
  • the function of the U-shaped coupling piece 103 is similar to that of an inductor.
  • a magnetic field generated by the U-shaped coupling piece 103 excites a magnetic field of the coaxial resonant cavity 101.
  • the columnar intracavity conductor 104 is coupled with the metal conductor layer 105 for performing signal connection for the source and the load via the magnetic field in the coaxial resonant cavity 101 excited by the U-shaped coupling piece 103, and this type of coupling is also called inductance coupling.
  • a high-frequency filter provided in Embodiment 2 of the present invention includes at least one grounded coaxial resonant cavity, at least one printed circuit board covering a cavity opening of the coaxial resonant cavity, and at least one U-shaped intracavity conductor.
  • FIG. 2a shows a schematic diagram of a structure and a relative position of each part in a coaxial resonant cavity 201 of the high-frequency filter provided in Embodiment 2.
  • a metal conductor layer 204 for performing signal connection for a source and a load is laid on a surface of the printed circuit board 202, and a grounded metal conductor layer is laid on the other surface opposite to the surface laid with the metal conductor layer 204 for performing signal connection for the source and the load.
  • the grounded metal conductor layer may be laid on the whole surface, or the grounded metal conductor layer is at least laid on a portion contacting with the coaxial resonant cavity 201.
  • the metal conductor layer 204 for performing signal connection for the source and the load may further has a function of coupling a signal connected by the metal conductor layer 204 to a U-shaped intracavity conductor 203.
  • the U-shaped intracavity conductor 203 may be curved prismatic or curved cylindrical.
  • One end of the U-shaped intracavity conductor 203 contacts with the grounded metal conductor layer to implement grounding, and the other end is embedded in the printed circuit board 202, and does not contact with the metal conductor layer 204 for performing signal connection for the source and the load.
  • a screw 205 arranged on the U-shaped intracavity conductor 203 is configured to adjust a frequency.
  • the printed circuit board may further be arranged inside the coaxial resonant cavity 201, a cavity opening of the coaxial resonant cavity 201 may be shielded by using a shield plate, and the U-shaped intracavity conductor 203 may be curved cylindrical, as shown in FIG. 2b .
  • One end of the U-shaped intracavity conductor 203 contacts with the grounded metal conductor layer laid on the printed circuit board 202, and the other end is embedded in the printed circuit board 202, but does not contact with the metal conductor layer 204 for performing signal connection for the source and the load.
  • a horizontal portion of the U-shaped intracavity conductor 203 is parallel to the surface of the printed circuit board 202 laid with the metal conductor layer 204 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer.
  • the U-shaped intracavity conductor 203 may be coupled with the metal conductor layer 204 for performing signal connection for the source and the load by using the printed circuit board 202 as a medium, and this type of coupling is capacitance coupling.
  • the structure and the relative position of each part in the coaxial resonant cavity may further be that: one end of the U-shaped intracavity conductor is connected to the grounded metal conductor layer, and the other end is embedded in the printed circuit board, and contacts with the metal conductor layer for performing signal connection for the source and the load.
  • the horizontal portion of the U-shaped intracavity conductor is parallel to the surface of the printed circuit board laid with the metal conductor layer for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer.
  • a high-frequency filter provided in Embodiment 3 of the present invention includes at least one grounded coaxial resonant cavity, at least one L-shaped intracavity conductor, and at least one printed circuit board covering a cavity opening of the coaxial resonant cavity.
  • FIG. 3 shows a schematic diagram of a structure and a relative position of each part in a coaxial resonant cavity 301 of the high-frequency filter provided in Embodiment 3.
  • a metal conductor layer 304 for performing signal connection for a source and a load is laid on a surface of a printed circuit board 302, and a grounded metal conductor layer is laid on the other surface opposite to the surface of the printed circuit board 302 laid with the metal conductor layer 304 for performing signal connection for the source and the load.
  • the metal conductor layer 304 may further has a function of coupling a signal connected by the metal conductor layer 304 to an L-shaped intracavity conductor 303.
  • the L-shaped intracavity conductor 303 may be curved prismatic or curved cylindrical, and a screw 305 on it is configured to adjust a frequency.
  • One end of a vertical portion of the L-shaped intracavity conductor 303 is embedded in the printed circuit board 302, but does not contact with the metal conductor layer 304 for performing signal connection for the source and the load.
  • the grounded metal conductor layer may be laid on the whole surface, or the grounded metal conductor layer is at least laid on a portion contacting with the coaxial resonant cavity 301. In this way, the coaxial resonant cavity 301 is also grounded.
  • One end of a horizontal portion of the L-shaped intracavity conductor 303 contacts with a side wall of the coaxial resonant cavity 301. Since the coaxial resonant cavity 301 is grounded, the end of the horizontal portion of the L-shaped intracavity conductor 303 is equivalent to being grounded.
  • the horizontal portion of the L-shaped intracavity conductor 303 is parallel to the surface of the printed circuit board 302 laid with the metal conductor layer 304 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer.
  • the L-shaped intracavity conductor 303 may be coupled with the metal conductor layer 304 for performing signal connection for the source and the load by using the printed circuit board 302 as a medium, and this type of coupling is capacitance coupling.
  • the structure and the relative position of each part in the coaxial resonant cavity may further be that: the end of the vertical portion of the L-shaped intracavity conductor is embedded in the printed circuit board, and contacts with the metal conductor layer for performing signal connection for the source and the load.
  • the grounded metal conductor layer may be laid on the whole surface, or the grounded metal conductor layer is laid on the portion contacting with the coaxial resonant cavity. In this way, the coaxial resonant cavity is also grounded.
