EP2817562A1 - Appareil d'éclairage à del réfléchissant non éblouissant avec montage de dissipateur thermique - Google Patents
Appareil d'éclairage à del réfléchissant non éblouissant avec montage de dissipateur thermiqueInfo
- Publication number
- EP2817562A1 EP2817562A1 EP12869302.5A EP12869302A EP2817562A1 EP 2817562 A1 EP2817562 A1 EP 2817562A1 EP 12869302 A EP12869302 A EP 12869302A EP 2817562 A1 EP2817562 A1 EP 2817562A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- lighting apparatus
- reflector
- heat conducting
- heat
- main housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004020 conductor Substances 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
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- 230000003287 optical effect Effects 0.000 claims description 11
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- 229910052751 metal Inorganic materials 0.000 description 26
- 239000002184 metal Substances 0.000 description 26
- 238000005253 cladding Methods 0.000 description 20
- 230000004313 glare Effects 0.000 description 10
- 239000011521 glass Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- WEJZHZJJXPXXMU-UHFFFAOYSA-N 2,4-dichloro-1-phenylbenzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC=C1 WEJZHZJJXPXXMU-UHFFFAOYSA-N 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XLDBTRJKXLKYTC-UHFFFAOYSA-N 2,3,4,4'-tetrachlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=C(Cl)C(Cl)=C1Cl XLDBTRJKXLKYTC-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- MUBKMWFYVHYZAI-UHFFFAOYSA-N [Al].[Cu].[Zn] Chemical compound [Al].[Cu].[Zn] MUBKMWFYVHYZAI-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
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- 229910002804 graphite Inorganic materials 0.000 description 1
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- 230000031700 light absorption Effects 0.000 description 1
- 238000012538 light obscuration Methods 0.000 description 1
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- 230000001737 promoting effect Effects 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
- F21V7/048—Optical design with facets structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
- F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0008—Reflectors for light sources providing for indirect lighting
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0066—Reflectors for light sources specially adapted to cooperate with point like light sources; specially adapted to cooperate with light sources the shape of which is unspecified
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to electrical lighting devices and systems and, more specifically, lighting apparatuses using at least one single-chip or multi-chip light-emitting diode (“LED”), back-reflecting collection optics for LEDs, and an improved heat sink mounting apparatus which promotes efficient heat dissipation generated from the LED while minimizing light obstruction and glare.
- LED light-emitting diode
- the LED light source is located at the center of a reflector with its light emission directed outward from the reflector.
- LED lighting apparatuses such as PAR38, which use multiple LEDs with their light emissions directed outward from one or more reflectors.
- These configurations are unable to achieve narrow beam angles, and result in considerable glare since observers are not shielded from the LED light source. Further, these configurations inefficiently distributes heat; thereby, making the use of high- powered LEDs in these configurations practically prohibitive.
- a lighting apparatus comprises a main housing; a reflector disposed within the main housing, the reflector having a front side and a rear side; a heat conducting body comprising at least two heat pipes, wherein a first portion of the at least two heat pipes are positioned parallel to a central axis of the lighting apparatus on the front side of the reflector, and a second portion of each of the at least two heat pipes is in the rear side of the reflector and is thermally coupled to the main housing; a heat conducting head located on the front side of the reflector, and is thermally coupled to the heat conducting body; at least two LEDs thermally coupled to the heat conducting head and the heat conducting body, the at least two LEDs being positioned to face the front side of the reflector so that light emitted from the at least two LEDs are directed to the front side of the reflector.
- the at least two heat pipes are substantially J-shaped, L-shaped, or a combination thereof.
- the heat conducting body provides a pathway for heat to flow from the at least two LEDs toward the main housing.
- the reflector has at least two central optical axes.
- one end of the heat conducting body is thermally coupled to the at least two LEDs, and the other end of the heat conducting body is thermally coupled to the main housing.
- the reflector is in a symmetrical or unsymmetrical shape.
- the main housing is substantially frustoconical, cylindrical or cubical in shape, and is made of a thermally-conductive material.
- the main housing comprises one or more heat dissipating fins.
- the lighting apparatus further comprises a plastic housing, coupled to the main housing; and a lamp base coupled to the plastic housing.
