EP2901714A4 - Circuit intégré dans un dispositif mems - Google Patents

Circuit intégré dans un dispositif mems

Info

Publication number: EP2901714A4
Authority: EP; European Patent Office
Prior art keywords: integrated circuit; mems device; mems; integrated; circuit
Prior art date: 2012-09-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Ceased

Application number

EP13842019.5A

Other languages

German (de)

English (en)

Other versions

EP2901714A1 (fr

Inventor

Sandra F Vos

Daniel Giesecke

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Knowles Electronics LLC

Original Assignee

Knowles Electronics LLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-09-27

Filing date

2013-09-26

Publication date

2016-06-08

2013-09-26 Application filed by Knowles Electronics LLC filed Critical Knowles Electronics LLC

2015-08-05 Publication of EP2901714A1 publication Critical patent/EP2901714A1/fr

2016-06-08 Publication of EP2901714A4 publication Critical patent/EP2901714A4/fr

Status Ceased legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/941—Dispositions of bond pads
- H10W72/9413—Dispositions of bond pads on encapsulations
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/20—Configurations of stacked chips
- H10W90/22—Configurations of stacked chips the stacked chips being on both top and bottom sides of a package substrate, interposer or RDL
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

Physics & Mathematics (AREA)
Engineering & Computer Science (AREA)
Acoustics & Sound (AREA)
Signal Processing (AREA)
Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Micromachines (AREA)

EP13842019.5A 2012-09-27 2013-09-26 Circuit intégré dans un dispositif mems Ceased EP2901714A4 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US201261706350P	2012-09-27	2012-09-27
PCT/US2013/061873 WO2014052559A1 (fr)	2012-09-27	2013-09-26	Circuit intégré dans un dispositif mems

Publications (2)

Publication Number	Publication Date
EP2901714A1 EP2901714A1 (fr)	2015-08-05
EP2901714A4 true EP2901714A4 (fr)	2016-06-08

Family

ID=50388957

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP13842019.5A Ceased EP2901714A4 (fr)	2012-09-27	2013-09-26	Circuit intégré dans un dispositif mems

Country Status (5)

Country	Link
EP (1)	EP2901714A4 (fr)
JP (1)	JP2015532548A (fr)
KR (1)	KR20150058467A (fr)
CN (1)	CN104756523B (fr)
WO (1)	WO2014052559A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102014106503B4 (de) *	2014-05-08	2016-03-03	Epcos Ag	Verfahren zur Herstellung eines Mikrofons
EP3018092A1 (fr)	2014-11-10	2016-05-11	AT & S Austria Technologie & Systemtechnik Aktiengesellschaft	Emballage de mems
US10373883B2 (en) *	2017-10-26	2019-08-06	Advanced Semiconductor Engineering, Inc.	Semiconductor package device and method of manufacturing the same
JP2020013835A (ja) *	2018-07-13	2020-01-23	Tdk株式会社	センサー用パッケージ基板及びこれを備えるセンサーモジュール並びに電子部品内臓基板
CN109218862B (zh) *	2018-08-31	2019-12-24	合翔(常州)电子有限公司	一种电声元件及其生产工艺
JP7435306B2 (ja) *	2020-06-25	2024-02-21	Tdk株式会社	キャビティを有する回路基板及びその製造方法
CN113905318B (zh) *	2021-09-16	2024-10-11	歌尔微电子股份有限公司	麦克风结构
WO2025220975A1 (fr) *	2024-04-18	2025-10-23	엘지이노텍 주식회사	Microphone mems