  • the end portion of the horizontal portion of the L-shaped intracavity conductor contacts with the side wall of the coaxial resonant cavity. Since the coaxial resonant cavity is grounded, the end portion of the horizontal portion of the L-shaped intracavity conductor is equivalent to be grounded.
  • the horizontal portion of the L-shaped intracavity conductor is parallel to the surface of the printed circuit board laid with the metal conductor layer for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer.
  • a high-frequency filter provided in Embodiment 4 of the present invention includes at least one grounded coaxial resonant cavity, at least one columnar intracavity conductor, at least one metal wire, and at least one printed circuit board covering a cavity opening of the coaxial resonant cavity.
  • FIG. 4 shows a schematic diagram of a structure and a relative position of each part in a coaxial resonant cavity 401 of the high-frequency filter provided in Embodiment 4.
  • a columnar intracavity conductor 402 may be a cylindrical intracavity conductor or a prismatic intracavity conductor.
  • a metal conductor layer 404 for performing signal connection for a source and a load is laid on a surface of a printed circuit board 403, and a grounded metal conductor layer is laid on the other surface opposite to the surface laid with the metal conductor layer 404 for performing signal connection for the source and the load, or the grounded metal conductor layer is at least laid on a portion contacting with the coaxial resonant cavity 401.
  • the coaxial resonant cavity 401 is also grounded.
  • the metal conductor layer 404 for performing signal connection for the source and the load may further has a function of coupling a signal connected by the metal conductor layer 404 to the columnar intracavity conductor 402.
  • the columnar intracavity conductor 402 may be fixed in the coaxial resonant cavity 401, and one end of the columnar intracavity conductor 402 contacts with a side wall of the coaxial resonant cavity 401 to implement grounding.
  • a screw 407 arranged on the columnar intracavity conductor 402 is configured to adjust a frequency.
  • the relative relation between the printed circuit board 403 and the columnar intracavity conductor 402 may be that: the surface of the printed circuit board 403 laid with the metal conductor layer 404 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer is parallel to an axial direction or a center line direction of the columnar intracavity conductor 402.
  • the columnar intracavity conductor 402 is a cylindrical intracavity conductor
  • the surface of the printed circuit board 403 laid with the metal conductor layer 404 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer is parallel to the axial direction of the columnar intracavity conductor 402; and if the columnar intracavity conductor 402 is a prismatic intracavity conductor, the surface of the printed circuit board 403 laid with the metal conductor layer 404 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer is parallel to the center line direction of the columnar intracavity conductor 402.
  • a high-frequency filter provided in Embodiment 5 of the present invention includes at least one grounded coaxial resonant cavity, at least one columnar intracavity conductor, and at least one printed circuit board arranged inside the coaxial resonant cavity.
  • FIG. 5 shows a schematic diagram of a structure and a relative position of each part in a coaxial resonant cavity 401 of the high-frequency filter provided in Embodiment 5.
  • a metal conductor layer 504 for performing signal connection for a source and a load is laid on a surface of a printed circuit board 503, and a grounded metal conductor layer is laid on the surface opposite to the surface laid with the metal conductor layer 504 for performing signal connection for the source and the load.
  • the grounded metal conductor layer contacts with a side wall of the coaxial resonant cavity.
  • a columnar intracavity conductor 502 may be a cylindrical intracavity conductor or a prismatic intracavity conductor, and one end of it contacts with the coaxial resonant cavity 401.
  • the metal conductor layer 504 for performing signal connection for the source and the load may further has a function of coupling a signal connected by the metal conductor layer 504 to the columnar intracavity conductor 502.
  • a screw 505 arranged on the columnar intracavity conductor 502 is configured to adjust a frequency.
  • the relative relation between the printed circuit board 503 and the columnar intracavity conductor 502 may be that: the surface of the printed circuit board 503 laid with the metal conductor layer 504 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer 505 is perpendicular to an axial direction or a center line (if the columnar intracavity conductor 502 is a prismatic intracavity conductor) direction of the columnar intracavity conductor 502.
  • the surface of the printed circuit board 503 laid with the metal conductor layer 504 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer 505 is perpendicular to the axial direction of the columnar intracavity conductor 502; and if the columnar intracavity conductor 502 is a prismatic intracavity conductor, the surface of the printed circuit board 503 laid with the metal conductor layer 504 for performing signal connection for the source and the load or the surface laid with the grounded metal conductor layer 505 is perpendicular to the center line direction of the columnar intracavity conductor 502.
  • each coaxial resonant cavity of the high-frequency filter is provided with at least one printed circuit board and at least one intracavity conductor on a side of the printed circuit board. Because the plate making craft can ensure dimensional precision of the metal conductor layer for performing signal connection for the source and the load within plus or minus 1 mil (milli-inch), a dimensional tolerance of the printed circuit board and a fluctuation range of the dielectric constant can be effectively controlled, and there is no assembly tolerance.
  • This high consistency of the printed circuit board ensures that consistency of indexes of components of the printed circuit board structure is higher than that of components assembled through pure machining.
  • the high consistency of the printed circuit board ensures batch consistency of indexes such as filter standing wave, phase, and group delay, and a volume of the filter can be reduced in comparison to an air strip line because of a relatively high dielectric constant of the printed circuit board.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
EP11879066.6A 2011-12-30 2011-12-30 Hochfrequenzfilter Active EP2800201B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/085003 WO2013097168A1 (zh) 2011-12-30 2011-12-30 一种高频滤波器