- the lamp base is an E26 lamp base, a GU10 lamp base, an E27 lamp base, or a GU24 lamp base.
- the lighting apparatus further comprises the at least two LEDs being positioned at a range of 0 degree to 120 degrees relative to the central axis of the lighting apparatus.
- the heat conducting head has a triangular side profile or an irregular hexagon side profile, and has at least two mounting areas for the at least two LEDs, respectively.
- the heat conducting head is made of aluminum, copper, or a combination thereof.
- the lighting apparatus further comprises a PCB coupled the at least two LEDs and the heat conducting head.
- the lighting apparatus comprises a main housing having a generally frustoconical shape; a reflector disposed within the main housing, the reflector having a front side, a rear side and at least two central optical axes; a heat conducting body comprising at least two substantially J-shaped heat pipes, wherein a first portion of the at least two substantially J-shaped heat pipes is bar-shaped and located on the front side of the reflector, and is coupled to a heat conducting head located at or near a central axis of the lighting apparatus, a second portion of the at least two substantially J-shaped heat pipes which goes through the reflector via an opening at or near the central axis of the lighting apparatus, and a third portion of the at least two substantially J-shaped heat pipes is curved and at least a portion of which is coupled to the main housing; and at least two LEDs thermally coupled to the heat conducting head and positioned facing the front side of the reflector at an inclined angle relative to a central axis of the lighting apparatus so that light
- FIGURE 1 is a perspective view from the top side of a lighting apparatus according to an aspect of the present invention.
- FIGURE 2 is a perspective view from the bottom side of the lighting apparatus shown in FIGURE 1 ;
- FIGURE 3 is an "X-ray" view from the bottom side of the lighting apparatus shown in FIGURE 3;
- FIGURE 4 is a cross-sectional perspective view from the top side of the lighting apparatus shown in FIGURE 1 ;
- FIGURE 5 is a cross-sectional perspective view from the bottom side of the lighting apparatus shown in FIGURE 1 ;
- FIGURE 6 is a cross-sectional view of the lighting apparatus shown in FIGURE 1 ;
- FIGURE 7 is a cross-sectional view of a known heat pipe (from http://en.wikipedia.org/wiki /Image: Heat Pipe Mechanism.png);
- FIGURE 8 is a perspective view of a lighting apparatus according to another aspect of the present invention.
- FIGURE 9 is a perspective view from the bottom side of the lighting apparatus shown in FIGURE 8.
- FIGURE 10 is a cross-sectional perspective view of the lighting apparatus shown in FIGURE 8;
- FIGURE 11 is another cross-sectional perspective view of the lighting apparatus shown in FIGURE 8;
- FIGURE 12 is an exploded perspective view of the lighting apparatus shown in FIGURE 8.
- FIGURE 13 is an exploded cross-sectional view of the lighting apparatus shown in FIGURE 8.
- FIGURE 14 is a perspective view of a heat conducting body (cladded heat pipe) with an LED coupled directly onto according to an aspect of the present invention
- FIGURE 15 is a perspective view of a heat conducting body (non- cladded heat pipe) with an LED coupled directly onto according to another aspect of the present invention
- FIGURE 16 is a perspective view of a lighting apparatus (which includes an S-shaped heat conducting body) according to another aspect of the present invention.
- FIGURE 17 is a side view of the lighting apparatus shown in FIGURE 16;
- FIGURE 18 is a cross-sectional perspective view of the lighting apparatus shown in FIGURE 16;
- FIGURE 19 is an exploded perspective view of the top rim and a heat sink mounting apparatus (which includes a metal cladding, an S-shaped heat conducting body, a mounting platform, a mounting plate, and an LED) of the lighting apparatus shown in FIGURE 16;
- a heat sink mounting apparatus which includes a metal cladding, an S-shaped heat conducting body, a mounting platform, a mounting plate, and an LED
- FIGURE 20 is a perspective view from the top side (without a glass cover) of the lighting apparatus shown in FIGURE 16;
- FIGURE 21 is a perspective view from the top side of a lighting apparatus according to another aspect of the present invention.
