EP2825344A4 - Laser scribing with extended depth affectation into a workpiece - Google Patents

Laser scribing with extended depth affectation into a workpiece

Info

Publication number
EP2825344A4
EP2825344A4 EP13760572.1A EP13760572A EP2825344A4 EP 2825344 A4 EP2825344 A4 EP 2825344A4 EP 13760572 A EP13760572 A EP 13760572A EP 2825344 A4 EP2825344 A4 EP 2825344A4
Authority
EP
European Patent Office
Prior art keywords
workpiece
laser scribing
extended depth
depth affectation
affectation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13760572.1A
Other languages
German (de)
French (fr)
Other versions
EP2825344A1 (en
Inventor
Jeffrey P Sercel
Marco Mendes
Mathew Hannon
Dadelszen Michael Von
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IPG Microsystems LLC
Original Assignee
IPG Microsystems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/422,190 external-priority patent/US20120234807A1/en
Application filed by IPG Microsystems LLC filed Critical IPG Microsystems LLC
Publication of EP2825344A1 publication Critical patent/EP2825344A1/en
Publication of EP2825344A4 publication Critical patent/EP2825344A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
EP13760572.1A 2012-03-16 2013-03-18 Laser scribing with extended depth affectation into a workpiece Withdrawn EP2825344A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/422,190 US20120234807A1 (en) 2009-12-07 2012-03-16 Laser scribing with extended depth affectation into a workplace
PCT/US2013/032781 WO2013138802A1 (en) 2012-03-16 2013-03-18 Laser scribing with extended depth affectation into a workpiece

Publications (2)

Publication Number Publication Date
EP2825344A1 EP2825344A1 (en) 2015-01-21
EP2825344A4 true EP2825344A4 (en) 2016-02-17

Family

ID=49161885

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13760572.1A Withdrawn EP2825344A4 (en) 2012-03-16 2013-03-18 Laser scribing with extended depth affectation into a workpiece

Country Status (6)

