EP2864432A2 - Substance adhésive et à couler thermoconductrice - Google Patents

Substance adhésive et à couler thermoconductrice

Info

Publication number
EP2864432A2
EP2864432A2 EP13829435.0A EP13829435A EP2864432A2 EP 2864432 A2 EP2864432 A2 EP 2864432A2 EP 13829435 A EP13829435 A EP 13829435A EP 2864432 A2 EP2864432 A2 EP 2864432A2
Authority
EP
European Patent Office
Prior art keywords
heat
casting compound
conductive adhesive
thermally conductive
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP13829435.0A
Other languages
German (de)
English (en)
Inventor
Thomas GÖTZ
Wolfgang Kleiner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GOETZ, THOMAS
Kleiner Wolfgang
Zehnder Group International AG
Original Assignee
Zehnder Verkaufs und Verwaltungs AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zehnder Verkaufs und Verwaltungs AG filed Critical Zehnder Verkaufs und Verwaltungs AG
Priority to EP19155595.2A priority Critical patent/EP3508540A3/fr
Priority to EP13829435.0A priority patent/EP2864432A2/fr
Publication of EP2864432A2 publication Critical patent/EP2864432A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • C09J1/02—Adhesives based on inorganic constituents containing water-soluble alkali silicates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/122—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0089—Systems using radiation from walls or panels
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency

Definitions

  • the invention relates to a thermally conductive adhesive and casting compound for joining components.
  • Thermally conductive adhesive and casting compounds are known in the art. They are used in particular for the production of heat-conducting plates, that is to produce connections between heat-conducting components such as pipes, sheets or ribs. In this case, in particular heat-conductive materials are used, which have a high thermal conductivity and are simultaneously flowable and moldable, so that the components to be connected can be positively embedded therein.
  • thermally conductive adhesive and casting compound is a mass of a thermally highly conductive material. This contains in particular carbon, which also graphite, foam graphite and the like come into question.
  • the thermally conductive material can either be in a pourable state and poured into the mold, or poured as a loose material into the mold and compacted or pulped.
  • thermally conductive materials are, for example, sheets of graphite foam.
  • the publication OE 19844 617 A1 discloses, for example, an arrangement for the air conditioning of rooms, which consists of climate panels, which have a body made of mineral material and a meandering curved pipe register embedded therein.
  • the mineral material consists of a hydrate mixture of various hydrate stages and mineralogical and / or metallic additives with dense structure.
  • Hydrate mixture can include calcium sulfate, calcium carbonate or
  • the metallic additives may, for example, be granular or powdered copper or copper alloys.
  • the meandering curved tube register is pressed into the hydrate mixture and can thus be coupled in a fluid-conducting manner with the tube registers of adjacent climate plates.
  • the heat-conducting connection takes place via positive contacting benacfibarter "Kiimaplatten.
  • the publication OE 20 2004 002 089 U1 shows a heating element in sandwich construction, in which heating tubes in a thermally conductive, filled with different materials
  • plastic composite layer are pressed.
  • the plastic composite layer has a rigid polyurethane foam filled with heat-conducting material, which contains thermally conductive particles of carbon black, graphite, aluminum powder, aluminum oxide, iron and / or silicate particles.
  • the pipe system is embedded form-fitting.
  • heat exchanger elements are used for heating and / or cooling bodies, comparatively much energy is lost in the transition from the pipe register to the rat.
  • the invention proposes a thermally conductive Ktebe- and casting compound, which has a filler material and a binder, wherein the
  • Filler material has one or more thermally conductive substances, and wherein the binder is an alkali silicate.
  • a binder to the heat-conductive substances having filler material can be a particularly adherent and thermally conductive connection of the components to achieve the adhesive and casting compound.
  • the binder ensures a high adhesion between the adjacent surfaces.
  • the invention provides that the binder is an alkali silicate. Since the heat-conducting components mostly have metallic surfaces, a binder is suitable which forms an active chemical compound with them.
  • the invention is based on the finding that metallic surfaces usually have coatings of metal oxides. If the selected alkali metal silicate now forms a chemical compound to these metal oxide coatings, the desired strong adhesive forces can be achieved.
  • the solution according to the invention can also be used for plastic components.
  • the alkali silicate is then selected so that it forms a chemical compound to the respective plastic.
  • the combination of filling material and binder can produce a
  • Total mass are provided, which has both a high thermal conductivity and a high adhesive force.
  • the binder may be an alkali silicate
  • the proposed alkali silicates are generally known under the name "water glasses".
  • Water glasses have different proportions and types of alkali oxides. Differences are, for example, sodium water glasses and potassium water glasses.
  • Na 2 SiO 3 is a water-bright, oily liquid, which reacts alkaline. In contact with air, this liquid solidifies gradually to a hard, glassy mass.
  • Potassium water glass, chemical formula K 2 SiO 3 has very similar properties as sodium water glass.
  • Water glasses are, as the name implies, related to real glass. Accordingly, the expected thermal conductivity of the pure binder water glass at about 1 W / mK.
  • the water glass used as a binder contains components that enter into an active chemical compound with the surface material of the components to be joined and thus ensure a very good surface connection and thus connection of the components. Decisive for this good surface connection is the alkaline environment of the aqueous water glasses, which leads, for example in the case of metal tube registers to a corresponding chemical activation of the metallic surfaces.
  • the chemical components of the binder penetrate quasi-diffusion into the oxide skins of the metals and settle there in the oxide structure.
  • the invention uses the knowledge that metallic surfaces always have coatings or layers of different metal oxides. This is the basis for a stable and permanent formation of the connection between the adhesive and casting compound according to the invention and the metallic surface.
  • water glasses used as binders wet the filling material and, after drying, also bind it firmly into the mass compound. Overall, a particularly strong connection can be created.
  • the invention may provide that the binder comprises a water-soluble, plastic-containing adhesive.
  • the so-called dispersion adhesives serve as a replacement for the water glass-containing binder.
  • Dispersion adhesives are used in various designs for other construction purposes.
  • other adhesive mixtures such as, for example, reactive resins, are also possible as binders for the heat-conducting material. Binders of this type are particularly suitable when the components to be joined are made of plastic or contain plastic.
  • the invention provides that the heat-conducting substances a
  • the filling material of the adhesive and casting compound is intended to produce a high heat transfer rate between adjacent surfaces.
  • the heat transfer rate should It should also be particularly high, especially with only small temperature differences between adjacent surfaces.
  • materials are required which have a thermal conductivity between 5 and 20 W / mK. These include substances such as aluminum, copper or even steel.
  • both high thermal conductivity and particularly high adhesive strength can be achieved by the heat-conducting adhesive and casting compound consisting of filler material and binder.
  • the heat-conducting substances are formed as fibers, chips, grains and / or powder.
  • the filling material in such a "particle form”
  • a particularly good miscibility with the binder can be achieved.
  • the metallic substances which are particularly advantageous may be "waste substances" from the machining
  • the chips have a thickness of about 0.1 mm to about 0.5 mm and a length of about 0.1 mm to 30 mm.
  • the heat-conducting substances may also have one or more non-metallic substances.
  • the non-metallic substance may be graphite.
  • the excellent thermal conductivity of non-metallic substances can be used. Decisive for achieving a good thermal conductivity is always the good contact between the heat-conductive adhesive and casting compound and the metallic surface.