- FIGURE 22 is an exploded perspective view from the top side of the lighting apparatus shown in FIGURE 21 ;
- FIGURE 23 is an exploded cross-sectional view of the lighting apparatus shown in FIGURE 21 ;
- FIGURE 24 is a cross-sectional view of the lighting apparatus shown in FIGURE 21 ;
- FIGURE 25 is another cross-sectional view of the lighting apparatus shown in FIGURE 21 ;
- FIGURE 26 is a cross-sectional view of the lighting apparatus shown in FIGURE 21 ;
- FIGURE 27 is a perspective view from the bottom side of the lighting apparatus shown in FIGURE 21 ;
- FIGURE 28 is a perspective view of a lighting apparatus according to another aspect of the present invention.
- FIGURE 29 is a perspective view from the bottom side of the lighting apparatus shown in FIGURE 28;
- FIGURE 30 is a side view of the lighting apparatus shown in FIGURE 28.
- FIGURE 31 is a cross-sectional perspective view of the lighting apparatus shown in FIGURE 28.
- a lighting apparatus 1 has a reflector 4 which is coupled to a top rim 3, wherein the top rim 3 is coupled to a heat conducting body 2.
- the heat conducting body 2 contains a heat pipe 8 which is cladded by a cladding 9, and a mounting platform 5 located on one side of the heat conducting body 2 facing opposite the front side of the reflector 4.
- an LED 6 is coupled to a metal core printed circuit board (“PCB”) 7 which is then coupled to the mounting platform 5.
- PCB metal core printed circuit board
- the mounting platform 5 is shaped (which, in this aspect of the present invention, is circular) in such a manner that it provides increased non-glare protection from the LED relative to existing lighting apparatuses.
- the LED 6 is located above at or near a central optical axis 300 of the reflector 4, and is positioned so that light emitted from the LED 6 is substantially or entirely directed to the front side of the reflector 4; thereby, as shown in FIGURE 6, allowing the reflector 4 to collect and colliminate the light emitted from LED 6, and reflect the colliminated light away from the reflector 4 and past LED 6 and the heat conducting body 2.
- the heat conducting body 2 intercepts very little of the exiting reflected, colliminated light from reflector 4 due to its flat, narrow construction. As shown in FIGURE 3, the flat, narrow construction of the heat conducting body 2 creates a small cross- section 10 to the exiting reflected, colliminated light from reflector 4.
- the heat generated from the LED 6 travels the following heat path through the lighting apparatus: metal core PCB 7, mounting platform 5, cladding 9, heat pipe 8, cladding 9, and then top rim 3 and reflector 4.
- the heat generated from the LED 6 can also travel through metal core PCB 7, mounting platform 5, cladding 9, heat pipe 8, and then top rim 3 and reflector 4.
- the top rim 3 and reflector 4 act as heat sinks.
- the lighting apparatus 50 contains a reflector 53 which is coupled to a top rim 52, wherein the top rim 52 is coupled to a heat conducting body 51.
- the heat conducting body 51 contains a heat pipe 56 which is cladded by a cladding 59, and a mounting platform 54 located on one side of the heat conducting body 51 facing opposite the reflector 53.
- the LED 55 as shown in FIGURE 11 , is coupled to a metal core PCB 60 which is then coupled to the mounting platform 54.
- This aspect of the present invention includes a main housing 57 which has one or more heat dissipating fins 58 for maximizing surface area; thereby, increasing its heat dissipation capacity.
- the top rim 52, reflector 53, and the main housing 57 act as heat sinks, with the main housing 57 acting as the primary heat sink.
- the main housing 57 is coupled to a reflector edge 63.
- the size of air gap 62 can vary depending on the size of the reflector 53.
- the heat generated from the LED 55 travels a heat path which includes travelling through metal core PCB 60, mounting platform 54, cladding 59, heat pipe 56, cladding 59, and then top rim 52, reflector 53 and main housing 57.
- the heat can also travel through metal core PCB 60, mounting platform 54, cladding 59, heat pipe 56, and then top rim 52, reflector 53 and main housing 57.
- the lighting apparatus 500 includes a main housing 501 ; a reflector 502 having a front side and a rear side; a top rim 503 coupled to the main housing 501 ; a heat conducting body 1000 which is positioned on the front side of the reflector 502 and coupled to the top rim 503; an LED 504 being positioned facing directly at the front side of the reflector 502 so that light emitted from the LED 504 is substantially or entirely directed to the front side of the reflector 502.
