EP2808735A4 - Corps à structure d'irrégularités fines, matériau de réserve thermo-réactif pour gravure chimique à sec, procédé de façonnage de moule et moule - Google Patents

Corps à structure d'irrégularités fines, matériau de réserve thermo-réactif pour gravure chimique à sec, procédé de façonnage de moule et moule

Info

Publication number
EP2808735A4
EP2808735A4 EP13741525.3A EP13741525A EP2808735A4 EP 2808735 A4 EP2808735 A4 EP 2808735A4 EP 13741525 A EP13741525 A EP 13741525A EP 2808735 A4 EP2808735 A4 EP 2808735A4
Authority
EP
European Patent Office
Prior art keywords
mold
thermo
chemical etching
shaping method
dry chemical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP13741525.3A
Other languages
German (de)
English (en)
Other versions
EP2808735A1 (fr
EP2808735B1 (fr
Inventor
Yoshimichi Mitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E Materials Corp filed Critical Asahi Kasei E Materials Corp
Publication of EP2808735A1 publication Critical patent/EP2808735A1/fr
Publication of EP2808735A4 publication Critical patent/EP2808735A4/fr
Application granted granted Critical
Publication of EP2808735B1 publication Critical patent/EP2808735B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0075—Manufacture of substrate-free structures
    • B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/04—Chromates
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2905/00—Use of metals, their alloys or their compounds, as mould material
    • B29K2905/06—Tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/757—Moulds, cores, dies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
    • H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Drying Of Semiconductors (AREA)
  • Micromachines (AREA)
EP13741525.3A 2012-01-27 2013-01-24 Produit à structure concave-convexe fines, procédé de façonnage d'un moule et usage d'un matériau de réserve thermo-réactif Not-in-force EP2808735B1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2012014820 2012-01-27
JP2012128275 2012-06-05
JP2012185252 2012-08-24
PCT/JP2013/051432 WO2013111812A1 (fr) 2012-01-27 2013-01-24 Corps à structure d'irrégularités fines, matériau de réserve thermo-réactif pour gravure chimique à sec, procédé de façonnage de moule et moule

Publications (3)

Publication Number Publication Date
EP2808735A1 EP2808735A1 (fr) 2014-12-03
EP2808735A4 true EP2808735A4 (fr) 2015-07-01
EP2808735B1 EP2808735B1 (fr) 2017-03-22

Family

ID=48873524

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13741525.3A Not-in-force EP2808735B1 (fr) 2012-01-27 2013-01-24 Produit à structure concave-convexe fines, procédé de façonnage d'un moule et usage d'un matériau de réserve thermo-réactif

Country Status (7)

Country Link
US (3) US9623590B2 (fr)
EP (1) EP2808735B1 (fr)
JP (1) JP6105490B2 (fr)
KR (1) KR101614628B1 (fr)
CN (2) CN107255905A (fr)
TW (1) TWI511854B (fr)
WO (1) WO2013111812A1 (fr)

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JP6497849B2 (ja) * 2014-04-15 2019-04-10 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6396819B2 (ja) * 2015-02-03 2018-09-26 東京エレクトロン株式会社 プラズマ処理方法及びプラズマ処理装置
CN111580190B (zh) * 2015-11-24 2021-12-28 哈佛学院院长及董事 制造针对可见光谱波长的电介质超颖表面的原子层沉积处理
US11835680B2 (en) 2017-05-04 2023-12-05 President And Fellows Of Harvard College Meta-lens doublet for aberration correction
JP7461294B2 (ja) 2017-08-31 2024-04-03 メタレンズ，インコーポレイテッド 透過型メタサーフェスレンズ統合
KR102492733B1 (ko) 2017-09-29 2023-01-27 삼성디스플레이 주식회사 구리 플라즈마 식각 방법 및 디스플레이 패널 제조 방법
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EP4004608A4 (fr) 2019-07-26 2023-08-30 Metalenz, Inc. Systèmes d'imagerie à métasurfaces à ouverture et à métasurfaces à réfraction hybrides
EP3964356A1 (fr) * 2020-09-03 2022-03-09 Boegli-Gravures SA Procédé et système de fabrication d'un dispositif de gaufrage à l'aide d'un masque de gravure
CN114025496B (zh) * 2021-11-11 2023-11-07 江苏普诺威电子股份有限公司 Pcb等边三角形的制作方法
KR20240100340A (ko) * 2021-11-16 2024-07-01 제이에스알 가부시끼가이샤 반도체 기판의 제조 방법
CN120188073A (zh) 2022-03-31 2025-06-20 梅特兰兹股份有限公司 偏振分选超颖表面微透镜阵列设备
CN115372409B (zh) * 2022-08-22 2023-08-25 中南大学 同时测量相变材料固、液两相温变热导率的装置及方法
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US9701044B2 (en) 2017-07-11
TW201334937A (zh) 2013-09-01
US9597822B2 (en) 2017-03-21
EP2808735A1 (fr) 2014-12-03
US20150017275A1 (en) 2015-01-15
EP2808735B1 (fr) 2017-03-22
KR101614628B1 (ko) 2016-04-21
WO2013111812A1 (fr) 2013-08-01
KR20140047154A (ko) 2014-04-21
CN104067171A (zh) 2014-09-24
JP6105490B2 (ja) 2017-03-29
US9623590B2 (en) 2017-04-18
US20150183152A1 (en) 2015-07-02
TWI511854B (zh) 2015-12-11
JPWO2013111812A1 (ja) 2015-05-11
CN107255905A (zh) 2017-10-17

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