EP2853350A4 - Tampon à polir et son procédé de fabrication - Google Patents

Tampon à polir et son procédé de fabrication

Info

Publication number
EP2853350A4
EP2853350A4 EP13793745.4A EP13793745A EP2853350A4 EP 2853350 A4 EP2853350 A4 EP 2853350A4 EP 13793745 A EP13793745 A EP 13793745A EP 2853350 A4 EP2853350 A4 EP 2853350A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
same
polishing pad
polishing
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13793745.4A
Other languages
German (de)
English (en)
Other versions
EP2853350A1 (fr
Inventor
Bong-Su Ahn
Young-Jun Jang
Jin-Su Jeong
Sang-Mok Lee
Kee-Cheon Song
Seung-Geun Kim
Jang-Won Seo
Jeong-Seon Choo
Hak-Su Kang
Gyoung-Pyo Kong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
KPX CHEMICAL CO Ltd
Original Assignee
Samsung Electronics Co Ltd
KPX CHEMICAL CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd, KPX CHEMICAL CO Ltd filed Critical Samsung Electronics Co Ltd
Publication of EP2853350A1 publication Critical patent/EP2853350A1/fr
Publication of EP2853350A4 publication Critical patent/EP2853350A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
    • B24D3/16—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for close-grained structure, i.e. of high density
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP13793745.4A 2012-05-23 2013-02-12 Tampon à polir et son procédé de fabrication Withdrawn EP2853350A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020120054523A KR101417274B1 (ko) 2012-05-23 2012-05-23 연마패드 및 그 제조방법
PCT/KR2013/001085 WO2013176378A1 (fr) 2012-05-23 2013-02-12 Tampon à polir et son procédé de fabrication

Publications (2)

Publication Number Publication Date
EP2853350A1 EP2853350A1 (fr) 2015-04-01
EP2853350A4 true EP2853350A4 (fr) 2016-01-13

Family

ID=49624027

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13793745.4A Withdrawn EP2853350A4 (fr) 2012-05-23 2013-02-12 Tampon à polir et son procédé de fabrication

Country Status (7)

Country Link
US (1) US20150133039A1 (fr)
EP (1) EP2853350A4 (fr)
JP (1) JP5959724B2 (fr)
KR (1) KR101417274B1 (fr)
CN (1) CN104507641B (fr)
SG (1) SG11201407257TA (fr)
WO (1) WO2013176378A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112014003158B4 (de) 2013-07-05 2022-12-15 Asahi Kasei Chemicals Corporation Elektrisches Bauteil, umfassend ein Isolierharz-Formteil, sowie Verfahren zur Stabilisierung der Flammhemmung
CN104802099B (zh) * 2015-05-04 2017-07-21 华侨大学 一种具有大容屑腔的磨块、其制备方法及应用
SG11201704554SA (en) * 2016-04-06 2017-11-29 Kpx Chemical Co Ltd Method of manufacturing polishing pad
KR101894071B1 (ko) 2016-11-03 2018-08-31 에스케이씨 주식회사 연마패드 제조용 자외선 경화형 수지 조성물, 연마패드 및 이의 제조방법
KR102608960B1 (ko) * 2016-12-05 2023-12-01 삼성전자주식회사 집적회로 소자 제조용 연마 패드의 제조 방법
KR102088919B1 (ko) * 2017-09-11 2020-03-13 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
WO2019050365A1 (fr) * 2017-09-11 2019-03-14 에스케이씨 주식회사 Tampon de polissage en polyuréthane poreux et son procédé de fabrication
KR101949911B1 (ko) * 2017-09-11 2019-02-19 에스케이씨 주식회사 다공성 폴리우레탄 연마패드 및 이의 제조방법
CN109080061B (zh) * 2018-07-25 2021-06-11 南通德亿新材料有限公司 一种热塑性弹性体发泡颗粒浇注成型工艺
CN109093538A (zh) * 2018-08-24 2018-12-28 成都时代立夫科技有限公司 一种cmp抛光垫表面处理工艺
KR102502516B1 (ko) * 2021-03-12 2023-02-23 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
CN113414705B (zh) * 2021-07-12 2022-07-29 苏州赛尔特新材料有限公司 一种大尺寸双层柔性抛光垫及制备方法与应用
WO2023034573A1 (fr) * 2021-09-02 2023-03-09 Cmc Materials, Inc. Tampon cmp texturé comprenant des particules polymères
KR102594068B1 (ko) * 2021-10-12 2023-10-24 에스케이엔펄스 주식회사 연마패드 및 이를 이용한 반도체 소자의 제조방법
US20240181597A1 (en) * 2022-12-01 2024-06-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Dual-layer cmp polishing subpad