- the heat conducting body 1000 is substantially S-shaped and includes a middle portion 1001 that is bar-shaped or substantially bar-shaped; and curved wing portions 1002 and 1003 which extend from each end of the middle portion 1001.
- curved wing portions 1002 and 1002 are coupled to the top rim 503, wherein the top rim 503 has slots 520 and 521 which permit the curved wing portions 1002 and 1003 to fit within the slots 520, 521 , respectively; thereby, permitting coupling of the heat conducting body 1000 and the top rim 503.
- the heat conducting body 1000 and the top rim 503 can also be coupled via soldering, thermal epoxy or any other techniques known in the art which are used to couple the heat conducting body 1000 to the top rim 503.
- the heat conducting body 1000 includes a mounting platform 530 which is positioned near or at the central optical axis of the reflector 502, and a mounting plate 531 coupled between the mounting platform 530 and LED 504.
- the heat conducting body 000 also includes a heat pipe is located at the middle portion 1001 and/or one or both of the curved wing portions 1002 and 1003.
- a metal cladding 550 can be coupled to the heat conducting body 1000.
- the metal cladding 550 can be used to secure and direct electrical cable or wires which extends from the top rim 503 to the LED 504 along the middle portion 1001 of the heat conducting body 1000, and is made of a thermally- conductive material, such as stainless steel, aluminum, copper or any other high- heat conductive material.
- the present invention can include a glass cover 800 which is coupled to the top rim 503 and a cap rim 509.
- the glass cover 800 protects at least the reflector 502, the heat conducting body 1000, the mounting platform 530, the mounting plate 531 and LED 504 from environmental hazards, such as water and dust.
- the glass cover can also be used in conjunction with the aspects of the present invention set forth in FIGURES 1-6 and 8-13.
- the present invention can also include a plastic housing 700 that is coupled to the bottom end of the main housing 501 , and a lamp base 701 (e.g., an E26 lamp base, a GU10 lamp base, an E27 lamp base, a G24 lamp base) that is coupled to the plastic housing 700.
- a lamp base 701 e.g., an E26 lamp base, a GU10 lamp base, an E27 lamp base, a G24 lamp base
- the lighting apparatus 1200 includes a main housing 1300, a reflector 1800 having a front side and a rear side; a heat conducting head 1500 which is located on the front side of reflector 1800 and is thermally coupled to a heat conducting body 1600, wherein the heat conducting body 1600 is positioned parallel to a central axis of the apparatus ("central axis 2000") on the front side of the reflector 1800, and extends through an opening 1850 of the reflector 1800 and onto the rear side of the reflector 1800, and is thermally coupled to the main housing 1300; at least two LEDs 5000, 5001 are thermally coupled to the heat conducting head 1500 and positioned facing the front side of reflector 1800 at either an inclined angle relative to the central axis 2000 or directly facing the reflector.
- the LEDs 5000, 5001 can be position at a range of 0 degree (which is facing vertically downward to the reflector and parallel to the central axis 2000) to 120 degrees relative to the central axis 2000
- the lighting apparatus 1200 also includes an anti-glare cap 1700, which is coupled to the heat conducting head 1500, and covers at least a portion of the at least two LEDs 5000, 5001.
- the anti-glare cap has at least two lips 1700a, 1700b that cover at least a portion of the at least two LEDs 5000, 5001.
- the anti-glare cap helps reduce direct glare caused by directly viewing the at least two LEDs 5000, 5001.
- the anti-glare cap also redirects light emitted from the at least two LEDs 5000, 5001 to the reflector 1800.
- the reflector 1800 has at least two central optical axes, wherein each central optical axis is positioned in a manner which creates a beam angle of at least 30 degrees.
- the reflector 1800 has at least two independent optical systems (see FIGURE 26) which generate identical and overlapping beams.
- Such reflector 1800 has 2 to 60 deg beam Full Width Half Maximum (“FWHM").
- Heat conducting head 1500 can have a triangular or irregular hexagon side profile, and has at least two mounting areas 1530a, 1530b which the at least two LEDs 5000, 5001 may be directly or indirectly coupled thereto, respectively.