Citations (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20040168825A1 (en) *	2000-02-25	2004-09-02	Hajime Sakamoto	Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US20080007927A1 (en) *	2005-12-16	2008-01-10	Ibiden Co., Ltd.	Multilayered printed circuit board and the manufacturing method thereof
US20100195864A1 (en) *	2007-08-02	2010-08-05	Nxp B.V.	Electro-acoustic transducer comprising a mems sensor
TW201101851A (en) *	2009-06-23	2011-01-01	Merry Electronics Co Ltd	Micro-electro-mechanical acoustic sensor package structure
US20110163437A1 (en) *	2010-01-07	2011-07-07	Samsung Electro-Mechanics Co., Ltd.	Semiconductor package and method of manufacturing the same
US20110241197A1 (en) *	2010-04-01	2011-10-06	Horst Theuss	Device and Method for Manufacturing a Device
US20120020510A1 (en) *	2009-02-05	2012-01-26	Funai Electric Co., Ltd.	Microphone unit
US20120087521A1 (en) *	2010-10-12	2012-04-12	Analog Devices, Inc.	Microphone Package with Embedded ASIC
JP2012086345A (ja) *	2010-10-22	2012-05-10	Dainippon Printing Co Ltd	Ｍｅｍｓデバイス、その製造方法、及びそれを有する半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102005053765B4 (de) *	2005-11-10	2016-04-14	Epcos Ag	MEMS-Package und Verfahren zur Herstellung
US7436054B2 (en) *	2006-03-03	2008-10-14	Silicon Matrix, Pte. Ltd.	MEMS microphone with a stacked PCB package and method of producing the same
US8766512B2 (en) *	2009-03-31	2014-07-01	Sand 9, Inc.	Integration of piezoelectric materials with substrates
US8421168B2 (en) *	2009-11-17	2013-04-16	Fairchild Semiconductor Corporation	Microelectromechanical systems microphone packaging systems
KR101130335B1 (ko) *	2010-07-09	2012-03-26	주식회사 비에스이	마이크로폰

2013
- 2013-09-26 CN CN201380050551.2A patent/CN104756523B/zh active Active
- 2013-09-26 EP EP13842019.5A patent/EP2901714A4/fr not_active Ceased
- 2013-09-26 KR KR1020157010272A patent/KR20150058467A/ko not_active Ceased
- 2013-09-26 JP JP2015534645A patent/JP2015532548A/ja active Pending
- 2013-09-26 WO PCT/US2013/061873 patent/WO2014052559A1/fr not_active Ceased

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20040168825A1 (en) *	2000-02-25	2004-09-02	Hajime Sakamoto	Multilayer printed circuit board and multilayer printed circuit board manufacturing method
US20080007927A1 (en) *	2005-12-16	2008-01-10	Ibiden Co., Ltd.	Multilayered printed circuit board and the manufacturing method thereof
US20100195864A1 (en) *	2007-08-02	2010-08-05	Nxp B.V.	Electro-acoustic transducer comprising a mems sensor
US20120020510A1 (en) *	2009-02-05	2012-01-26	Funai Electric Co., Ltd.	Microphone unit
TW201101851A (en) *	2009-06-23	2011-01-01	Merry Electronics Co Ltd	Micro-electro-mechanical acoustic sensor package structure
US20110163437A1 (en) *	2010-01-07	2011-07-07	Samsung Electro-Mechanics Co., Ltd.	Semiconductor package and method of manufacturing the same
US20110241197A1 (en) *	2010-04-01	2011-10-06	Horst Theuss	Device and Method for Manufacturing a Device
US20120087521A1 (en) *	2010-10-12	2012-04-12	Analog Devices, Inc.	Microphone Package with Embedded ASIC
JP2012086345A (ja) *	2010-10-22	2012-05-10	Dainippon Printing Co Ltd	Ｍｅｍｓデバイス、その製造方法、及びそれを有する半導体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014052559A1 *

Also Published As

Publication number	Publication date
KR20150058467A (ko)	2015-05-28
JP2015532548A (ja)	2015-11-09
CN104756523A (zh)	2015-07-01
WO2014052559A1 (fr)	2014-04-03
CN104756523B (zh)	2018-01-16
EP2901714A1 (fr)	2015-08-05

Legal Events

Date	Code	Title	Description
2015-07-03	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2015-08-05	17P	Request for examination filed	Effective date: 20150415
2015-08-05	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2015-08-05	AX	Request for extension of the european patent	Extension state: BA ME
2016-01-06	DAX	Request for extension of the european patent (deleted)
2016-06-08	RA4	Supplementary search report drawn up and despatched (corrected)	Effective date: 20160509
2016-06-08	RIC1	Information provided on ipc code assigned before grant	Ipc: H04R 1/04 20060101AFI20160502BHEP Ipc: H04R 31/00 20060101ALN20160502BHEP Ipc: H04R 19/00 20060101ALI20160502BHEP Ipc: H01L 29/84 20060101ALI20160502BHEP Ipc: H04R 19/04 20060101ALI20160502BHEP
2016-07-13	17Q	First examination report despatched	Effective date: 20160613
2016-12-16	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: EXAMINATION IS IN PROGRESS
2021-09-15	REG	Reference to a national code	Ref country code: DE Ref legal event code: R003
2022-02-18	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION HAS BEEN REFUSED
2022-03-23	18R	Application refused	Effective date: 20210915

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