  • the particle size of the admixed metallic or even non-metallic components is always essential. Grain sizes of 5 ⁇ m to 300 ⁇ m are particularly advantageous on the example of graphite. As a rule, however, mixtures of different particle sizes, with a corresponding particle size spectrum, are used.
  • the filler may also comprise cellulosic fibers.
  • the cellulose fibers serve to increase the strength of the thermally conductive adhesive and casting compound.
  • Cellulosic fibers consist of multiple sugar molecules whose surface structure is such as to provide an optimal bond between cellulose fibers and cellulose fibers
  • Typical addition amounts are in the range of 0.5 to 10 mass percent.
  • Typical fiber lengths of the added cellulose fibers are in the range from 20 .mu.m to 2000 .mu.m.
  • the filler may comprise a water-soluble, plastic-containing adhesive.
  • dispersion adhesive or styrene acrylates a considerable improvement in the ductility of the adhesive and casting compound according to the invention can be achieved.
  • additions of mica, talc, kaolin and / or porcelain flour within the filling material are also conceivable. Mica is particularly advantageously added in amounts of about 10 percent by mass, talc in an amount of 6 to 7 percent by mass and kaolin or porcelain flour in an amount of 0.5 to 10 percent by mass
  • the heat-conductive adhesive and casting compound according to the invention may likewise comprise a solvent.
  • the solvent gives the adhesive and casting compound a processing consistency which makes it possible to join the components to be joined in such a way that only minimal cavities, imperfections or voids are created. Only so can
  • thermally conductive filling materials and the required binder by the addition of the appropriate solvent within a mixing process in a pasty, if desired also liquid-like, state are brought. This allows a technically simple processing and optimum connection of the heat-conducting components depending on the application.
  • the thermally conductive adhesive and casting compound may comprise a hydrophobizing agent.
  • the hydrophobing agent comprises an organosilicon compound.
  • the hydrophobing agent may be alkoxysilanes ("silanes”), alkoxysiloxanes (“siloxanes”),
  • Alkylpolysiloxanes (“silicone resins") or Alkalisiliconate have been described.
  • alkoxysilanes admixed as the water repellents of the composition and / or
  • Alkoxysiloxanes react with water molecules of the alkali metal silicate (water glass)
  • Silicone resin solidifies after the solvent has volatilized.
  • the alkali metal siliconate admixed as a water repellent also reacts with CO 2 from the air to form silicone resin.
  • alkoxysilanes and / or alkoxysiloxanes
  • silanes can be used in one dissolved organic solvent or mixed by means of an emulsifier as an emulsion in water of the mass.
  • the emulsion can be used as a low-viscosity emulsion
  • the hydrophobing makes the thermally conductive adhesive and casting water repellent, whereby penetration of water molecules in the alkali silicate matrix and their
  • the invention continues to provide
  • the invention provides a method for producing a heat conduction plate, wherein one or more components in a flowable, thermally conductive adhesive and casting compound which a filler of one or more thermally conductive substances and a binder of an alkali silicate and / or a water-soluble, plastic-containing adhesive has to be embedded, and being the flowable
  • thermally conductive adhesive and casting compound then hardens upon contact with ambient air.
  • the invention thus provides a total of a thermally conductive adhesive and casting compound for the connection of components, which has the following advantages over the prior art: particularly high adhesive forces by chemical bonding between the alkali silicate or the water-soluble, plastic-containing adhesive and the surface of connecting components,
  • Voids, pores, etc. between the surfaces to be joined are avoided, toxic or environmentally harmful substances, such as used in soldering, are completely eliminated, the investment costs are very low,
  • Filling material, binders and solvents are particularly easy to mix.
  • thermally conductive substances having a particularly high thermal conductivity.
  • These substances are advantageously aluminum, copper and / or steel.
  • the substances are used in the form of fibers, chips, grains and / or as a powder. They have a thickness of about 0.1 mm to 0.5 mm and a length of about 0.1 mm to 30 mm.
  • the metallic substances can be further mixed with a non-metallic substance, such as graphite, so that overall a high thermal conductivity between 5 and 20 W / mK is formed.
  • the filler can also be consolidated with cellulosic fibers. Typical additives are in the range of 0.5 to 10 percent by mass. Typical fiber lengths of the added cellulose fibers are in the
  • the filler can also have a water-soluble, plastic-containing adhesive and / or materials such as mica, talc, kaolin and / or porcelain flour have.
  • the filler material is then mixed with the binder according to the invention.
  • the binder is adjusted to the surface to be joined.
  • an alkali metal silicate such as Na 2 SiO 3 or K 2 SiO 3 is suitable.
  • the binder may also comprise a water-soluble, plastic-containing adhesive, for example a dispersion adhesive.
  • a filler is preferably additionally added to the filler and the binding material.
  • the mixture can be brought into a pasty or even liquid-like state particularly easily by means of a mixing process.
  • the heat-conducting adhesive and casting compound according to the invention is placed in a casting mold and then the components are embedded therein, so that the adhesive and
  • Casting compound is in contact with all surface areas of the components.
  • water glasses used within the filling material can be an active, chemical compound to those existing on the metallic surfaces of the components
  • Metal oxide layers are produced. Due to the alkaline environment of the aqueous
  • Water glasses creates a chemical activation of the metallic surfaces, whereby the chemical components of the water glasses penetrate diffusion-like into the oxide skins of the metals and embed themselves there in the oxide structure. As a result, the particularly strong bond between the adhesive and casting compound and the metallic surface of the component is achieved. Since the filling material of the adhesive and casting compound furthermore has metallic and also non-metallic substances with high thermal conductivity, the adhesive parts also have a particularly high thermal conductivity. This results in a continuous, heat-conducting connection between the heat-conductive adhesive and casting compound and the embedded components, ie the tube register.
  • the composition according to the invention sc can penetrate into the transition regions between the casting compound and components in such a way that only minimal cavities, imperfections or voids are formed. This ensures that, with regard to the heat flow between the components no insulating defects are installed, which reduce the heat flow, especially at low Temperature differences, would result.
  • heat exchangers independently of a predetermined casting mold. It is not a standardized mold provided with tube registers and connections, poured out and then removed the finished molded body of the mold, but it can be poured at will each existing hollow body and serve as a heat exchanger in the poured state. This makes it possible, for example,