- the heat conducting head 1500 is made of a thermally-conductive material such as aluminum, copper, any other high-heat conductive material, or a combination thereof.
- the heat conducting body 1600 comprises at least two heat pipes 1601a, 1601b thermally coupled to the at least two LEDs 5000, 5001 , heat conducting head 1500 and main housing 1300.
- Main housing 1300 has a slot 1900, which heat pipes 1601a, 1601b fit within the slot 1900; thereby, permitting coupling of the heat pipes 1601a, 1601 b and the main housing 1300.
- the heat pipes 1601a, 160 b can be shaped to optimize heat conduction and transfer efficiency from the at least two LEDs 5000, 5001 to the main housing 1300.
- the heat pipes 1601a, 1601b are in a substantially J-shape.
- the heat pipes 1601a, 1601b can also be in a substantially L shape, a substantially T shape, or a combination thereof.
- the heat generated from the at least two LEDs 5000, 5001 travels the following heat path through the lighting apparatus 1200: heat conducting head 1500, heat conducting body 1600, and then reflector 1800 and main housing 1300.
- the reflector 1800 and main housing 1300 act as heat sinks.
- the lighting apparatus 8000 includes lighting apparatus 1200, wherein one end of the main housing 1300 is coupled with a plastic housing 700, the plastic housing 700 coupled to a lamp base 701 (e.g., an E26 lamp base, a GU10 lamp base, an E27 lamp base, a GU24 lamp base).
- the plastic housing 700 contains main circuit boards, and electrically insulate such main circuit boards from the main housing 1300.
- heat conducting body 1600 can handle more heat power than heat conducting body 2, 51 , 1000 since the heat conducting body 1600 comprises at least two heat pipes 1601a, 1601b which can direct more heat from the LEDs 5000, 5001 to the reflector 1800 and main housing 1300.
- a user can mix color from the at least two LEDs 5000, 5001 , and therefore can choose a wider range of colors of light to emanate from the lighting apparatus 1200, 1800.
- the heat conducting body 2, 51 contain a heat pipe 8, 56 which is cladded by a cladding 9, 59, and a mounting platform 5, 54 located on one side of the heat conducting body 2, 51 facing opposite the reflector 4, 53.
- the cladding 9, 59 can be made of a thermally-conductive material such as aluminum, copper, graphite or zinc, and can include a mounting platform 5, 54.
- the cladding 9, 59 can be used to increase structural strength of the heat pipe 8, 56, assist in transferring and spreading the heat from the LED 6, 55 to the heat pipe, and assist in the transferring and spreading the heat from the heat pipe 8, 56 to the heat sinks, such as top rim 3, 52, reflector 4, 53 and main housing 57.
- the heat conducting body 1000 can be coupled to a metal cladding 550.
- Metal cladding 550 covers a substantial portion of the middle portion 1001 of the heat conducting body 1000, and is used for aesthetic purposes, securing electric cable or wires between heat conducting body 1000 and metal cladding 550, and/or directing such electric cable or wires to the LED 504.
- the metal cladding 550 can be made of thermally-conductive material, such as stainless steel, aluminum, copper or any other high-heat conductive material.
- the LED 91 can be directly affixed onto a heat conducting body 90 (via the mounting platform 92 of cladding 93).
- FIGURE 15 shows a heat conducting body 100 wherein an LED 103 is coupled onto a mounting platform 102, which is, in turn, directly coupled to a heat pipe 101.
- the mounting platform 102 can be cylindrically-shaped, and can partially or completely encase at least the center of the heat pipe 101.
- the heat pipe (such as heat pipe 8, 56, 101 , 1601a, 1601b) can be made of porous copper incorporating a large number cavities filled with pure water. As shown in FIGURE 7, water within the heat pipe evaporates to vapor as it absorbs thermal energy from a heat source. See 400 in FIGURE 7. The vaporized water then migrates along the vapor cavity to cooler sections of the heat pipe. See 401 in FIGURE 7. There, the vapor quickly cools and condenses back to fluid, and the fluid is absorbed by the wick, releasing thermal energy. See 402 in FIGURE 7. The fluid then returns along the inner cavities to the heated sections (See 403 in FIGURE 7), and repeats the heat pipe thermal cycle described above.
