EP2810310A4 - Thermoelektrische vorrichtungen mit gesintertem bonden - Google Patents

Thermoelektrische vorrichtungen mit gesintertem bonden

Info

Publication number
EP2810310A4
EP2810310A4 EP13743614.3A EP13743614A EP2810310A4 EP 2810310 A4 EP2810310 A4 EP 2810310A4 EP 13743614 A EP13743614 A EP 13743614A EP 2810310 A4 EP2810310 A4 EP 2810310A4
Authority
EP
European Patent Office
Prior art keywords
thermoelectric devices
sintered bonding
sintered
bonding
thermoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13743614.3A
Other languages
English (en)
French (fr)
Other versions
EP2810310A1 (de
Inventor
Julian Kähler
Thomas Kruspe
Sebastian Jung
Andrej Stranz
Andreas Waag
Erwin Peiner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Baker Hughes Holdings LLC
Original Assignee
Baker Hughes Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/363,997 external-priority patent/US20120291454A1/en
Application filed by Baker Hughes Inc filed Critical Baker Hughes Inc
Publication of EP2810310A1 publication Critical patent/EP2810310A1/de
Publication of EP2810310A4 publication Critical patent/EP2810310A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/81—Structural details of the junction
    • H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/254—Diamond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
EP13743614.3A 2012-02-01 2013-01-25 Thermoelektrische vorrichtungen mit gesintertem bonden Withdrawn EP2810310A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/363,997 US20120291454A1 (en) 2011-05-20 2012-02-01 Thermoelectric Devices Using Sintered Bonding
PCT/US2013/023203 WO2013116107A1 (en) 2012-02-01 2013-01-25 Thermoelectric devices using sintered bonding

Publications (2)

Publication Number Publication Date
EP2810310A1 EP2810310A1 (de) 2014-12-10
EP2810310A4 true EP2810310A4 (de) 2016-01-20

Family

ID=48905721

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13743614.3A Withdrawn EP2810310A4 (de) 2012-02-01 2013-01-25 Thermoelektrische vorrichtungen mit gesintertem bonden

Country Status (2)

Country Link
EP (1) EP2810310A4 (de)
WO (1) WO2013116107A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220131062A1 (en) * 2020-10-28 2022-04-28 Lenovo (Singapore) Pte. Ltd. Solid-state thermoelectric
CN119973264B (zh) * 2025-02-25 2025-11-04 哈尔滨工业大学 一种基于纳米银纸实现低温、低压连接方钴矿与金属电极的方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0898310A2 (de) * 1997-08-19 1999-02-24 Sumitomo Electric Industries, Ltd. Halbleiter-Kühlkörper und seine Herstellung
US6270848B1 (en) * 1997-02-06 2001-08-07 Sumitomo Electric Industries, Ltd. Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same
US20070183920A1 (en) * 2005-02-14 2007-08-09 Guo-Quan Lu Nanoscale metal paste for interconnect and method of use
JP2009081252A (ja) * 2007-09-26 2009-04-16 Aruze Corp 熱電変換素子及びその電極形成方法
JP2009117792A (ja) * 2007-10-19 2009-05-28 Ube Ind Ltd 熱電変換モジュール及びその製造方法
WO2009150908A1 (ja) * 2008-06-13 2009-12-17 アルゼ株式会社 熱電変換素子及び熱電変換素子用導電性部材
CN102311714A (zh) * 2011-08-24 2012-01-11 浙江科创新材料科技有限公司 一种纳米银填充高导热导电胶及其制备方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5824561A (en) * 1994-05-23 1998-10-20 Seiko Instruments Inc. Thermoelectric device and a method of manufacturing thereof
WO2009008127A1 (ja) * 2007-07-09 2009-01-15 Kabushiki Kaisha Toshiba 熱電変換モジュールとそれを用いた熱交換器、熱電温度調節装置および熱電発電装置
JP4912991B2 (ja) * 2007-09-07 2012-04-11 住友化学株式会社 熱電変換素子の製造方法
JP5499317B2 (ja) * 2009-03-03 2014-05-21 学校法人東京理科大学 熱電変換素子及び熱電変換モジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6270848B1 (en) * 1997-02-06 2001-08-07 Sumitomo Electric Industries, Ltd. Heat sink material for use with semiconductor component and method for fabricating the same, and semiconductor package using the same
EP0898310A2 (de) * 1997-08-19 1999-02-24 Sumitomo Electric Industries, Ltd. Halbleiter-Kühlkörper und seine Herstellung
US20070183920A1 (en) * 2005-02-14 2007-08-09 Guo-Quan Lu Nanoscale metal paste for interconnect and method of use
JP2009081252A (ja) * 2007-09-26 2009-04-16 Aruze Corp 熱電変換素子及びその電極形成方法
JP2009117792A (ja) * 2007-10-19 2009-05-28 Ube Ind Ltd 熱電変換モジュール及びその製造方法
WO2009150908A1 (ja) * 2008-06-13 2009-12-17 アルゼ株式会社 熱電変換素子及び熱電変換素子用導電性部材
CN102311714A (zh) * 2011-08-24 2012-01-11 浙江科创新材料科技有限公司 一种纳米银填充高导热导电胶及其制备方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013116107A1 *

Also Published As

Publication number Publication date
EP2810310A1 (de) 2014-12-10
WO2013116107A1 (en) 2013-08-08

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RIN1 Information on inventor provided before grant (corrected)

Inventor name: PEINER, ERWIN

Inventor name: KRUSPE, THOMAS

Inventor name: WAAG, ANDREAS

Inventor name: KAEHLER, JULIAN

Inventor name: STRANZ, ANDREJ

Inventor name: JUNG, SEBASTIAN

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