EP2928700A4 - Verfahren und vorrichtung zur übertragung von folien zwischen substraten - Google Patents

Verfahren und vorrichtung zur übertragung von folien zwischen substraten

Info

Publication number: EP2928700A4
Authority: EP; European Patent Office
Prior art keywords: substrates; transferring films; films; transferring
Prior art date: 2012-12-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP13860728.8A

Other languages

English (en)

French (fr)

Other versions

EP2928700A1 (de

EP2928700B1 (de

Inventor

Bruce Ira Willner

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Aixtron SE

Original Assignee

Graphene Frontiers LLC

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-12-07

Filing date

2013-12-06

Publication date

2016-06-22

2013-12-06 Application filed by Graphene Frontiers LLC filed Critical Graphene Frontiers LLC

2013-12-06 Priority to PL13860728T priority Critical patent/PL2928700T3/pl

2015-10-14 Publication of EP2928700A1 publication Critical patent/EP2928700A1/de

2016-06-22 Publication of EP2928700A4 publication Critical patent/EP2928700A4/de

2018-09-12 Application granted granted Critical

2018-09-12 Publication of EP2928700B1 publication Critical patent/EP2928700B1/de

Status Active legal-status Critical Current

2033-12-06 Anticipated expiration legal-status Critical

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/10—Removing layers, or parts of layers, mechanically or chemically
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/184—Preparation
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/182—Graphene
- C01B32/194—After-treatment
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
- H10P90/12—Preparing bulk and homogeneous wafers
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B32B2037/243—Coating
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
- B32B2037/246—Vapour deposition

Landscapes

Chemical & Material Sciences (AREA)
Organic Chemistry (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Nanotechnology (AREA)
Inorganic Chemistry (AREA)
Mechanical Engineering (AREA)
Carbon And Carbon Compounds (AREA)
Laminated Bodies (AREA)

EP13860728.8A 2012-12-07 2013-12-06 Verfahren und vorrichtung zur übertragung von folien zwischen substraten Active EP2928700B1 (de)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
PL13860728T PL2928700T3 (pl)	2012-12-07	2013-12-06	Sposób i aparatura do przenoszenia powłok z jednego substratu na inny

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US201261797471P	2012-12-07	2012-12-07
PCT/US2013/073585 WO2014089437A1 (en)	2012-12-07	2013-12-06	Method and apparatus for transfer of films among substrates

Publications (3)

Publication Number	Publication Date
EP2928700A1 EP2928700A1 (de)	2015-10-14
EP2928700A4 true EP2928700A4 (de)	2016-06-22
EP2928700B1 EP2928700B1 (de)	2018-09-12

Family

ID=50881366

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP13860728.8A Active EP2928700B1 (de)	2012-12-07	2013-12-06	Verfahren und vorrichtung zur übertragung von folien zwischen substraten

Country Status (8)

Country	Link
US (3)	US8822308B2 (de)
EP (1)	EP2928700B1 (de)
JP (1)	JP2016508891A (de)
KR (1)	KR102203157B1 (de)
CN (1)	CN104981357B (de)
ES (1)	ES2691120T3 (de)
PL (1)	PL2928700T3 (de)
WO (1)	WO2014089437A1 (de)