Country Link
EP (1) EP2825344A4 (en)
JP (1) JP2015519722A (en)
KR (1) KR20140137437A (en)
CN (1) CN104334312A (en)
TW (1) TW201343296A (en)
WO (1) WO2013138802A1 (en)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
EP2754524B1 (en) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line
EP2781296B1 (en) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
CN105102177B (en) * 2013-04-04 2018-02-27 Lpkf激光电子股份公司 The substrate that the method and apparatus of perforation are introduced on substrate and are manufactured by this way
RU2551043C1 (en) * 2013-11-07 2015-05-20 Общество С Ограниченной Ответственностью "Оптосистемы" Method and device for forming precision holes in optically transparent film with ultra-short laser radiation pulse
US10005152B2 (en) * 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
TWI730945B (en) 2014-07-08 2021-06-21 美商康寧公司 Methods and apparatuses for laser processing materials
CN107074611A (en) * 2014-07-11 2017-08-18 康宁股份有限公司 System and method that glass-cutting is carried out in glassware are induced to by the way that pulse laser is perforated
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
JP2017530867A (en) 2014-07-14 2017-10-19 コーニング インコーポレイテッド System and method for processing transparent materials using adjustable length and diameter laser beam focal lines
WO2016010991A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US9617180B2 (en) * 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
JP2016058429A (en) * 2014-09-05 2016-04-21 株式会社ディスコ Wafer processing method
DE102014116958B9 (en) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optical system for beam shaping of a laser beam, laser processing system, method for material processing and use of a common elongated focus zone for laser material processing
DE102014116957A1 (en) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optical system for beam shaping
EP3854513B1 (en) * 2014-11-19 2024-01-03 TRUMPF Laser- und Systemtechnik GmbH Asymmetric optical beam forming system
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
US20160158890A1 (en) * 2014-12-05 2016-06-09 Solarcity Corporation Systems and methods for scribing photovoltaic structures
WO2016115017A1 (en) 2015-01-12 2016-07-21 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
WO2016154284A1 (en) 2015-03-24 2016-09-29 Corning Incorporated Laser cutting and processing of display glass compositions
JP2018516215A (en) 2015-03-27 2018-06-21 コーニング インコーポレイテッド Gas permeable window and manufacturing method thereof
KR102499697B1 (en) 2015-07-10 2023-02-14 코닝 인코포레이티드 Method for continuously manufacturing holes in a flexible substrate sheet and articles related thereto
CN106392334B (en) * 2015-07-29 2020-01-07 大族激光科技产业集团股份有限公司 A kind of transparent hard and brittle material laser penetration cutting device and cutting method
LT6428B (en) 2015-10-02 2017-07-25 Uab "Altechna R&D" Method and device for laser processing of transparent materials
JP6549014B2 (en) * 2015-10-13 2019-07-24 株式会社ディスコ Optical device wafer processing method
WO2017108950A1 (en) * 2015-12-22 2017-06-29 Heraeus Deutschland Gmbh Method for the production of a metal-ceramic substrate using a pico-laser
JP6369454B2 (en) * 2015-12-24 2018-08-08 トヨタ自動車株式会社 Laser welding equipment
JP6938543B2 (en) 2016-05-06 2021-09-22 コーニング インコーポレイテッド Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
CN106102986B (en) * 2016-06-08 2018-06-12 大族激光科技产业集团股份有限公司 Method and device for cutting sapphire
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
EP3848333B1 (en) 2016-10-24 2025-12-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
CN106425112B (en) * 2016-11-02 2018-11-06 国神光电科技(上海)有限公司 A kind of method and system of laser scribing
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
KR102596305B1 (en) * 2017-11-20 2023-10-30 아이피지 포토닉스 코포레이션 Laser systems and methods for processing materials
CN107945136B (en) * 2017-12-04 2021-09-24 深圳市路畅科技股份有限公司 Fisheye image correction method, fisheye image correction system, fisheye image correction equipment and computer storage medium
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
JP7119094B2 (en) 2017-12-29 2022-08-16 コアレイズ オーワイ Laser processing apparatus and method
DE102018126381A1 (en) * 2018-02-15 2019-08-22 Schott Ag Method and device for inserting a dividing line into a transparent brittle material, as well as according to the method producible, provided with a dividing line element
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN111151895A (en) * 2020-01-13 2020-05-15 大族激光科技产业集团股份有限公司 A process and system for cutting transparent materials by using filamentation effect
CN111215768B (en) * 2020-01-16 2021-03-30 吉林大学 Method for longitudinal processing by utilizing inverse spherical aberration correction and application
TWI794589B (en) * 2020-02-21 2023-03-01 海納光電股份有限公司 Device and method for processing hard and brittle plates in high temperature environment
DE102021100675B4 (en) 2021-01-14 2022-08-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Process for dividing a transparent workpiece
CN113732511B (en) * 2021-08-30 2023-01-06 中国科学院西安光学精密机械研究所 Femtosecond laser processing method and device for optical fiber surface cladding micro-nano structure
CN120286871B (en) * 2025-06-13 2025-08-26 邯郸中建材光电材料有限公司 Laser scribing equipment for power generation glass and scribing method for light transmission line of power generation glass

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050024743A1 (en) * 2003-05-22 2005-02-03 Frederic Camy-Peyret Focusing optic for laser cutting
US20070051706A1 (en) * 2005-09-08 2007-03-08 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
EP1811551A1 (en) * 2004-11-12 2007-07-25 Hamamatsu Photonics K.K. Laser beam machining method and semiconductor chip
EP2186596A1 (en) * 2007-08-03 2010-05-19 Hamamatsu Photonics K.K. Laser working method, laser working apparatus, and its manufacturing method
JP2010158686A (en) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd Optical device for laser processing, laser processing device and laser processing method