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1175965A2 (fr) * 2000-07-25 2002-01-30 Ebara Corporation Outil de polissage, procédé de fabrication d'un tel outil, appareil de polissage d'une plaquette semiconductrice et procédé de polissage d'un substrat
EP1201368A2 (fr) * 2000-10-24 2002-05-02 JSR Corporation Composition pour tampon de polissage, produit réticulé pour tampon de polissage, tampon de polissage ainsi réalisé et son procédé de fabrication
EP1357161A2 (fr) * 2002-04-22 2003-10-29 JSR Corporation Dispersion aqueuse pour polissage chimio-mécanique
US20030220061A1 (en) * 2002-05-23 2003-11-27 Cabot Microelectronics Corporation Microporous polishing pads
WO2004076127A1 (fr) * 2003-02-21 2004-09-10 Dow Global Technologies Inc. Procede de fabrication d'un materiau abrasif fixe
WO2010053729A1 (fr) * 2008-11-04 2010-05-14 Guiselin Olivier L Article abrasif revêtu pour applications de polissage ou de rodage et système et procédé pour sa production
WO2011041438A2 (fr) * 2009-09-30 2011-04-07 Applied Materials, Inc. Tampon de planarisation chimico-mécanique présentant des caractéristiques de surface

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2216728A (en) * 1935-12-31 1940-10-08 Carborundum Co Abrasive article and method of making the same
US2901337A (en) * 1956-07-31 1959-08-25 Union Carbide Corp Abrasive articles and method of making the same
MY114512A (en) 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5441549A (en) * 1993-04-19 1995-08-15 Minnesota Mining And Manufacturing Company Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
KR20010055971A (ko) * 1999-12-13 2001-07-04 김진우 연마 패드
KR100707407B1 (ko) * 2000-06-13 2007-04-13 도요 고무 고교 가부시키가이샤 폴리우레탄 발포체의 제조방법, 폴리우레탄 발포체 및연마 시트
JP2003011066A (ja) * 2000-07-25 2003-01-15 Ebara Corp 研磨工具及びその製造方法
US7632434B2 (en) * 2000-11-17 2009-12-15 Wayne O. Duescher Abrasive agglomerate coated raised island articles
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
US7074115B2 (en) * 2003-10-09 2006-07-11 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad
US6986705B2 (en) * 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
TW200734379A (en) * 2005-10-31 2007-09-16 Kure Norton Co Ltd Method of manufacturing resin bonding grinding wheel
JP4873667B2 (ja) * 2009-09-18 2012-02-08 東洋ゴム工業株式会社 研磨パッド
KR101080572B1 (ko) 2009-09-29 2011-11-04 삼성전자주식회사 연마 패드 및 그 제조방법
KR100986969B1 (ko) * 2010-01-29 2010-10-11 차윤종 연마 패드용 대전방지성 폴리우레탄 다공질체 및 그 제조 방법 및 이를 이용한 연마패드

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1175965A2 (fr) * 2000-07-25 2002-01-30 Ebara Corporation Outil de polissage, procédé de fabrication d'un tel outil, appareil de polissage d'une plaquette semiconductrice et procédé de polissage d'un substrat
EP1201368A2 (fr) * 2000-10-24 2002-05-02 JSR Corporation Composition pour tampon de polissage, produit réticulé pour tampon de polissage, tampon de polissage ainsi réalisé et son procédé de fabrication
EP1357161A2 (fr) * 2002-04-22 2003-10-29 JSR Corporation Dispersion aqueuse pour polissage chimio-mécanique
US20030220061A1 (en) * 2002-05-23 2003-11-27 Cabot Microelectronics Corporation Microporous polishing pads
WO2004076127A1 (fr) * 2003-02-21 2004-09-10 Dow Global Technologies Inc. Procede de fabrication d'un materiau abrasif fixe
WO2010053729A1 (fr) * 2008-11-04 2010-05-14 Guiselin Olivier L Article abrasif revêtu pour applications de polissage ou de rodage et système et procédé pour sa production
WO2011041438A2 (fr) * 2009-09-30 2011-04-07 Applied Materials, Inc. Tampon de planarisation chimico-mécanique présentant des caractéristiques de surface

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013176378A1 *

Also Published As

Publication number Publication date
SG11201407257TA (en) 2014-12-30
JP2015514598A (ja) 2015-05-21
CN104507641B (zh) 2018-01-05
CN104507641A (zh) 2015-04-08
KR101417274B1 (ko) 2014-07-09
US20150133039A1 (en) 2015-05-14
WO2013176378A1 (fr) 2013-11-28
EP2853350A1 (fr) 2015-04-01
JP5959724B2 (ja) 2016-08-02
KR20130130893A (ko) 2013-12-03

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20141028

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AX Request for extension of the european patent

Extension state: BA ME

RIN1 Information on inventor provided before grant (corrected)

Inventor name: KIM, SEUNG-GEUN

Inventor name: KANG, HAK-SU

Inventor name: LEE, SANG-MOK

Inventor name: JEONG, JIN-SU

Inventor name: SONG, KEE-CHEON

Inventor name: SEO, JANG-WON

Inventor name: AHN, BONG-SU

Inventor name: KONG, GYOUNG-PYO

Inventor name: JANG, YOUNG-JUN

Inventor name: CHOO, JEONG-SEON

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20151216

RIC1 Information provided on ipc code assigned before grant

Ipc: B24D 3/16 20060101ALI20151210BHEP

Ipc: B24D 11/00 20060101AFI20151210BHEP

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Effective date: 20181220

STAA Information on the status of an ep patent application or granted ep patent

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Effective date: 20190501