EP2825344A4 - Laserritzen mit simulation von erweiterter tiefe in ein werkstück - Google Patents

Laserritzen mit simulation von erweiterter tiefe in ein werkstück

Info

Publication number
EP2825344A4
EP2825344A4 EP13760572.1A EP13760572A EP2825344A4 EP 2825344 A4 EP2825344 A4 EP 2825344A4 EP 13760572 A EP13760572 A EP 13760572A EP 2825344 A4 EP2825344 A4 EP 2825344A4
Authority
EP
European Patent Office
Prior art keywords
workpiece
laser scribing
extended depth
depth affectation
affectation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13760572.1A
Other languages
English (en)
French (fr)
Other versions
EP2825344A1 (de
Inventor
Jeffrey P Sercel
Marco Mendes
Mathew Hannon
Dadelszen Michael Von
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IPG Microsystems LLC
Original Assignee
IPG Microsystems LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US13/422,190 external-priority patent/US20120234807A1/en
Application filed by IPG Microsystems LLC filed Critical IPG Microsystems LLC
Publication of EP2825344A1 publication Critical patent/EP2825344A1/de
Publication of EP2825344A4 publication Critical patent/EP2825344A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • B23K2101/35—Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
EP13760572.1A 2012-03-16 2013-03-18 Laserritzen mit simulation von erweiterter tiefe in ein werkstück Withdrawn EP2825344A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/422,190 US20120234807A1 (en) 2009-12-07 2012-03-16 Laser scribing with extended depth affectation into a workplace
PCT/US2013/032781 WO2013138802A1 (en) 2012-03-16 2013-03-18 Laser scribing with extended depth affectation into a workpiece

Publications (2)

Publication Number Publication Date
EP2825344A1 EP2825344A1 (de) 2015-01-21
EP2825344A4 true EP2825344A4 (de) 2016-02-17

Family

ID=49161885

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13760572.1A Withdrawn EP2825344A4 (de) 2012-03-16 2013-03-18 Laserritzen mit simulation von erweiterter tiefe in ein werkstück

Country Status (6)

Country Link
EP (1) EP2825344A4 (de)
JP (1) JP2015519722A (de)
KR (1) KR20140137437A (de)
CN (1) CN104334312A (de)
TW (1) TW201343296A (de)
WO (1) WO2013138802A1 (de)