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne des substances adhésives et à couler thermoconductrices. Les substances adhésives et à couler sont utilisées pour y encastrer par exemple un réseau de tubes et former ainsi une plaque thermoconductrice. L'objet de la présente invention est la création d'une liaison particulièrement adhésive et simultanément thermoconductrice entre la substance à couler et le réseau de tubes. À cet effet, la substance adhésive et à couler thermoconductrice selon l'invention contient une matière de charge et un liant, la matière de charge contenant une ou plusieurs substances thermoconductrices et le lient étant un silicate alcalin.
EP13829435.0A 2012-06-22 2013-06-24 Substance adhésive et à couler thermoconductrice Withdrawn EP2864432A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP19155595.2A EP3508540A3 (fr) 2012-06-22 2013-06-24 Matière de coulée et adhésive à conduction thermique
EP13829435.0A EP2864432A2 (fr) 2012-06-22 2013-06-24 Substance adhésive et à couler thermoconductrice

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP12173195.4A EP2677011B1 (fr) 2012-06-22 2012-06-22 Masse de coulée et masse adhésive à conduction thermique
PCT/IB2013/001326 WO2014027230A2 (fr) 2012-06-22 2013-06-24 Substance adhésive et à couler thermoconductrice
EP13829435.0A EP2864432A2 (fr) 2012-06-22 2013-06-24 Substance adhésive et à couler thermoconductrice

Related Child Applications (1)

Application Number Title Priority Date Filing Date
EP19155595.2A Division EP3508540A3 (fr) 2012-06-22 2013-06-24 Matière de coulée et adhésive à conduction thermique

Publications (1)

Publication Number Publication Date
EP2864432A2 true EP2864432A2 (fr) 2015-04-29

Family

ID=46354062

Family Applications (3)