- the heat pipe use the above-described mechanism to transmit thermal energy from the LED to heat sinks, such as the top rim 3, 52, reflector 4, 53, 1800, and main housing 57, 501 , 1300.
- the heat pipe can be flattened (in a cross-section direction) into a thin strip in order to minimize light absorption.
- Another aspect of the present invention includes a heat conducting body with one or more heat pipes.
- each heat pipe is connected to a center hub (like a spoke on a wheel) positioned near or at the central optical axis of a reflector.
- the center hub acts as a mounting platform for one or more LEDs, and is made of thermally-conductive material such as aluminum, copper or any other high-heat conductive material.
- the heat conducting body extends up to or near the central axis of a reflector and being coupled to the top rim at only one connection point (such as connection point 900 or 901 for FIGURE 1 , or connection point 910 or 911 for FIGURE 8). As a result, the heat conducting body does not form a chord to or a diameter of the top rim of FIGURES 1 and 8.
- the heat conducting body includes a mounting platform with an LED directly coupled thereto, or an LED coupled to a metal core PCB or a mounting plate, which is then coupled to the mounting platform.
- This alternative aspect of the present invention reduces light blockage caused by the heat conducting body and improves lens efficiency, while promoting heat dissipation and anti-glare.
- the mounting platform 5, 54, 102, 530 are made of a thermally- conductive material such as aluminum, copper or any other high-heat conductive material. Also, as mentioned above, the mounting platform provides increased non-glare protection from the LED relative to existing light apparatuses. In the present invention, the possibility of direct glare from the LED is eliminated (or at least mitigated) since (1) the LED is coupled onto the mounting platform and positioned facing directly at the reflector so as that light emitted from the LED is substantially or entirely directed to the reflector, and (2) the mounting platform is shaped (e.g., circular) in a manner which prevents a direct view of the LED at any viewing angle.
- the reflector 4, 53, 502, 1800 are made of a thermally-conductive material such as aluminum, and act as a heat sink.
- the reflector 4, 53, 502, 1800 can be made of a non-thermally-conductive material such as plastic.
- light emitted from the LEDs 6, 5000, 5001 is substantially or entirely directed toward the reflector 4, 1800, wherein the reflector 4, 1800 collimates the light emitted from the LED 6 into a light beam and reflects the light beam with a particular beam angle.
- the beam angle can range from 2 to 60 Full Width Half Maximum (“FWHM") degree.
- the reflector 4, 1800 of the present invention is designed to collect substantially or entirely the light emitted from the LEDs 6, 5000, 5001 and redirect the light in a manner which eliminates (or at least mitigates) luminance of the present invention within a direct glare zone (i.e. , approximately 45 to 85 degree with respect to vertical).
- the reflector 4, 53, 502, 1800 can take a variety of shapes to achieve various light beam patterns. It can be shaped in any conic section (e.g., hyperbola, ellipse or parabola), used singularly or in various combinations, in two-dimension or three-dimensional shapes. Further, the reflector 4, 53, 502, 1800 can be symmetrical or asymmetrical.
- An LED can be an LED module with one or more chips.
- the LED can be a high-powered LED.
- One or more LEDs can be used in the present invention.
- the LED 6, 55, 504 are coupled to a metal core PCB 7, 60 or a mounting plate 531.
- the LED 91 , 103 are coupled to the mounting platform 92 and 102.
- such LEDs can be coupled to a PCB (metal core or F4-based) which is then coupled to the heat conducting head 1500, or can be coupled on the heat mounting head 1500.
- the LED can be soldered onto a metal core PCB, mounting plate, mounting platform, or heat conducting head.
- Thermal paste, thermal grease, soldering, reflow soldering or any other soldering materials or techniques known in the art can be used to couple the LED onto the metal core PCB, mounting plate, mounting platform, or heat conducting head.
- the at least two LEDs 5000, 5001 can be the same or different colors. Allowing LED 5000, 5001 to be different colors allows color mixing and variation. LEDs 5000, 5001 can create a color temperature range of 2700K to 5000K. Such LEDs 5000, 5001 can be programmed by individually controlling LED current. Power supplies and control unit are needed to allow such color mixing and variation.