Families Citing this family (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
US9701564B2 (en) 2013-01-15 2017-07-11 Corning Incorporated Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
ES2908956T3 (es) * 2013-04-04 2022-05-04 Lpkf Laser & Electronics Ag Procedimiento para introducir rupturas en un sustrato
RU2551043C1 (ru) * 2013-11-07 2015-05-20 Общество С Ограниченной Ответственностью "Оптосистемы" Способ и устройство формирования прецизионных отверстий в оптически прозрачной пленке сверхкоротким импульсом лазерного излучения
US10005152B2 (en) * 2013-11-19 2018-06-26 Rofin-Sinar Technologies Llc Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9687936B2 (en) 2013-12-17 2017-06-27 Corning Incorporated Transparent material cutting with ultrafast laser and beam optics
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
TWI730945B (zh) 2014-07-08 2021-06-21 美商康寧公司 用於雷射處理材料的方法與設備
MX2017000440A (es) * 2014-07-11 2017-08-16 Corning Inc Sistemas y metodos para cortado de vidrio al inducir perforaciones por láser pulsado en artículos de vidrio.
US9617180B2 (en) 2014-07-14 2017-04-11 Corning Incorporated Methods and apparatuses for fabricating glass articles
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
WO2016010949A1 (en) 2014-07-14 2016-01-21 Corning Incorporated Method and system for forming perforations
EP3169479B1 (de) 2014-07-14 2019-10-02 Corning Incorporated Verfahren und system zum stoppen von inzidenter rissausbreitung in einem transparenten material
KR20170028943A (ko) 2014-07-14 2017-03-14 코닝 인코포레이티드 조정가능한 레이저 빔 촛점 라인을 사용하여 투명한 재료를 처리하는 방법 및 시스템
JP2016058429A (ja) * 2014-09-05 2016-04-21 株式会社ディスコ ウエーハの加工方法
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
EP3221727B1 (de) * 2014-11-19 2021-03-17 Trumpf Laser- und Systemtechnik GmbH System zur asymmetrischen optischen strahlformung
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US20160158890A1 (en) * 2014-12-05 2016-06-09 Solarcity Corporation Systems and methods for scribing photovoltaic structures
US9899546B2 (en) 2014-12-05 2018-02-20 Tesla, Inc. Photovoltaic cells with electrodes adapted to house conductive paste
CN107406293A (zh) 2015-01-12 2017-11-28 康宁股份有限公司 使用多光子吸收方法来对经热回火的基板进行激光切割
US11773004B2 (en) 2015-03-24 2023-10-03 Corning Incorporated Laser cutting and processing of display glass compositions
KR20170131638A (ko) 2015-03-27 2017-11-29 코닝 인코포레이티드 가스 투과성 유리창 및 이의 제작방법
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
CN106392334B (zh) * 2015-07-29 2020-01-07 大族激光科技产业集团股份有限公司 一种透明硬脆材料激光贯穿切割装置以及切割方法
JP6549014B2 (ja) * 2015-10-13 2019-07-24 株式会社ディスコ 光デバイスウエーハの加工方法
CN108367387B (zh) * 2015-12-22 2021-12-07 贺利氏德国有限责任两合公司 使用皮秒激光生产金属陶瓷基材的方法
JP6369454B2 (ja) * 2015-12-24 2018-08-08 トヨタ自動車株式会社 レーザー溶接装置
JP6938543B2 (ja) 2016-05-06 2021-09-22 コーニング インコーポレイテッド 透明基板からの、輪郭設定された形状のレーザ切断及び取り外し
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10981251B2 (en) 2016-06-08 2021-04-20 Han's Laser Technology Industry Group Co., Ltd Method and device for cutting sapphire
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
KR20190035805A (ko) 2016-07-29 2019-04-03 코닝 인코포레이티드 레이저 처리를 위한 장치 및 방법
KR102423775B1 (ko) 2016-08-30 2022-07-22 코닝 인코포레이티드 투명 재료의 레이저 가공
US10730783B2 (en) 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
KR102428350B1 (ko) 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
CN106425112B (zh) * 2016-11-02 2018-11-06 国神光电科技（上海）有限公司 一种激光划片的方法及系统
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
KR102596305B1 (ko) * 2017-11-20 2023-10-30 아이피지 포토닉스 코포레이션 재료의 가공을 위한 시스템 및 방법 레이저
CN107945136B (zh) * 2017-12-04 2021-09-24 深圳市路畅科技股份有限公司 一种鱼眼图像矫正方法、系统、设备及计算机存储介质
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11850679B2 (en) 2017-12-29 2023-12-26 Corelase Oy Laser processing apparatus and method
