EP2926367A4 - Verfahren zur bildung von dünnfilmleitern auf einem substrat - Google Patents

Verfahren zur bildung von dünnfilmleitern auf einem substrat

Info

Publication number
EP2926367A4
EP2926367A4 EP12889427.6A EP12889427A EP2926367A4 EP 2926367 A4 EP2926367 A4 EP 2926367A4 EP 12889427 A EP12889427 A EP 12889427A EP 2926367 A4 EP2926367 A4 EP 2926367A4
Authority
EP
European Patent Office
Prior art keywords
substrate
thin film
forming thin
film conductors
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12889427.6A
Other languages
English (en)
French (fr)
Other versions
EP2926367A1 (de
Inventor
Andrew E Edd
Charles C Munson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCC Nano LLC
Original Assignee
NCC Nano LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCC Nano LLC filed Critical NCC Nano LLC
Publication of EP2926367A1 publication Critical patent/EP2926367A1/de
Publication of EP2926367A4 publication Critical patent/EP2926367A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0386—Paper sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/102—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding of conductive powder, i.e. metallic powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
EP12889427.6A 2012-12-03 2012-12-03 Verfahren zur bildung von dünnfilmleitern auf einem substrat Withdrawn EP2926367A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2012/067607 WO2014088546A1 (en) 2012-12-03 2012-12-03 Method for forming thin film conductors on a substrate

Publications (2)

Publication Number Publication Date
EP2926367A1 EP2926367A1 (de) 2015-10-07
EP2926367A4 true EP2926367A4 (de) 2016-07-27

Family

ID=50883816

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12889427.6A Withdrawn EP2926367A4 (de) 2012-12-03 2012-12-03 Verfahren zur bildung von dünnfilmleitern auf einem substrat

Country Status (4)

Country Link
EP (1) EP2926367A4 (de)
JP (1) JP6202763B2 (de)
CA (1) CA2893584C (de)
WO (1) WO2014088546A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016111133A1 (ja) * 2015-01-06 2016-07-14 株式会社フジクラ 導体層の製造方法及び配線基板
JP2016171051A (ja) * 2015-03-16 2016-09-23 Ｄｏｗａエレクトロニクス株式会社 導電膜およびその製造方法
JP2021079644A (ja) * 2019-11-20 2021-05-27 凸版印刷株式会社 印刷物とその製造方法、及び圧力感知シート
US11996384B2 (en) 2020-12-15 2024-05-28 Pulseforge, Inc. Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040185388A1 (en) * 2003-01-29 2004-09-23 Hiroyuki Hirai Printed circuit board, method for producing same, and ink therefor
US20100231672A1 (en) * 2009-03-12 2010-09-16 Margaret Joyce Method of improving the electrical conductivity of a conductive ink trace pattern and system therefor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5311027A (en) * 1993-02-26 1994-05-10 Raychem Corporation Apparatus and method for uniformly irradiating a strand
US6257133B1 (en) * 1999-03-15 2001-07-10 International Paper Method and apparatus for controlling cross directional nip dynamics
JP2001064547A (ja) * 1999-09-01 2001-03-13 Toyo Ink Mfg Co Ltd 活性エネルギー線硬化型導電性ペースト、それを用いた導体回路および非接触ｉｄ
JP4858057B2 (ja) * 2006-09-29 2012-01-18 大日本印刷株式会社 導電性基板の製造方法
US10231344B2 (en) * 2007-05-18 2019-03-12 Applied Nanotech Holdings, Inc. Metallic ink
DE102007051930A1 (de) * 2007-10-29 2009-04-30 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer Leiterbahnstruktur
US9564629B2 (en) * 2008-01-02 2017-02-07 Nanotek Instruments, Inc. Hybrid nano-filament anode compositions for lithium ion batteries
US7960027B2 (en) * 2008-01-28 2011-06-14 Honeywell International Inc. Transparent conductors and methods for fabricating transparent conductors
CN101939798A (zh) * 2008-02-13 2011-01-05 住友金属矿山株式会社 柔性透明导电膜和柔性功能性元件以及它们的制造方法
KR20120018329A (ko) * 2009-04-21 2012-03-02 몰렉스 인코포레이티드 3차원 안테나
WO2011028823A1 (en) * 2009-09-01 2011-03-10 Armstrong World Industries, Inc. Cellulosic product forming process and wet formed cellulosic product
TWI459876B (zh) * 2009-10-27 2014-11-01 Panasonic Corp 導體圖案的形成方法及導體圖案
US8907258B2 (en) * 2010-04-08 2014-12-09 Ncc Nano, Llc Apparatus for providing transient thermal profile processing on a moving substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040185388A1 (en) * 2003-01-29 2004-09-23 Hiroyuki Hirai Printed circuit board, method for producing same, and ink therefor
US20100231672A1 (en) * 2009-03-12 2010-09-16 Margaret Joyce Method of improving the electrical conductivity of a conductive ink trace pattern and system therefor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014088546A1 *