- the present invention includes a metal core PCB (see metal core PCB 7, 60 shown in FIGURES 3 and 12).
- the metal core PCB includes LED circuitry, and acts as a heat-transporting medium.
- the metal core PCB comprises a base metal plate (copper or aluminum, which is approximately 0.8 to 3mm thick), a dielectric layer (laminated on top of the base metal plate, which is approximately 0.1 mm thick), and a copper circuit track (printed on top of dielectric layer, which is approximately 0.05 to 0.2 mm thick).
- a metal core PCB is not included in the present invention in order to further reduce thermal resistance; thereby, reducing LED junction temperature and increasing maximum LED power.
- a mounting plate 531 is used, wherein the mounting plate 531 being coupled to the LED 504 and to the mounting platform 530.
- the mounting plate is made a thermally-conductive material such as copper or any other high-heat conductive material, and approximately 0.8 to 3mm thick. Mechanical techniques (such as screws) known in the art are used to couple the mounting plate to the mounting platform, and a thermal grease or paste with high thermal conductivity can be used between the mounting plate and mounting platform.
- the top rim 3, 52, 503 are made of a thermally-conductive material, such as aluminum, copper or zinc or any other high-heat conductive material.
- the top rim 3 acts as a primary heat sink (for example, see FIGURE 1), or, like top rim 52, 503, as a secondary heat sink (for example, see FIGURES 8 and 18).
- the present invention includes a cap rim 509 which helps secures the glass cover 800 to the top rim 503.
- the main housing 57, 501 , 1300 are made of a thermally-conductive material, such as aluminum, copper, zinc or any other high-heat conductive material.
- the main housing 57, 501 , 1300 act as a primary heat sink (for example, see FIGURES 8, 17, 23).
- the main housing 57, 501 , 1300 can have one or more fins 58, 570, 1350 and/or take a conical-like or cylindrical-like shape to increase its surface area in order to increase its heat dissipation capacity.
- the main housing 57, 501 , 1300 can be substantially frustoconical in shape.
- the main housing can also be cylindrical or cubical in shape.
- one end of the main housing 57, 501 , 1300 are coupled with a plastic housing 700, the plastic housing 700 coupled to a lamp base 701 ⁇ e.g., an E26 lamp base, a GU10 lamp base, an E27 lamp base, a GU24 lamp base).
- the plastic housing 700 contains main circuit boards, and electrically insulate such main circuit boards from the main housing 57, 501.
- main housing can be utilized in conjunction with the aspect of the present invention set forth in FIGURES 1-6
- plastic housing 700 and lamp base 701 can be utilized with the aspects of the present invention shown in FIGURES 1-6, FIGURES 8- 13, and FIGURES 28-31.
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/401,724 US9234646B2 (en) | 2008-05-23 | 2012-02-21 | Non-glare reflective LED lighting apparatus with heat sink mounting |
| PCT/CA2012/050204 WO2013123570A1 (fr) | 2012-02-21 | 2012-03-30 | Appareil d'éclairage à del réfléchissant non éblouissant avec montage de dissipateur thermique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2817562A1 true EP2817562A1 (fr) | 2014-12-31 |
| EP2817562A4 EP2817562A4 (fr) | 2015-10-21 |
Family
ID=49004868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP12869302.5A Withdrawn EP2817562A4 (fr) | 2012-02-21 | 2012-03-30 | Appareil d'éclairage à del réfléchissant non éblouissant avec montage de dissipateur thermique |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2817562A4 (fr) |