Publications (3)

Publication Number Publication Date
EP2800201A1 true EP2800201A1 (de) 2014-11-05
EP2800201A4 EP2800201A4 (de) 2015-04-22
EP2800201B1 EP2800201B1 (de) 2018-11-14

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ID=46995178

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11879066.6A Active EP2800201B1 (de) 2011-12-30 2011-12-30 Hochfrequenzfilter

Country Status (3)

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EP (1) EP2800201B1 (de)
CN (1) CN102742072B (de)
WO (1) WO2013097168A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016104608A1 (de) * 2016-03-14 2017-09-14 Kathrein-Werke Kg Koaxialfilter in Rahmenbauweise
EP3240100A1 (de) * 2016-04-28 2017-11-01 Alcatel Lucent Funkfrequenzfilter mit einer kammer und filtrierverfahren
US12040524B2 (en) 2021-03-30 2024-07-16 Nokia Solutions And Networks Oy Cavity filter element for a cavity filter

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110867634B (zh) * 2018-08-28 2022-06-24 罗森伯格技术有限公司 一种电磁混合耦合滤波器
CN109728388B (zh) * 2019-02-12 2023-12-05 华南理工大学 一种具有恒定绝对带宽的高选择性电调同轴滤波器
CN111584983B (zh) * 2020-06-09 2021-07-13 中国电子科技集团公司第十四研究所 一种多层结构的滤波耦合组件
CN117154409A (zh) * 2020-10-27 2023-12-01 华为技术有限公司 一种传输线组件、天线组件和移动终端

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US5004993A (en) * 1989-09-19 1991-04-02 The United States Of America As Represented By The Secretary Of The Navy Constricted split block waveguide low pass filter with printed circuit filter substrate
JP3379326B2 (ja) * 1996-02-20 2003-02-24 三菱電機株式会社 高周波フィルタ
FI106584B (fi) * 1997-02-07 2001-02-28 Filtronic Lk Oy Korkeataajuussuodatin
JP2001044704A (ja) * 1999-07-29 2001-02-16 Sony Corp 分布定数回路素子とその製造方法およびプリント配線板
US6919782B2 (en) * 2001-04-04 2005-07-19 Adc Telecommunications, Inc. Filter structure including circuit board
CH696098A5 (de) * 2002-12-11 2006-12-15 Thales Suisse Sa Abstimmbare Hochfrequenz-Filteranordnung sowie Verfahren zu ihrer Herstellung.
TWI301336B (en) * 2003-12-24 2008-09-21 Delta Electronics Inc High frequency filter
FI119402B (fi) * 2004-03-22 2008-10-31 Filtronic Comtek Oy Järjestely suodattimen lähtösignaalin jakamiseksi
US7592882B2 (en) * 2007-02-22 2009-09-22 John Mezzalingua Associates, Inc. Dual bandstop filter with enhanced upper passband response
EP2056394B1 (de) * 2007-10-31 2013-09-04 Alcatel Lucent Hohlraumresonator
CN101471477A (zh) * 2007-12-27 2009-07-01 奥雷通光通讯设备（上海）有限公司 一种用于无源腔体滤波器的耦合器

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016104608A1 (de) * 2016-03-14 2017-09-14 Kathrein-Werke Kg Koaxialfilter in Rahmenbauweise
US10347958B2 (en) 2016-03-14 2019-07-09 Kathrein Se Coaxial filter having a frame construction and a conductive separating web, where internal resonators can be galvanically connected to either the frame construction or the separating web
EP3240100A1 (de) * 2016-04-28 2017-11-01 Alcatel Lucent Funkfrequenzfilter mit einer kammer und filtrierverfahren
US12040524B2 (en) 2021-03-30 2024-07-16 Nokia Solutions And Networks Oy Cavity filter element for a cavity filter

Also Published As

Publication number Publication date
CN102742072A (zh) 2012-10-17
EP2800201A4 (de) 2015-04-22
CN102742072B (zh) 2014-07-30
EP2800201B1 (de) 2018-11-14
WO2013097168A1 (zh) 2013-07-04

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