Also Published As

Publication number Publication date
JP2016501431A (ja) 2016-01-18
EP2926367A1 (de) 2015-10-07
JP6202763B2 (ja) 2017-09-27
WO2014088546A1 (en) 2014-06-12
CA2893584C (en) 2019-05-21
CA2893584A1 (en) 2014-06-12

Similar Documents

Publication Publication Date Title
SG11201504125UA (en) Method of making transparent conductors on a substrate
LT2964417T (lt) Būdas kiaurinėms angoms pagrinde įvesti
SG2013083654A (en) Methods for depositing films on sensitive substrates
PL2839054T3 (pl) Sposób otrzymywania podłoża powlekanego
FI20116048A0 (fi) Menetelmä NFC-kalvojen valmistamiseksi alustoille
TWI563114B (en) Film deposition apparatus
PL2683669T3 (pl) Sposób otrzymywania podłoża wyposażonego w powłokę
EP3058585A4 (de) Türme für substratträger
EP2840107A4 (de) Hartbeschichtungsfilm und verfahren zur herstellung davon
SG11201604779XA (en) Method for producing a block copolymer film on a substrate
EP2837432A4 (de) Herstellungsverfahren für beschichtungsfilm
TWI560309B (en) Film deposition method
PL2938494T3 (pl) Sposób wytwarzania podłoża drukowego i bezpośrednio zadrukowanego panelu dekoracyjnego
TWI561353B (en) Apparatus for transferring substrate
GB201218697D0 (en) A method of depositing an amorphous silicon film
EP2638115A4 (de) Verfahren zum drucken auf einem filmsubstrat
EP2966190A4 (de) Verfahren zur herstellung eines aluminidbeschichtungsfilms auf einer basis
EP3014347A4 (de) Verfahren zum anhaften eines substrats auf einer polymerschicht
IL227985A0 (en) A method for creating an entertainment film
EP3041035A4 (de) Verfahren zur herstellung einer pnbzt-dünnschicht
SG11201403305VA (en) Apparatus for forming thin film
EP2784555A4 (de) Verfahren zur herstellung einer phasendifferenzfolie
GB2579491B (en) Protective coating for a substrate
EP2906428A4 (de) Verfahren zur herstellung eines substrats mit einem bild auf mindestens einer oberfläche
SG11201509621VA (en) Device and method for coating a substrate

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20150608

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIN1 Information on inventor provided before grant (corrected)

Inventor name: EDD, ANDREW, E.

Inventor name: MUNSON, CHARLES, C.

DAX Request for extension of the european patent (deleted)
RA4 Supplementary search report drawn up and despatched (corrected)

Effective date: 20160629

RIC1 Information provided on ipc code assigned before grant

Ipc: H05K 3/10 20060101ALN20160623BHEP

Ipc: H05K 3/12 20060101AFI20160623BHEP

Ipc: H01B 1/22 20060101ALI20160623BHEP

Ipc: H05K 3/14 20060101ALN20160623BHEP

Ipc: H05K 1/09 20060101ALN20160623BHEP

Ipc: H05K 1/03 20060101ALN20160623BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20190507

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20190918