| CN (1) | CN104081120A (fr) |
| HK (2) | HK1200904A1 (fr) |
| TW (1) | TWI529344B (fr) |
| WO (1) | WO2013123570A1 (fr) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2520248B (en) * | 2013-11-12 | 2016-02-24 | Collingwood Lighting Ltd | Lighting unit |
| CN104976539B (zh) * | 2015-07-22 | 2018-03-27 | 深圳市中孚能电气设备有限公司 | 金属嵌合前置式屈光装置以及光源 |
| US10180246B2 (en) * | 2016-10-31 | 2019-01-15 | Honeywell International Inc. | LED searchlight and method |
| US10259377B2 (en) * | 2017-01-20 | 2019-04-16 | Tractor Supply Company | Vehicle light bar with straight and curved frame portions |
| AT520487B1 (de) * | 2017-09-21 | 2019-07-15 | Litestudio Og | Leuchtmodul zur Abstrahlung von parallel gerichtetem Licht |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2161912B (en) * | 1984-07-19 | 1987-10-28 | Shimizu Construction Co Ltd | Illumination apparatus |
| US4837667A (en) * | 1986-10-03 | 1989-06-06 | Tobias Grau | Lighting system with lamps arranged between two low-voltage conductors |
| US7048412B2 (en) * | 2002-06-10 | 2006-05-23 | Lumileds Lighting U.S., Llc | Axial LED source |
| US6976769B2 (en) * | 2003-06-11 | 2005-12-20 | Cool Options, Inc. | Light-emitting diode reflector assembly having a heat pipe |
| US7742225B2 (en) * | 2004-06-14 | 2010-06-22 | Hewlett-Packard Development Company, L.P. | Bandpass reflector with heat removal |
| CN1722484A (zh) * | 2004-07-16 | 2006-01-18 | 奥斯兰姆施尔凡尼亚公司 | 用于发光二极管的管座装置 |
| US7565925B2 (en) * | 2005-06-24 | 2009-07-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| CN101495802B (zh) * | 2006-07-28 | 2011-08-10 | 皇家飞利浦电子股份有限公司 | 照明模块 |
| JP4726872B2 (ja) * | 2006-09-27 | 2011-07-20 | シーシーエス株式会社 | 反射型照明装置 |
| DK2276973T3 (da) * | 2008-05-23 | 2013-01-14 | Huizhou Light Engine Ltd | Ikke-blændende reflektiv ledbelysningsindretning med varmeoptagende montering |
| TWI407043B (zh) * | 2008-11-04 | 2013-09-01 | Advanced Optoelectronic Tech | 發光二極體光源模組及其光學引擎 |
| CN101865369B (zh) * | 2009-04-16 | 2014-04-30 | 富准精密工业(深圳)有限公司 | 发光二极管灯具 |
| TW201038870A (en) * | 2009-04-24 | 2010-11-01 | Foxconn Tech Co Ltd | Light emitting diode lamp |
| TW201038868A (en) * | 2009-04-24 | 2010-11-01 | Foxconn Tech Co Ltd | Light emitting diode lamp |
| RU2573424C2 (ru) * | 2009-06-25 | 2016-01-20 | Конинклейке Филипс Электроникс Н.В. | Теплорегулирующее устройство |
| CN102087004B (zh) * | 2009-12-03 | 2014-06-11 | 马士科技有限公司 | 发光二极管灯和其中的反光杯 |
| EP2397753B1 (fr) * | 2010-06-15 | 2013-05-29 | Kitagawa Holdings, LLC | Lampe à DEL et son dissipateur de chaleur doté d'un tuyau de chaleur enroulé |
| DE102010030296B4 (de) * | 2010-06-21 | 2012-11-22 | Osram Ag | Lampe mit konkavem Reflektor und einem Vorsprung für mindestens eine Lichtquelle |
-
2012
- 2012-03-30 WO PCT/CA2012/050204 patent/WO2013123570A1/fr not_active Ceased
- 2012-03-30 EP EP12869302.5A patent/EP2817562A4/fr not_active Withdrawn
- 2012-03-30 HK HK15101175.8A patent/HK1200904A1/xx unknown
- 2012-03-30 CN CN201280067140.XA patent/CN104081120A/zh active Pending
- 2012-03-30 HK HK15106226.6A patent/HK1205783A1/xx unknown
- 2012-03-30 TW TW101111452A patent/TWI529344B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| HK1200904A1 (en) | 2015-08-14 |
| TW201335538A (zh) | 2013-09-01 |
| CN104081120A (zh) | 2014-10-01 |
| WO2013123570A1 (fr) | 2013-08-29 |
| EP2817562A4 (fr) | 2015-10-21 |
| TWI529344B (zh) | 2016-04-11 |
| HK1205783A1 (en) | 2015-12-24 |
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