DE102018126381A1 (de) * 2018-02-15 2019-08-22 Schott Ag Verfahren und Vorrichtung zum Einfügen einer Trennlinie in ein transparentes sprödbrüchiges Material, sowie verfahrensgemäß herstellbares, mit einer Trennlinie versehenes Element
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
CN111151895A (zh) * 2020-01-13 2020-05-15 大族激光科技产业集团股份有限公司 一种利用成丝效应切割透明材料的工艺及系统
CN111215768B (zh) * 2020-01-16 2021-03-30 吉林大学 利用反球差校正进行纵向加工的方法及应用
TWI794589B (zh) * 2020-02-21 2023-03-01 海納光電股份有限公司 硬脆板材高溫環境加工裝置及方法
DE102021100675B4 (de) 2021-01-14 2022-08-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Verfahren zum Zerteilen eines transparenten Werkstücks
CN113732511B (zh) * 2021-08-30 2023-01-06 中国科学院西安光学精密机械研究所 光纤表面包层微纳结构飞秒激光加工方法及装置
CN120286871B (zh) * 2025-06-13 2025-08-26 邯郸中建材光电材料有限公司 发电玻璃激光刻划设备及发电玻璃透光线刻划方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050024743A1 (en) * 2003-05-22 2005-02-03 Frederic Camy-Peyret Focusing optic for laser cutting
US20070051706A1 (en) * 2005-09-08 2007-03-08 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
EP1811551A1 (de) * 2004-11-12 2007-07-25 Hamamatsu Photonics K.K. Laserstrahl-bearbeitungsverfahren und halbleiterchip
EP2186596A1 (de) * 2007-08-03 2010-05-19 Hamamatsu Photonics K.K. Laserbearbeitungsverfahren, laserbearbeitungsvorrichtung und herstellungsverfahren dafür
JP2010158686A (ja) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd レーザ加工用光学装置、レーザ加工装置およびレーザ加工方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3967884A (en) * 1974-11-05 1976-07-06 Eastman Kodak Company Three element objective lens
JPH07117647B2 (ja) * 1992-05-25 1995-12-18 シーメンス アクチエンゲゼルシヤフト 走査対物レンズ
US6133986A (en) * 1996-02-28 2000-10-17 Johnson; Kenneth C. Microlens scanner for microlithography and wide-field confocal microscopy
US8247731B2 (en) * 2002-02-25 2012-08-21 Board Of Regents Of The University Of Nebraska Laser scribing and machining of materials
AU2003211581A1 (en) * 2002-03-12 2003-09-22 Hamamatsu Photonics K.K. Method of cutting processed object
JP4813985B2 (ja) * 2006-06-23 2011-11-09 株式会社ディスコ ウエーハの加工条件設定方法
EP2105239B1 (de) * 2006-11-30 2016-01-13 Sumitomo Electric Industries, Ltd. Optisches lichtkondensiersystem. laserbearbeitungsverfahren und -vorrichtung und verfahren zur herstellung von zerbrechlichem material
JP2010050175A (ja) * 2008-08-20 2010-03-04 Disco Abrasive Syst Ltd レーザー加工方法及びレーザー加工装置
JP5241525B2 (ja) * 2009-01-09 2013-07-17 浜松ホトニクス株式会社 レーザ加工装置
US20110132885A1 (en) * 2009-12-07 2011-06-09 J.P. Sercel Associates, Inc. Laser machining and scribing systems and methods
JP5452247B2 (ja) * 2010-01-21 2014-03-26 東芝機械株式会社 レーザダイシング装置
JP5614739B2 (ja) * 2010-02-18 2014-10-29 国立大学法人埼玉大学 基板内部加工装置および基板内部加工方法
CN102230983A (zh) * 2011-06-17 2011-11-02 山西飞虹激光科技有限公司 用于激光加工的光学元件及激光加工设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050024743A1 (en) * 2003-05-22 2005-02-03 Frederic Camy-Peyret Focusing optic for laser cutting
EP1811551A1 (de) * 2004-11-12 2007-07-25 Hamamatsu Photonics K.K. Laserstrahl-bearbeitungsverfahren und halbleiterchip
US20070051706A1 (en) * 2005-09-08 2007-03-08 Imra America, Inc. Transparent material processing with an ultrashort pulse laser
EP2186596A1 (de) * 2007-08-03 2010-05-19 Hamamatsu Photonics K.K. Laserbearbeitungsverfahren, laserbearbeitungsvorrichtung und herstellungsverfahren dafür
JP2010158686A (ja) * 2009-01-06 2010-07-22 Disco Abrasive Syst Ltd レーザ加工用光学装置、レーザ加工装置およびレーザ加工方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013138802A1 *

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KR20140137437A (ko) 2014-12-02
JP2015519722A (ja) 2015-07-09
EP2825344A1 (de) 2015-01-21
TW201343296A (zh) 2013-11-01
WO2013138802A1 (en) 2013-09-19

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