Application Number Title Priority Date Filing Date
EP12173195.4A Active EP2677011B1 (fr) 2012-06-22 2012-06-22 Masse de coulée et masse adhésive à conduction thermique
EP19155595.2A Withdrawn EP3508540A3 (fr) 2012-06-22 2013-06-24 Matière de coulée et adhésive à conduction thermique
EP13829435.0A Withdrawn EP2864432A2 (fr) 2012-06-22 2013-06-24 Substance adhésive et à couler thermoconductrice

Family Applications Before (2)

Application Number Title Priority Date Filing Date
EP12173195.4A Active EP2677011B1 (fr) 2012-06-22 2012-06-22 Masse de coulée et masse adhésive à conduction thermique
EP19155595.2A Withdrawn EP3508540A3 (fr) 2012-06-22 2013-06-24 Matière de coulée et adhésive à conduction thermique

Country Status (3)

Country Link
EP (3) EP2677011B1 (fr)
PL (1) PL2677011T3 (fr)
WO (1) WO2014027230A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2782787C1 (ru) * 2021-10-20 2022-11-02 Акционерное общество "Научно-производственное предприятие "Алмаз" (АО "НПП "Алмаз") Клей

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102016205178A1 (de) * 2016-03-30 2017-10-05 Siemens Aktiengesellschaft Kleber zur Verbindung einer leistungselektronischen Baugruppe mit einem Kühlkörper und Verbund daraus

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DE4225861A1 (de) * 1992-08-06 1994-04-07 Mueller Michaela Dübelmasse, Verwendung eines härtbaren Compounds aus Wasserglas, Härtungsmitteln für Wasserglas und aktiven Zuschlagstoffen als Kleber für Ankerstäbe und Dübel
DE102007004953A1 (de) * 2007-01-26 2008-07-31 Tesa Ag Heizelement
CN101591516A (zh) * 2008-05-28 2009-12-02 北京科技桥科贸有限公司 水玻璃胶粘剂
WO2011080338A1 (fr) * 2009-12-31 2011-07-07 Sgl Carbon Se Dispositif de thermorégulation d'une pièce

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EP0133631A1 (fr) * 1983-08-08 1985-03-06 Devon County Council Elément échangeur de chaleur et système de chauffage ou de réfrigération sous-sol utilisant cet élément
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EP1669682B1 (fr) * 2004-12-07 2014-07-16 Götz, Thomas Composition de fibres et utilisation et procédé pour la fabrication de cette composition, élément d'échange de chaleur et système d'échange de chaleur et utilisation de cet système
JP5176878B2 (ja) * 2008-11-04 2013-04-03 横浜ゴム株式会社 熱伝導性エマルジョン
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Publication number Priority date Publication date Assignee Title
DE4225861A1 (de) * 1992-08-06 1994-04-07 Mueller Michaela Dübelmasse, Verwendung eines härtbaren Compounds aus Wasserglas, Härtungsmitteln für Wasserglas und aktiven Zuschlagstoffen als Kleber für Ankerstäbe und Dübel
DE102007004953A1 (de) * 2007-01-26 2008-07-31 Tesa Ag Heizelement
CN101591516A (zh) * 2008-05-28 2009-12-02 北京科技桥科贸有限公司 水玻璃胶粘剂
WO2011080338A1 (fr) * 2009-12-31 2011-07-07 Sgl Carbon Se Dispositif de thermorégulation d'une pièce

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2782787C1 (ru) * 2021-10-20 2022-11-02 Акционерное общество "Научно-производственное предприятие "Алмаз" (АО "НПП "Алмаз") Клей

Also Published As

Publication number Publication date
WO2014027230A2 (fr) 2014-02-20
EP2677011B1 (fr) 2017-10-25
EP3508540A3 (fr) 2019-12-04
WO2014027230A3 (fr) 2014-12-31
EP3508540A2 (fr) 2019-07-10
PL2677011T3 (pl) 2018-04-30
EP2677011A1 (fr) 2013-12-25

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