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KR101878739B1 (ko) *	2011-10-24	2018-07-17	삼성전자주식회사	그래핀 전사부재, 그래핀 전사방법 및 이를 이용한 그래핀 소자 제조방법
CN103208425B (zh) *	2013-03-22	2015-08-26	中国科学院上海微系统与信息技术研究所	一种石墨烯调制的高K金属栅Ge基MOS器件的制作方法
US9064698B1 (en) *	2014-03-30	2015-06-23	International Business Machines Corporation	Thin-film gallium nitride structures grown on graphene
WO2015196066A2 (en)	2014-06-20	2015-12-23	The Regents Of The University Of California	Method for the fabrication and transfer of graphene
CN104129783B (zh) *	2014-08-04	2017-02-15	中国科学院金属研究所	一种低成本、洁净无损转移大面积石墨烯的方法
CN104495823B (zh) *	2014-12-16	2016-08-17	中国科学院重庆绿色智能技术研究院	一种单层连续石墨烯薄膜卷材的制备方法及装置
CN104495824B (zh) *	2014-12-16	2016-08-24	中国科学院重庆绿色智能技术研究院	一种单层连续石墨烯薄膜生产的方法和装置
US10272647B2 (en) *	2014-12-19	2019-04-30	Corning Incorporated	Graphene and polymer-free method for transferring CVD grown graphene onto hydrophobic substrates
CN104538562B (zh) *	2015-01-15	2017-04-26	京东方科技集团股份有限公司	一种oled器件及其封装方法和封装装置
KR101870643B1 (ko) *	2016-01-28	2018-06-25	주식회사 참트론	그래핀의 전사방법
CN105862147B (zh) *	2016-06-14	2018-03-23	扬州纳佰成纳米科技有限公司	一种静电纺丝分立辊式纳米纤维膜连续接收方法及其装置
US10759157B2 (en)	2016-06-15	2020-09-01	Nanomedical Diagnostics, Inc.	Systems and methods for transferring graphene
US11056343B2 (en)	2016-06-15	2021-07-06	Cardea Bio, Inc.	Providing a temporary protective layer on a graphene sheet
US10903319B2 (en)	2016-06-15	2021-01-26	Nanomedical Diagnostics, Inc.	Patterning graphene with a hard mask coating
US10369775B2 (en) *	2016-12-09	2019-08-06	Imec Vzw	Method of releasing graphene from substrate
CN110065939B (zh) *	2018-01-23	2022-09-23	中国科学院上海微系统与信息技术研究所	具有石墨烯气泡的石墨烯结构及其制备方法
WO2020243396A1 (en) *	2019-05-29	2020-12-03	Purdue Research Foundation	Delamination processes and fabrication of thin film devices thereby
CN113078054B (zh) *	2021-03-25	2024-06-18	中国科学院上海微系统与信息技术研究所	一种电极层的制备方法及半导体结构
JP7851537B2 (ja)	2022-06-13	2026-04-27	国立大学法人東京大学	フレーク状物質の操作方法、及びフレーク状物質を用いた物品の生産方法
NL2033775B1 (en)	2022-12-21	2024-06-27	Applied Nanolayers B V	Method and apparatus for transferring one or more layers of a material from an initial substrate to a target substrate

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US20110319554A1 (en) *	2008-11-25	2011-12-29	The Board Of Trustees Of The University Of Alabama	Exfoliation of graphite using ionic liquids
WO2012067438A2 (en) *	2010-11-19	2012-05-24	Samsung Techwin Co., Ltd.	Method and apparatus for transferring graphene
WO2012134205A1 (en) *	2011-04-01	2012-10-04	Samsung Techwin Co., Ltd.	Method of manufacturing graphene film, apparatus for manufacturing graphene film, and graphene film manufactured by using apparatus for manufacturing graphene film
US20120282419A1 (en) *	2010-01-15	2012-11-08	Jonghyun Ahn	Graphene protective film serving as a gas and moisture barrier, method for forming same, and use thereof

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2013
- 2013-12-06 PL PL13860728T patent/PL2928700T3/pl unknown
- 2013-12-06 JP JP2015545871A patent/JP2016508891A/ja active Pending
- 2013-12-06 ES ES13860728.8T patent/ES2691120T3/es active Active
- 2013-12-06 US US14/099,032 patent/US8822308B2/en active Active
- 2013-12-06 EP EP13860728.8A patent/EP2928700B1/de active Active
- 2013-12-06 WO PCT/US2013/073585 patent/WO2014089437A1/en not_active Ceased
- 2013-12-06 KR KR1020157017901A patent/KR102203157B1/ko active Active
- 2013-12-06 CN CN201380072552.7A patent/CN104981357B/zh active Active
2014
- 2014-07-29 US US14/445,746 patent/US9427946B2/en active Active
2016
- 2016-07-26 US US15/219,743 patent/US20170080696A1/en not_active Abandoned

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US20120282419A1 (en) *	2010-01-15	2012-11-08	Jonghyun Ahn	Graphene protective film serving as a gas and moisture barrier, method for forming same, and use thereof
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WANG Y ET AL: "Electrochemical delamination of CVD-grown graphene film: Toward the recyclable use of copper catalyst", ACS NANO, AMERICAN CHEMICAL SOCIETY, US, vol. 5, no. 12, 27 December 2011 (2011-12-27), pages 9927 - 9933, XP002716759, ISSN: 1936-0851, [retrieved on 20111104], DOI: 10.1021/NN203700W *

Also Published As

Publication number	Publication date
US8822308B2 (en)	2014-09-02
CN104981357B (zh)	2017-04-12
JP2016508891A (ja)	2016-03-24
PL2928700T3 (pl)	2019-02-28
US20170080696A1 (en)	2017-03-23
US9427946B2 (en)	2016-08-30
ES2691120T3 (es)	2018-11-23
US20140332141A1 (en)	2014-11-13
EP2928700A1 (de)	2015-10-14
KR102203157B1 (ko)	2021-01-13
EP2928700B1 (de)	2018-09-12
KR20150094668A (ko)	2015-08-19
US20140162433A1 (en)	2014-06-12
CN104981357A (zh)	2015-10-14
WO2014089437A1 (en)	2014-06-12

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