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967884A (en) * 1974-11-05 1976-07-06 Eastman Kodak Company Three element objective lens
JPH07117647B2 (en) * 1992-05-25 1995-12-18 シーメンス アクチエンゲゼルシヤフト Scanning objective lens
US6133986A (en) * 1996-02-28 2000-10-17 Johnson; Kenneth C. Microlens scanner for microlithography and wide-field confocal microscopy
US8247731B2 (en) * 2002-02-25 2012-08-21 Board Of Regents Of The University Of Nebraska Laser scribing and machining of materials
CN1328002C (en) * 2002-03-12 2007-07-25 浜松光子学株式会社 Cutting method for workpiece
JP4813985B2 (en) * 2006-06-23 2011-11-09 株式会社ディスコ Wafer processing conditions setting method
WO2008069099A1 (en) * 2006-11-30 2008-06-12 Sumitomo Electric Industries, Ltd. Light condensing optical system, laser processing method and apparatus, and method of manufacturing fragile material
JP2010050175A (en) * 2008-08-20 2010-03-04 Disco Abrasive Syst Ltd Laser processing method and laser processing device
JP5241525B2 (en) * 2009-01-09 2013-07-17 浜松ホトニクス株式会社 Laser processing equipment
CN102639280A (en) * 2009-12-07 2012-08-15 Jp赛席尔联合股份有限公司 Laser processing and cutting system and method
JP5452247B2 (en) * 2010-01-21 2014-03-26 東芝機械株式会社 Laser dicing equipment
JP5614739B2 (en) * 2010-02-18 2014-10-29 国立大学法人埼玉大学 Substrate internal processing apparatus and substrate internal processing method
CN102230983A (en) * 2011-06-17 2011-11-02 山西飞虹激光科技有限公司 Optical element for laser processing and laser processing equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050024743A1 (en) * 2003-05-22 2005-02-03 Frederic Camy-Peyret Focusing optic for laser cutting
EP1811551A1 (en) * 2004-11-12 2007-07-25 Hamamatsu Photonics K.K. Laser beam machining method and semiconductor chip
US20070051706A1 (en) * 2005-09-08 2007-03-08 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
EP2186596A1 (en) * 2007-08-03 2010-05-19 Hamamatsu Photonics K.K. Laser working method, laser working apparatus, and its manufacturing method
JP2010158686A (en) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd Optical device for laser processing, laser processing device and laser processing method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013138802A1 *

Also Published As

Publication number Publication date
EP2825344A1 (en) 2015-01-21
JP2015519722A (en) 2015-07-09
TW201343296A (en) 2013-11-01
KR20140137437A (en) 2014-12-02
CN104334312A (en) 2015-02-04
WO2013138802A1 (en) 2013-09-19

Similar Documents

Publication Publication Date Title
ZA201202034B (en) Cutting tool
SG11201507853QA (en) Laser ablation cell
PL2737791T3 (en) Cutting tool
ZA201304929B (en) A pouch with laser scoring
PL2540459T3 (en) Cutting tool
EP2825368A4 (en) Hollow tip welding tool
EP2926930A4 (en) Surface-coated cutting tool
PT2877307T (en) Cutting tool and cutting insert with a stopper surface
GB201214856D0 (en) A laser module
PL2708621T3 (en) Laser cladding method
EP2688164A3 (en) Cutting tool with actuated blade guide
PL2667993T3 (en) Cutting tool
EP2939770A4 (en) CUTTING TOOL
EP2752263A4 (en) CUTTING TOOL
GB201106238D0 (en) Weld cladding
EP2939806A4 (en) CUTTING TOOL
EP2868408A4 (en) CUTTING TOOL
PL2780172T3 (en) Laser-marked polymer workpiece
PL3300831T3 (en) Laser cutting method using a nozzle with mobile element having an improved external profile
EP2858788A4 (en) Small diameter cutting tool
EP2823921A4 (en) Cutting tool
EP2810726A4 (en) Holder and cutting tool
IL233733A0 (en) Cutting tool assembly with removable tool head
ZA201400535B (en) Cutter tool
EP2736730A4 (en) A personal scoring tool

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20141009

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20160119

RIC1 Information provided on ipc code assigned before grant

Ipc: B23K 26/04 20060101AFI20160113BHEP

Ipc: B23K 26/53 20140101ALI20160113BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20190226

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20190709