EP2825344A4 - Laser scribing with extended depth affectation into a workpiece - Google Patents
Laser scribing with extended depth affectation into a workpieceInfo
- Publication number
- EP2825344A4 EP2825344A4 EP13760572.1A EP13760572A EP2825344A4 EP 2825344 A4 EP2825344 A4 EP 2825344A4 EP 13760572 A EP13760572 A EP 13760572A EP 2825344 A4 EP2825344 A4 EP 2825344A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- workpiece
- laser scribing
- extended depth
- depth affectation
- affectation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles ; Surface treated articles
- B23K2101/35—Surface treated articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Dicing (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/422,190 US20120234807A1 (en) | 2009-12-07 | 2012-03-16 | Laser scribing with extended depth affectation into a workplace |
| PCT/US2013/032781 WO2013138802A1 (en) | 2012-03-16 | 2013-03-18 | Laser scribing with extended depth affectation into a workpiece |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP2825344A1 EP2825344A1 (en) | 2015-01-21 |
| EP2825344A4 true EP2825344A4 (en) | 2016-02-17 |
Family
ID=49161885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP13760572.1A Withdrawn EP2825344A4 (en) | 2012-03-16 | 2013-03-18 | Laser scribing with extended depth affectation into a workpiece |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2825344A4 (en) |
| JP (1) | JP2015519722A (en) |
| KR (1) | KR20140137437A (en) |
| CN (1) | CN104334312A (en) |
| TW (1) | TW201343296A (en) |
| WO (1) | WO2013138802A1 (en) |
Families Citing this family (64)
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| WO2014079478A1 (en) | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| US9701564B2 (en) | 2013-01-15 | 2017-07-11 | Corning Incorporated | Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles |
| EP2754524B1 (en) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line |
| EP2781296B1 (en) | 2013-03-21 | 2020-10-21 | Corning Laser Technologies GmbH | Device and method for cutting out contours from flat substrates using a laser |
| ES2908956T3 (en) * | 2013-04-04 | 2022-05-04 | Lpkf Laser & Electronics Ag | Procedure for introducing ruptures in a substrate |
| RU2551043C1 (en) * | 2013-11-07 | 2015-05-20 | Общество С Ограниченной Ответственностью "Оптосистемы" | Method and device for forming precision holes in optically transparent film with ultra-short laser radiation pulse |
| US10005152B2 (en) * | 2013-11-19 | 2018-06-26 | Rofin-Sinar Technologies Llc | Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses |
| US9676167B2 (en) | 2013-12-17 | 2017-06-13 | Corning Incorporated | Laser processing of sapphire substrate and related applications |
| US11556039B2 (en) | 2013-12-17 | 2023-01-17 | Corning Incorporated | Electrochromic coated glass articles and methods for laser processing the same |
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| US9701563B2 (en) | 2013-12-17 | 2017-07-11 | Corning Incorporated | Laser cut composite glass article and method of cutting |
| US9850160B2 (en) | 2013-12-17 | 2017-12-26 | Corning Incorporated | Laser cutting of display glass compositions |
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| US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| US9687936B2 (en) | 2013-12-17 | 2017-06-27 | Corning Incorporated | Transparent material cutting with ultrafast laser and beam optics |
| US20150165560A1 (en) | 2013-12-17 | 2015-06-18 | Corning Incorporated | Laser processing of slots and holes |
| TWI730945B (en) | 2014-07-08 | 2021-06-21 | 美商康寧公司 | Methods and apparatuses for laser processing materials |
| MX2017000440A (en) * | 2014-07-11 | 2017-08-16 | Corning Inc | Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles. |
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| WO2016010949A1 (en) | 2014-07-14 | 2016-01-21 | Corning Incorporated | Method and system for forming perforations |
| EP3169479B1 (en) | 2014-07-14 | 2019-10-02 | Corning Incorporated | Method of and system for arresting incident crack propagation in a transparent material |
| KR20170028943A (en) | 2014-07-14 | 2017-03-14 | 코닝 인코포레이티드 | System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter |
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| US10047001B2 (en) | 2014-12-04 | 2018-08-14 | Corning Incorporated | Glass cutting systems and methods using non-diffracting laser beams |
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| US10981251B2 (en) | 2016-06-08 | 2021-04-20 | Han's Laser Technology Industry Group Co., Ltd | Method and device for cutting sapphire |
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| CN111151895A (en) * | 2020-01-13 | 2020-05-15 | 大族激光科技产业集团股份有限公司 | A process and system for cutting transparent materials by using filamentation effect |
| CN111215768B (en) * | 2020-01-16 | 2021-03-30 | 吉林大学 | Method for longitudinal processing by utilizing inverse spherical aberration correction and application |
| TWI794589B (en) * | 2020-02-21 | 2023-03-01 | 海納光電股份有限公司 | Device and method for processing hard and brittle plates in high temperature environment |
| DE102021100675B4 (en) | 2021-01-14 | 2022-08-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Process for dividing a transparent workpiece |
| CN113732511B (en) * | 2021-08-30 | 2023-01-06 | 中国科学院西安光学精密机械研究所 | Femtosecond laser processing method and device for fiber surface cladding micro-nano structure |
| CN120286871B (en) * | 2025-06-13 | 2025-08-26 | 邯郸中建材光电材料有限公司 | Laser scribing equipment for power generation glass and scribing method for light transmission line of power generation glass |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050024743A1 (en) * | 2003-05-22 | 2005-02-03 | Frederic Camy-Peyret | Focusing optic for laser cutting |
| US20070051706A1 (en) * | 2005-09-08 | 2007-03-08 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| EP1811551A1 (en) * | 2004-11-12 | 2007-07-25 | Hamamatsu Photonics K.K. | Laser beam machining method and semiconductor chip |
| EP2186596A1 (en) * | 2007-08-03 | 2010-05-19 | Hamamatsu Photonics K.K. | Laser working method, laser working apparatus, and its manufacturing method |
| JP2010158686A (en) * | 2009-01-06 | 2010-07-22 | Disco Abrasive Syst Ltd | Optical device for laser processing, laser processing device and laser processing method |
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-
2013
- 2013-03-15 TW TW102109207A patent/TW201343296A/en unknown
- 2013-03-18 EP EP13760572.1A patent/EP2825344A4/en not_active Withdrawn
- 2013-03-18 CN CN201380022339.5A patent/CN104334312A/en active Pending
- 2013-03-18 WO PCT/US2013/032781 patent/WO2013138802A1/en not_active Ceased
- 2013-03-18 JP JP2015500676A patent/JP2015519722A/en active Pending
- 2013-03-18 KR KR1020147028951A patent/KR20140137437A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050024743A1 (en) * | 2003-05-22 | 2005-02-03 | Frederic Camy-Peyret | Focusing optic for laser cutting |
| EP1811551A1 (en) * | 2004-11-12 | 2007-07-25 | Hamamatsu Photonics K.K. | Laser beam machining method and semiconductor chip |
| US20070051706A1 (en) * | 2005-09-08 | 2007-03-08 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104334312A (en) | 2015-02-04 |
| KR20140137437A (en) | 2014-12-02 |
| JP2015519722A (en) | 2015-07-09 |
| EP2825344A1 (en) | 2015-01-21 |
| TW201343296A (en) | 2013-11-01 |
| WO2013138802A1 (en) | 2013-09-19 |
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